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1. WO2022004355 - SPUTTERING TARGET AND METHOD FOR PRODUCING SAME

Publication Number WO/2022/004355
Publication Date 06.01.2022
International Application No. PCT/JP2021/022679
International Filing Date 15.06.2021
IPC
C23C 14/34 2006.1
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
22characterised by the process of coating
34Sputtering
B22F 1/00 2006.1
BPERFORMING OPERATIONS; TRANSPORTING
22CASTING; POWDER METALLURGY
FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
1Special treatment of metallic powder, e.g. to facilitate working, to improve properties; Metallic powders per se, e.g. mixtures of particles of different composition
B22F 3/14 2006.1
BPERFORMING OPERATIONS; TRANSPORTING
22CASTING; POWDER METALLURGY
FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
3Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor
12Both compacting and sintering
14simultaneously
B22F 3/15 2006.1
BPERFORMING OPERATIONS; TRANSPORTING
22CASTING; POWDER METALLURGY
FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
3Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor
12Both compacting and sintering
14simultaneously
15Hot isostatic pressing
B22F 9/08 2006.1
BPERFORMING OPERATIONS; TRANSPORTING
22CASTING; POWDER METALLURGY
FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
9Making metallic powder or suspensions thereof; Apparatus or devices specially adapted therefor
02using physical processes
06starting from liquid material
08by casting, e.g. through sieves or in water, by atomising or spraying
C22C 1/04 2006.1
CCHEMISTRY; METALLURGY
22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
CALLOYS
1Making non-ferrous alloys
04by powder metallurgy
Applicants
  • 株式会社フルヤ金属 FURUYA METAL CO., LTD. [JP]/[JP]
Inventors
  • 鈴木 雄 SUZUKI, Yu
  • 大友 将平 OTOMO, Shohei
  • 野澤 公義 NOZAWA, Masayoshi
Agents
  • 今下 勝博 IMASHITA, Katsuhiro
  • 岡田 賢治 OKADA, Kenji
Priority Data
2020-11273130.06.2020JP
Publication Language Japanese (ja)
Filing Language Japanese (JA)
Designated States
Title
(EN) SPUTTERING TARGET AND METHOD FOR PRODUCING SAME
(FR) CIBLE DE PULVÉRISATION ET PROCÉDÉ DE FABRICATION ASSOCIÉ
(JA) スパッタリングターゲット及びその製造方法
Abstract
(EN) The purpose of the present invention is to provide: a sputtering target that makes it possible to perform film formation in which contamination by particles is suppressed on the occasion of sputtering; and a method for producing the sputtering target. A sputtering target according to the present invention is an alloy sputtering target formed from ruthenium serving as a first element and at least one substance serving as a second element and selected from among boron, aluminum, titanium, zirconium, hafnium, vanadium, niobium, tantalum, chrome, molybdenum, and tungsten. The sputtering target is produced by a method including a preparation step for preparing raw materials, an atomization step in which an alloy powder is obtained by atomization, a mixing step in which a ruthenium raw material is additionally added to the alloy powder and a mixture is obtained, and a sintering step (a fourth step) in which the mixture is sintered and a sintered body is obtained. The maximum major diameter of the alloy powder obtained by atomization is 500 μm or less.
(FR) La présente invention vise à fournir : une cible de pulvérisation qui permet d'effectuer une formation de film, la contamination par des particules étant supprimée à l'occasion de la pulvérisation ; et un procédé de production de la cible de pulvérisation. Une cible de pulvérisation cathodique selon la présente invention est une cible de pulvérisation d'alliage formée à partir de ruthénium servant de premier élément et d'au moins une substance servant de second élément et sélectionnée parmi le bore, l'aluminium, le titane, le zirconium, le hafnium, le vanadium, le niobium, le tantale, le chrome, le molybdène et le tungstène. La cible de pulvérisation est produite par un procédé comprenant une étape de préparation consistant à préparer des matières premières, une étape d'atomisation dans laquelle une poudre d'alliage est obtenue par atomisation, une étape de mélange dans laquelle une matière première de ruthénium est en outre ajoutée à la poudre d'alliage et un mélange est obtenu, et une étape de frittage (une quatrième étape) au cours de laquelle le mélange est fritté et un corps fritté est obtenu. Le diamètre principal maximum de la poudre d'alliage obtenue par atomisation est de 500 µm ou moins.
(JA) 本開示の目的は、スパッタリングの際にパーティクルの混入を抑制した成膜が可能なスパッタリングターゲット及びその製造方法を提供することである。本発明に係るスパッタリングターゲットは、第1元素としてルテニウムと、第2元素としてホウ素、アルミニウム、チタン、ジルコニウム、ハフニウム、バナジウム、ニオブ、タンタル、クロム、モリブデン及びタングステンの中から選ばれるいずれか一種と、で構成される合金のスパッタリングターゲットの製造方法において、原料を準備する準備工程と、アトマイズ法によって合金粉末を得るアトマイズ工程と、合金粉末に、ルテニウム原料を更に添加して混合物を得る混合工程と、混合物を、焼結して焼結体を得る焼結工程(第4工程)と、を有し、アトマイズ法で得た合金粉末の最大長径が500μm以下である。
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