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1. WO2022004169 - ANTENNA MODULE, CONNECTING MEMBER, AND COMMUNICATION DEVICE EQUIPPED WITH SAME

Publication Number WO/2022/004169
Publication Date 06.01.2022
International Application No. PCT/JP2021/018983
International Filing Date 19.05.2021
IPC
H01P 3/08 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
PWAVEGUIDES; RESONATORS, LINES OR OTHER DEVICES OF THE WAVEGUIDE TYPE
3Waveguides; Transmission lines of the waveguide type
02with two longitudinal conductors
08Microstrips; Strip lines
H01Q 1/50 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
QANTENNAS, i.e. RADIO AERIALS
1Details of, or arrangements associated with, antennas
50Structural association of antennas with earthing switches, lead-in devices or lightning protectors
H01Q 23/00 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
QANTENNAS, i.e. RADIO AERIALS
23Antennas with active circuits or circuit elements integrated within them or attached to them
H04B 1/38 2015.1
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
BTRANSMISSION
1Details of transmission systems, not covered by a single one of groups H04B3/-H04B13/123; Details of transmission systems not characterised by the medium used for transmission
38Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
H04B 1/3827 2015.1
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
BTRANSMISSION
1Details of transmission systems, not covered by a single one of groups H04B3/-H04B13/123; Details of transmission systems not characterised by the medium used for transmission
38Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
3827Portable transceivers
H05K 1/14 2006.1
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
14Structural association of two or more printed circuits
Applicants
  • 株式会社村田製作所 MURATA MANUFACTURING CO., LTD. [JP]/[JP]
Inventors
  • 尾仲 健吾 ONAKA, Kengo
  • 森 弘嗣 MORI, Hirotsugu
  • 山田 良樹 YAMADA, Yoshiki
  • 須藤 薫 SUDO, Kaoru
  • 泉谷 寛 IZUMITANI, Hiroshi
  • 上田 英樹 UEDA, Hideki
Agents
  • 特許業務法人深見特許事務所 FUKAMI PATENT OFFICE, P.C.
Priority Data
2020-11482202.07.2020JP
2020-17334414.10.2020JP
Publication Language Japanese (ja)
Filing Language Japanese (JA)
Designated States
Title
(EN) ANTENNA MODULE, CONNECTING MEMBER, AND COMMUNICATION DEVICE EQUIPPED WITH SAME
(FR) MODULE D'ANTENNE, ÉLÉMENT DE CONNEXION ET DISPOSITIF DE COMMUNICATION ÉQUIPÉ DE CEUX-CI
(JA) アンテナモジュール、接続部材、およびそれを搭載した通信装置
Abstract
(EN) An antenna module (100) comprises: a first substrate (122A) and a second substrate (122B) on each of which a radiating element (121) is disposed; a third substrate (250); and a switching circuit (130). An RFIC (110) for supplying a high-frequency signal to each of the first substrate (122A) and the second substrate (122B) is provided to the third substrate (250). The switching circuit (130) is configured to switch the connection between the RFIC (110) and the radiating element on the first substrate (122A) and the connection between the RFIC (110) and the radiating element on the second substrate (122B).
(FR) Un module d'antenne (100) comprend : un premier substrat (122A) et un deuxième substrat (122B) sur chacun desquels un élément rayonnant (121) est disposé ; un troisième substrat (250) ; et un circuit de commutation (130). Un RFIC (110) destiné à fournir un signal haute fréquence à chacun des premier (122A) et deuxième (122B) substrats est disposé sur le troisième substrat (250). Le circuit de commutation (130) est conçu pour commuter la connexion entre le RFIC (110) et l'élément rayonnant sur le premier substrat (122A) et la connexion entre le RFIC (110) et l'élément rayonnant sur le second substrat (122B).
(JA) アンテナモジュール(100)は、各々に放射素子(121)が配置された第1基板(122A)および第2基板(122B)と、第3基板(250)と、切換回路(130)とを備える。第3基板(250)は、第1基板(122A)および第2基板(122B)に高周波信号を供給するためのRFIC(110)が配置されている。切換回路(130)は、RFIC(110)と第1基板(122A)上の放射素子との間の接続、および、RFIC(110)と第2基板(122B)上の放射素子との間の接続を切換えるように構成される。
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