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1. WO2022004308 - PRODUCTION METHOD FOR IMAGE DISPLAY DEVICE AND IMAGE DISPLAY DEVICE

Publication Number WO/2022/004308
Publication Date 06.01.2022
International Application No. PCT/JP2021/021770
International Filing Date 08.06.2021
IPC
H01L 33/00 2010.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
H01L 33/02 2010.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
02characterised by the semiconductor bodies
G09F 9/00 2006.1
GPHYSICS
09EDUCATING; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
9Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
G09F 9/30 2006.1
GPHYSICS
09EDUCATING; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
9Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
30in which the desired character or characters are formed by combining individual elements
G09F 9/33 2006.1
GPHYSICS
09EDUCATING; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
9Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
30in which the desired character or characters are formed by combining individual elements
33being semiconductor devices, e.g. diodes
Applicants
  • 日亜化学工業株式会社 NICHIA CORPORATION [JP]/[JP]
Inventors
  • 秋元 肇 AKIMOTO, Hajime
Agents
  • 日向寺 雅彦 HYUGAJI, Masahiko
  • 小崎 純一 KOZAKI, Junichi
  • 内田 敬人 UCHIDA, Takahito
Priority Data
2020-11174829.06.2020JP
Publication Language Japanese (ja)
Filing Language Japanese (JA)
Designated States
Title
(EN) PRODUCTION METHOD FOR IMAGE DISPLAY DEVICE AND IMAGE DISPLAY DEVICE
(FR) PROCÉDÉ DE FABRICATION DE DISPOSITIF D'AFFICHAGE D'IMAGE ET DISPOSITIF D'AFFICHAGE D'IMAGE
(JA) 画像表示装置の製造方法および画像表示装置
Abstract
(EN) A production method for an image display device according to one embodiment comprises: a step for preparing a second substrate in which a semiconductor layer has been formed on a first substrate; a step for bonding the semiconductor layer to a third substrate; a step for removing the first substrate; a step for etching the semiconductor layer and forming a light-emitting element including a light-emitting surface that is opposite to the bottom surface on the third substrate; a step for forming a first insulating film that covers the third substrate and the light-emitting element; a step for forming a circuit element on the first insulating film; a step for forming a second insulating film that covers the circuit element together with the first insulating film; a step for removing a part of the first and second insulating films and exposing the surface that includes the light-emitting surface; a step for forming a via that traverses the first and second insulating films; and a step for forming a wiring layer on the second insulating film.
(FR) La présente invention concerne, selon un mode de réalisation, un procédé de fabrication d'un dispositif d'affichage d'image qui comprend : une étape de préparation d'un deuxième substrat dans laquelle une couche semi-conductrice a été formée sur un premier substrat ; une étape de liaison de la couche semi-conductrice à un troisième substrat ; une étape de retrait du premier substrat ; une étape de gravure de la couche semi-conductrice et de formation d'un élément électroluminescent comprenant une surface électroluminescente qui est opposée à la surface inférieure sur le troisième substrat ; une étape de formation d'un premier film isolant qui recouvre le troisième substrat et l'élément électroluminescent ; une étape de formation d'un élément de circuit sur le premier film isolant ; une étape de formation d'un second film isolant qui recouvre l'élément de circuit avec le premier film isolant ; une étape de retrait d'une partie des premier et second films isolants et de mise à nu de la surface qui comprend la surface électroluminescente ; une étape de formation d'un trou d'interconnexion qui traverse les premier et second films isolants ; et une étape de formation d'une couche de câblage sur le second film isolant.
(JA) 実施形態に係る画像表示装置の製造方法は、半導体層を第1基板上に形成した第2基板を準備する工程と、第3基板に前記半導体層を貼り合わせる工程と、前記第1基板を除去する工程と、前記半導体層をエッチングして、前記第3基板上の底面に対向する発光面を含む発光素子を形成する工程と、前記第3基板および前記発光素子を覆う第1絶縁膜を形成する工程と、前記第1絶縁膜上に回路素子を形成する工程と、前記回路素子とともに前記第1絶縁膜を覆う第2絶縁膜を形成する工程と、前記第1および第2絶縁膜の一部を除去して前記発光面を含む面を露出させる工程と、前記第1および第2絶縁膜を貫通するビアを形成する工程と、前記第2絶縁膜上に配線層を形成する工程と、を備える。
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