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1. WO2022004390 - LID MEMBER, METHOD FOR MANUFACTURING LID MEMBER, PACKAGE, AND METHOD FOR MANUFACTURING PACKAGE

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Publication Number WO/2022/004390
Publication Date 06.01.2022
International Application No. PCT/JP2021/022889
International Filing Date 16.06.2021
IPC
H01L 23/02 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
02Containers; Seals
H01L 33/52 2010.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
52Encapsulations
CPC
H01L 23/02
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
02Containers; Seals
H01L 33/52
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
52Encapsulations
Applicants
  • 日本電気硝子株式会社 NIPPON ELECTRIC GLASS CO., LTD. [JP]/[JP]
Inventors
  • 間嶌　亮太 MASHIMA Ryota
Agents
  • 城村　邦彦 SHIROMURA Kunihiko
  • 熊野　剛 KUMANO Tsuyoshi
  • 山本　淳也 YAMAMOTO Junya
Priority Data
2020-11151029.06.2020JP
Publication Language Japanese (ja)
Filing Language Japanese (JA)
Designated States
Title
(EN) LID MEMBER, METHOD FOR MANUFACTURING LID MEMBER, PACKAGE, AND METHOD FOR MANUFACTURING PACKAGE
(FR) ÉLÉMENT DE COUVERCLE, PROCÉDÉ DE FABRICATION D'UN ÉLÉMENT DE COUVERCLE, EMBALLAGE ET PROCÉDÉ DE FABRICATION D'UN EMBALLAGE
(JA) 蓋部材、蓋部材の製造方法、パッケージ、及びパッケージの製造方法
front page image
Abstract
(EN) A lid member 4 is provided with a body section 7, a buffer film 8 formed on a surface 7a of the body section 7, and a bonding section 10 formed so as to overlap with the buffer film 8. The bonding section 10 includes a metal bonding material. The buffer film 8 includes an oxide film.
(FR) Un élémentde couvercle (4) est pourvu d'une section de corps (7), un film tampon formé sur une surface (7a) de la section de corps (7), et une section de liaison (10) formée de façon à chevaucher le film tampon. La section de liaison (10) comprend un matériau de liaison métallique. Le film tampon (8) comprend un film d'oxyde.
(JA) 蓋部材４は、本体部７と、本体部７の表面７ａに形成される緩衝膜８と、緩衝膜８に重なるように形成される接合部１０と、を備える。接合部１０は、金属系接合材を含む。緩衝膜８は、酸化膜を含む。
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