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1. WO2022004464 - CURABLE SILICONE COMPOSITION AND CURED PRODUCT THEREFROM

Publication Number WO/2022/004464
Publication Date 06.01.2022
International Application No. PCT/JP2021/023400
International Filing Date 21.06.2021
IPC
C08L 83/07 2006.1
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
83Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Compositions of derivatives of such polymers
04Polysiloxanes
07containing silicon bound to unsaturated aliphatic groups
C08L 83/05 2006.1
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
83Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Compositions of derivatives of such polymers
04Polysiloxanes
05containing silicon bound to hydrogen
H01L 21/52 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
52Mounting semiconductor bodies in containers
H01L 23/29 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
28Encapsulation, e.g. encapsulating layers, coatings
29characterised by the material
H01L 23/31 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
28Encapsulation, e.g. encapsulating layers, coatings
31characterised by the arrangement
Applicants
  • ダウ・東レ株式会社 DOW TORAY CO., LTD. [JP]/[JP]
Inventors
  • 山崎 亮介 YAMAZAKI Ryosuke
  • 山本 真一 YAMAMOTO Shinichi
  • 林 正之 HAYASHI Masayuki
Priority Data
2020-11261530.06.2020JP
Publication Language Japanese (ja)
Filing Language Japanese (JA)
Designated States
Title
(EN) CURABLE SILICONE COMPOSITION AND CURED PRODUCT THEREFROM
(FR) COMPOSITION DE SILICONE DURCISSABLE, ET ARTICLE DURCI ASSOCIÉ
(JA) 硬化性シリコーン組成物及びその硬化物
Abstract
(EN) [Problem] To provide: a curable silicone composition that can be handled as a liquid at room temperature and that provides a cured product that exhibits excellent adhesive characteristics and mechanical characteristics and a relatively high hardness; and uses of the curable silicone composition. [Solution] A curable silicone composition that is characterized by containing prescribed mass% ranges of (A1) an organopolysiloxane resin that has a curing-reactive functional group that contains a carbon-carbon double bond, (A2) an organopolysiloxane resin that does not contain a curing-reactive functional group that contains a carbon-carbon double bond, and (B) a straight-chain organopolysiloxane that is liquid at 25°C and has a curing-reactive functional group that contains a carbon-carbon double bond, and also contains (C) a curing agent, wherein the viscosity of the composition as a whole is not more than 50 Pa·s and the amount of the curing-reactive functional group in 100 g of the composition is at least 1.5 mol%; the cured product from the curable silicone composition; and use of the curable silicone composition in, for example, semiconductor applications.
(FR) L'invention fournit une composition de silicone durcissable qui permet une manipulation sous forme liquide à température de laboratoire, et dont l'article durci associé possède d'excellentes caractéristiques adhésives et mécaniques, et présente une dureté relativement élevée. L'invention fournit également une application associée à cette composition. Plus précisément, l'invention concerne une composition de silicone durcissable qui est caractéristique en ce qu'elle contient selon des plages spécifiques de pourcentage massique (A1) une résine d'organopolysiloxane qui possède un groupe fonctionnel réactif durcissable contenant une double liaison carbone-carbone, (A2) une résine d'organopolysiloxane ne possédant pas le même groupe fonctionnel réactif durcissable, et (B) un organopolysiloxane linéaire liquide à 25°C possédant ce même groupe fonctionnel réactif durcissable, et contient également (C) un agent de durcissement. En outre, la viscosité de l'ensemble de la composition est inférieure ou égale à 50Pa・s, et la quantité de groupe fonctionnel réactif durcissable, est supérieure ou égale à 1,5% en moles pour 100g de composition. L'invention concerne également l'article durci associé, et une application ayant pour but un semi-conducteurs, ou similaire.
(JA) [課題]室温で液状として取り扱うことができ、その硬化物が優れた接着特性および機械的特性を有し、かつ、比較的高い硬度を示す硬化性シリコーン組成物およびその用途を提供する。 [解決手段](A1)炭素-炭素二重結合を含む硬化反応性官能基を有するオルガノポリシロキサン樹脂、(A2)同硬化反応性官能基を有しないオルガノポリシロキサン樹脂および(B)同硬化反応性官能基を有する25℃で液状の直鎖状オルガノポリシロキサンを特定の質量%の範囲で含み、かつ、(C)硬化剤を含み、組成物全体の粘度が50Pa・s以下かつ、組成物100g中の硬化反応性の官能基量が1.5モル%以上であることを特徴とする硬化性シリコーン組成物、その硬化物およびその半導体用途等への使用。
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