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1. WO2022004354 - SPUTTERING TARGET AND METHOD FOR MANUFACTURING SAME

Publication Number WO/2022/004354
Publication Date 06.01.2022
International Application No. PCT/JP2021/022674
International Filing Date 15.06.2021
IPC
C23C 14/34 2006.1
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
22characterised by the process of coating
34Sputtering
B22F 1/00 2006.1
BPERFORMING OPERATIONS; TRANSPORTING
22CASTING; POWDER METALLURGY
FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
1Special treatment of metallic powder, e.g. to facilitate working, to improve properties; Metallic powders per se, e.g. mixtures of particles of different composition
B22F 3/14 2006.1
BPERFORMING OPERATIONS; TRANSPORTING
22CASTING; POWDER METALLURGY
FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
3Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor
12Both compacting and sintering
14simultaneously
B22F 3/15 2006.1
BPERFORMING OPERATIONS; TRANSPORTING
22CASTING; POWDER METALLURGY
FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
3Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor
12Both compacting and sintering
14simultaneously
15Hot isostatic pressing
B22F 9/08 2006.1
BPERFORMING OPERATIONS; TRANSPORTING
22CASTING; POWDER METALLURGY
FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
9Making metallic powder or suspensions thereof; Apparatus or devices specially adapted therefor
02using physical processes
06starting from liquid material
08by casting, e.g. through sieves or in water, by atomising or spraying
C22C 1/04 2006.1
CCHEMISTRY; METALLURGY
22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
CALLOYS
1Making non-ferrous alloys
04by powder metallurgy
Applicants
  • 株式会社フルヤ金属 FURUYA METAL CO., LTD. [JP]/[JP]
Inventors
  • 鈴木 雄 SUZUKI, Yu
  • 大友 将平 OTOMO, Shohei
  • 野澤 公義 NOZAWA, Masayoshi
Agents
  • 今下 勝博 IMASHITA, Katsuhiro
  • 岡田 賢治 OKADA, Kenji
Priority Data
2020-11272530.06.2020JP
Publication Language Japanese (ja)
Filing Language Japanese (JA)
Designated States
Title
(EN) SPUTTERING TARGET AND METHOD FOR MANUFACTURING SAME
(FR) CIBLE DE PULVÉRISATION ET PROCÉDÉ DE FABRICATION ASSOCIÉ
(JA) スパッタリングターゲット及びその製造方法
Abstract
(EN) The purpose of the present disclosure is to provide: a sputtering target that enables obtaining of a uniform compositional distribution in the in-plane direction and in the film thickness direction regarding the compositional makeup of a deposited film; and a method for manufacturing the sputtering target. The sputtering target according to the present invention is an alloy formed from a first element which is ruthenium and a second element which is one selected from among boron, aluminum, titanium, zirconium, hafnium, vanadium, niobium, tantalum, chromium, molybdenum, and tungsten. The sputtering target includes dispersed particles each formed from two phases including an inter metal compound phase comprising the two types of elements which are the first element and the second element. The maximum major axis of the dispersed particles is not more than 500 μm.
(FR) La présente invention vise à fournir : une cible de pulvérisation qui permet d'obtenir une distribution compositionnelle uniforme dans la direction dans le plan et dans la direction de l'épaisseur du film par rapport à la structure compositionnelle d'un film déposé ; et un procédé de fabrication de la cible de pulvérisation. La cible de pulvérisation selon la présente invention est un alliage formé à partir d'un premier élément qui est du ruthénium et d'un second élément qui est un élément sélectionné parmi le bore, l'aluminium, le titane, le zirconium, le hafnium, le vanadium, le niobium, le tantale, le chrome, le molybdène et le tungstène. La cible de pulvérisation comprend des particules dispersées chacune formée de deux phases comprenant une phase de composé intermétallique comprenant les deux types d'éléments qui sont le premier élément et le second élément. L'axe principal maximal des particules dispersées n'est pas supérieur à 500 µm.
(JA) 本開示の目的は、成膜された膜の組成について、膜の面内方向並びに膜厚方向に対しても均一な組成分布を得ることができるスパッタリングターゲット及びその製造方法を提供することである。本発明に係るスパッタリングターゲットは、第1元素としてルテニウムと、第2元素としてホウ素、アルミニウム、チタン、ジルコニウム、ハフニウム、バナジウム、ニオブ、タンタル、クロム、モリブデン及びタングステンの中から選ばれるいずれか一種と、で構成される合金のスパッタリングターゲットにおいて、スパッタリングターゲットは前記第1元素と前記第2元素との二種の元素からなる金属間化合物相を含む二相で構成された分散粒子を有し、分散粒子の最大長径が500μm以下である。
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