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1. WO2022004290 - CHEMICALLY AMPLIFIED PHOTOSENSITIVE COMPOSITION, PHOTOSENSITIVE DRY FILM, METHOD FOR MANUFACTURING PLATING MOLD-ATTACHED SUBSTRATE, AND METHOD FOR MANUFACTURING PLATED OBJECT

Publication Number WO/2022/004290
Publication Date 06.01.2022
International Application No. PCT/JP2021/021638
International Filing Date 07.06.2021
IPC
C25D 5/02 2006.1
CCHEMISTRY; METALLURGY
25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
5Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
02Electroplating of selected surface areas
G03F 7/004 2006.1
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
G03F 7/039 2006.1
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
039Macromolecular compounds which are photodegradable, e.g. positive electron resists
G03F 7/20 2006.1
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
20Exposure; Apparatus therefor
G03F 7/40 2006.1
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
26Processing photosensitive materials; Apparatus therefor
40Treatment after imagewise removal, e.g. baking
Applicants
  • 東京応化工業株式会社 TOKYO OHKA KOGYO CO., LTD. [JP]/[JP]
Inventors
  • 岸本 友輔 KISHIMOTO Yusuke
  • 片山 翔太 KATAYAMA Shota
Agents
  • 正林 真之 SHOBAYASHI Masayuki
  • 林 一好 HAYASHI Kazuyoshi
Priority Data
2020-11447401.07.2020JP
Publication Language Japanese (ja)
Filing Language Japanese (JA)
Designated States
Title
(EN) CHEMICALLY AMPLIFIED PHOTOSENSITIVE COMPOSITION, PHOTOSENSITIVE DRY FILM, METHOD FOR MANUFACTURING PLATING MOLD-ATTACHED SUBSTRATE, AND METHOD FOR MANUFACTURING PLATED OBJECT
(FR) COMPOSITION PHOTOSENSIBLE AMPLIFIÉE CHIMIQUEMENT, FILM SEC PHOTOSENSIBLE, PROCÉDÉ DE FABRICATION DE SUBSTRAT FIXÉ À UN MOULE DE PLACAGE, ET PROCÉDÉ DE FABRICATION D'OBJET PLAQUÉ
(JA) 化学増幅型感光性組成物、感光性ドライフィルム、めっき用鋳型付き基板の製造方法、及びめっき造形物の製造方法
Abstract
(EN) Provided are: a chemically amplified photosensitive composition with which a plating mold capable of forming a plated object having uniform dimensions can be formed by a photolithography method; a photosensitive dry film comprising a photosensitive layer made of the chemically amplified photosensitive composition; a method for manufacturing a plating mold-attached substrate using said chemically amplified positive-type photosensitive composition; and a method for manufacturing a plated object using a mold-attached substrate manufactured by said method. A coumarin compound (C) including a coumarin compound having a specific structure is blended with a chemically amplified photosensitive composition containing an acid generator (A) that generates an acid by irradiation with actinic light or radiation.
(FR) L'invention concerne : une composition photosensible amplifiée chimiquement avec laquelle un moule de placage pouvant former un objet plaqué à dimensions uniformes peut être formé par un procédé de photolithographie ; un film sec photosensible comprenant une couche photosensible constituée de la composition photosensible amplifiée chimiquement ; un procédé de fabrication d'un substrat fixé à un moule de placage faisant appel à ladite composition photosensible de type positif amplifiée chimiquement ; et un procédé de fabrication d'un objet plaqué faisant appel à un substrat fixé à un moule fabriqué par ledit procédé. Un composé coumarine (C) comprenant un composé coumarine ayant une structure spécifique est mélangé avec une composition photosensible amplifiée chimiquement contenant un générateur d'acide (A) qui génère un acide par exposition à un rayonnement ou à une lumière actinique.
(JA) 均一な寸法のめっき造形物を形成できるめっき用の鋳型をホトリソグラフィー法により形成可能な化学増幅型感光性組成物と、当該化学増幅型感光性組成物からなる感光性層を備える感光性ドライフィルムと、前述の化学増幅型ポジ型感光性組成物を用いるめっき用鋳型付き基板の製造方法と、前述の方法により製造された鋳型付き基板を用いるめっき造形物の製造方法とを提供すること。 活性光線又は放射線の照射により酸を発生する酸発生剤(A)を含む化学増幅型感光性組成物に、特定の構造のクマリン化合物を含むクマリン化合物(C)を配合する。
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