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1. WO2022004276 - SETTING METHOD OF SETTING INFORMATION USED FOR BOARD PROCESSING MONITORING, MONITORING METHOD OF BOARD PROCESSING DEVICE, AND BOARD PROCESSING DEVICE

Publication Number WO/2022/004276
Publication Date 06.01.2022
International Application No. PCT/JP2021/021368
International Filing Date 04.06.2021
IPC
B05C 11/00 2006.1
BPERFORMING OPERATIONS; TRANSPORTING
05SPRAYING OR ATOMISING IN GENERAL; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
CAPPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
11Component parts, details or accessories not specifically provided for in groups B05C1/-B05C9/132
B05C 11/10 2006.1
BPERFORMING OPERATIONS; TRANSPORTING
05SPRAYING OR ATOMISING IN GENERAL; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
CAPPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
11Component parts, details or accessories not specifically provided for in groups B05C1/-B05C9/132
10Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
H01L 21/027 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
027Making masks on semiconductor bodies for further photolithographic processing, not provided for in group H01L21/18 or H01L21/34165
H01L 21/304 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18the devices having semiconductor bodies comprising elements of group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
302to change the physical characteristics of their surfaces, or to change their shape, e.g. etching, polishing, cutting
304Mechanical treatment, e.g. grinding, polishing, cutting
H01L 21/306 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18the devices having semiconductor bodies comprising elements of group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
302to change the physical characteristics of their surfaces, or to change their shape, e.g. etching, polishing, cutting
306Chemical or electrical treatment, e.g. electrolytic etching
CPC
B05C 11/00
BPERFORMING OPERATIONS; TRANSPORTING
05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
11Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
B05C 11/10
BPERFORMING OPERATIONS; TRANSPORTING
05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
11Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
10Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
H01L 21/027
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
027Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
H01L 21/304
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
18the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
302to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
304Mechanical treatment, e.g. grinding, polishing, cutting
H01L 21/306
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
18the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
302to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
306Chemical or electrical treatment, e.g. electrolytic etching
Applicants
  • 株式会社SCREENホールディングス SCREEN HOLDINGS CO., LTD. [JP]/[JP]
Inventors
  • 沖田 有史 OKITA Yuji
  • 猶原 英司 NAOHARA Hideji
  • 角間 央章 KAKUMA Hiroaki
  • 増井 達哉 MASUI Tatsuya
  • 出羽 裕一 DEBA Yuichi
Agents
  • 吉竹 英俊 YOSHITAKE Hidetoshi
  • 有田 貴弘 ARITA Takahiro
Priority Data
2020-11287830.06.2020JP
Publication Language Japanese (ja)
Filing Language Japanese (JA)
Designated States
Title
(EN) SETTING METHOD OF SETTING INFORMATION USED FOR BOARD PROCESSING MONITORING, MONITORING METHOD OF BOARD PROCESSING DEVICE, AND BOARD PROCESSING DEVICE
(FR) PROCÉDÉ DE DÉFINITION POUR LA DÉFINITION D'INFORMATIONS UTILISÉES POUR UN CONTRÔLE DE TRAITEMENT DE CARTE, PROCÉDÉ DE CONTRÔLE DE DISPOSITIF DE TRAITEMENT DE CARTE ET DISPOSITIF DE TRAITEMENT DE CARTE
(JA) 基板処理監視に用いる設定情報の設定方法、基板処理装置の監視方法および基板処理装置
Abstract
(EN) This setting method of setting information used for board processing monitoring comprises: a setup recipe step (S12) for controlling a moving mechanism for moving a first object to be monitored in a board processing device to move the first object to be monitored to a first stop position; a setup imaging step, which is executed in parallel with the setup recipe step (S12) and in which a camera images the first object to be monitored; and a setting step (S16) for detecting, on the basis of first image data that is acquired by the camera in the setup imaging step and includes the first object to be monitored stopped at the first stop position, and first reference image data showing at least a part of the first object to be monitored, the position of the first object to be monitored in the first image data, and setting the position as an appropriate position with respect to the first stop position.
(FR) Ce procédé de définition pour la définition d'informations utilisées pour un contrôle de traitement de carte comprend : une étape de recette de configuration (S12) destinée à commander un mécanisme de déplacement destiné à déplacer un premier objet devant être contrôlé dans un dispositif de traitement de carte pour déplacer le premier objet devant être contrôlé jusqu'à une première position d'arrêt ; une étape d'imagerie de configuration, qui est exécutée en parallèle avec l'étape de recette de configuration (S12) et dans laquelle une caméra image le premier objet devant être contrôlé ; et une étape de définition (S16) destinée à détecter, sur la base de premières données d'image qui sont acquises par la caméra dans l'étape d'imagerie de configuration et comportent le premier objet devant être contrôlé arrêté au niveau de la première position d'arrêt, et des premières données d'image de référence représentant au moins une partie du premier objet devant être contrôlé, la position du premier objet devant être contrôlé dans les premières données d'image et la définition de la position comme une position appropriée par rapport à la première position d'arrêt.
(JA) 基板処理監視に用いる設定情報の設定方法は、基板処理装置内の第1監視対象物を移動させる移動機構を制御して、前記第1監視対象物を第1停止位置に移動させるセットアップレシピ工程(S12)と、セットアップレシピ工程(S12)と並行して実行され、カメラが第1監視対象物を撮像するセットアップ撮像工程と、セットアップ撮像工程においてカメラによって取得され、第1停止位置で停止する第1監視対象物を含む第1画像データと、第1監視対象物の少なくとも一部を示す第1参照画像データとに基づいて、第1画像データ内における第1監視対象物の位置を検出し、当該位置を前記第1停止位置に関する適正位置として設定する設定工程(S16)と、を備える。
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