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1. WO2022004285 - PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT THEREOF, AND WIRING STRUCTURE CONTAINING CURED PRODUCT

Publication Number WO/2022/004285
Publication Date 06.01.2022
International Application No. PCT/JP2021/021563
International Filing Date 07.06.2021
IPC
C08F 30/08 2006.1
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
30Homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal
04containing a metal
08containing silicon
C08F 299/08 2006.1
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
299Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
02from unsaturated polycondensates
08from polysiloxanes
G03F 7/004 2006.1
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
G03F 7/027 2006.1
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
G03F 7/029 2006.1
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
028with photosensitivity-increasing substances, e.g. photoinitiators
029Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
G03F 7/031 2006.1
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
028with photosensitivity-increasing substances, e.g. photoinitiators
031Organic compounds not covered by group G03F7/02967
Applicants
  • ナミックス株式会社 NAMICS CORPORATION [JP]/[JP]
Inventors
  • チューバロウ パウエル CZUBAROW Pawel
  • 大友 政義 OTOMO Masayoshi
  • カポグリス イルマ ジョランダ KAPOGLIS Irma Yolanda
  • クラスコ ニコラス チャールズ KRASCO Nicholas Charles
  • レティシアIII フランク アンソニー LETIZAIII Frank Anthony
  • 佐藤 敏行 SATO Toshiyuki
Agents
  • アイアット国際特許業務法人 IAT WORLD PATENT LAW FIRM
Priority Data
63/046,80801.07.2020US
Publication Language Japanese (ja)
Filing Language Japanese (JA)
Designated States
Title
(EN) PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT THEREOF, AND WIRING STRUCTURE CONTAINING CURED PRODUCT
(FR) COMPOSITION DE RÉSINE PHOTOSENSIBLE, SON PRODUIT DURCI, ET STRUCTURE DE CÂBLAGE CONTENANT LE PRODUIT DURCI
(JA) 感光性樹脂組成物、その硬化物、及びその硬化物を含む配線構造体
Abstract
(EN) Provided are: a photosensitive resin composition; a cured product thereof; and a wiring structure, an electronic component, a semiconductor device, and a camera module containing the cured product. The photosensitive resin composition is cured by irradiation with active energy rays rather than by a heat treatment at a high temperature. This photosensitive resin composition suppresses film reduction after a development process. Furthermore, a finely detailed pattern can be accurately formed through photolithography. One aspect of the present invention pertains a photosensitive resin composition comprising the following components (A) to (C): (A) a modified polyphenylene ether represented by formula (1) and formula (2); (B) a silsesquioxane compound represented by formula (3); and (C) a photopolymerization initiator, and said aspect also pertains to a cured product of the photosensitive resin composition, and a wiring structure, an electronic component, a semiconductor device, and a camera module containing said cured product.
(FR) La présente invention concerne : une composition de résine photosensible ; son produit durci ; et une structure de câblage, un composant électronique, un dispositif semi-conducteur, et un module caméra contenant le produit durci. La composition de résine photosensible est durcie par exposition à des rayons d’énergie active plutôt qu’à l'aide d'un traitement thermique à une température élevée. Cette composition de résine photosensible supprime la réduction de film après un procédé de développement. En outre, un motif finement détaillé peut être formé de manière précise par photolithographie. Un aspect de la présente invention concerne une composition de résine photosensible comprenant les composants (A) à (C) suivants : (A) un éther de polyphénylène modifié représenté par la formule (1) et la formule (2) ; (B) un composé de silsesquioxane représenté par la formule (3) ; et (C) un initiateur de photopolymérisation, et ledit aspect concernant également un produit durci de la composition de résine photosensible, et une structure de câblage, un composant électronique, un dispositif semi-conducteur, et un module caméra contenant ledit produit durci.
(JA) 感光性樹脂組成物、その硬化物、その硬化物を含む配線構造体、電子部品、半導体装置、及びカメラモジュールを提供する。この感光性樹脂組成物は、高温での熱処理ではなく、活性エネルギー線の照射により硬化される。この感光性樹脂組成物では、現像工程後の膜減りが抑制される。さらに、フォトリソグラフィーにより微細なパターンを正確に形成することができる。 本発明の一態様は、成分(A)~(C): (A)式(1)及び式(2)で表される変性ポリフェニレンエーテル、(B)式(3)で表されるシルセスキオキサン化合物、及び(C)光重合開始剤を含む、感光性樹脂組成物、及び、その硬化物、並びに、その硬化物を含む、配線構造体、電子部品、半導体装置及びカメラモジュールである。
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