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1. WO2022004332 - CIRCUIT STRUCTURE

Publication Number WO/2022/004332
Publication Date 06.01.2022
International Application No. PCT/JP2021/022284
International Filing Date 11.06.2021
IPC
H05K 1/02 2006.1
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
H05K 1/14 2006.1
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
14Structural association of two or more printed circuits
H05K 1/18 2006.1
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
18Printed circuits structurally associated with non-printed electric components
H05K 3/20 2006.1
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
10in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
20by affixing prefabricated conductor pattern
H05K 7/06 2006.1
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7Constructional details common to different types of electric apparatus
02Arrangements of circuit components or wiring on supporting structure
06on insulating boards
Applicants
  • 株式会社オートネットワーク技術研究所 AUTONETWORKS TECHNOLOGIES, LTD. [JP]/[JP]
  • 住友電装株式会社 SUMITOMO WIRING SYSTEMS, LTD. [JP]/[JP]
  • 住友電気工業株式会社 SUMITOMO ELECTRIC INDUSTRIES, LTD. [JP]/[JP]
Inventors
  • 原口 章 HARAGUCHI Akira
Agents
  • 吉竹 英俊 YOSHITAKE Hidetoshi
  • 有田 貴弘 ARITA Takahiro
  • 竹下 明男 TAKESHITA Akio
  • 福市 朋弘 FUKUICHI Tomohiro
Priority Data
2020-11425001.07.2020JP
Publication Language Japanese (ja)
Filing Language Japanese (JA)
Designated States
Title
(EN) CIRCUIT STRUCTURE
(FR) STRUCTURE DE CIRCUIT
(JA) 回路構成体
Abstract
(EN) A circuit structure is provided with a first bus bar, a second bus bar, an insulating member including an insulating part sited between the first bus bar and the second bus bar, a first circuit board provided on one main face of the first bus bar, one main face of the second bus bar, and the insulating part, and a first electronic component provided on the first circuit board. The first electronic component has a first connection terminal electrically connected to the first bus bar and bonded to the first circuit board, and a second connection terminal electrically connected to the second bus bar and bonded to the first circuit board.
(FR) Structure de circuit pourvue d'une première barre omnibus, d'une seconde barre omnibus, d'un élément isolant comprenant une partie isolante située entre la première barre omnibus et la seconde barre omnibus, une première carte de circuit imprimé disposée sur une face principale de la première barre omnibus, une face principale de la seconde barre omnibus, et la partie isolante, et un premier composant électronique disposé sur la première carte de circuit imprimé. Le premier composant électronique comporte une première borne de connexion connectée électriquement à la première barre omnibus et liée à la première carte de circuit imprimé, et une seconde borne de connexion connectée électriquement à la seconde barre omnibus et liée à la première carte de circuit imprimé.
(JA) 回路構成体は、第1バスバーと、第2バスバーと、第1バスバー及び第2バスバーの間に位置する絶縁部分を含む絶縁部材と、第1バスバーの一方の主面、第2バスバーの一方の主面及び絶縁部分の上に設けられた第1配線基板と、第1配線基板上に設けられた第1電子部品とを備える。第1電子部品は、第1バスバーに電気的に接続され、第1配線基板に接合された第1接続端子と、第2バスバーに電気的に接続され、第1配線基板に接合された第2接続端子とを有する。
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