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1. WO2022002414 - 3D IMAGE ACQUISITION SYSTEM FOR OPTICAL INSPECTION AND METHOD FOR OPTICAL INSPECTION OF OBJECTS, IN PARTICULAR ELECTRONIC ASSEMBLIES, ELECTRONIC BOARDS AND THE LIKE

Publication Number WO/2022/002414
Publication Date 06.01.2022
International Application No. PCT/EP2020/068858
International Filing Date 03.07.2020
IPC
G01B 11/06 2006.1
GPHYSICS
01MEASURING; TESTING
BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
11Measuring arrangements characterised by the use of optical means
02for measuring length, width, or thickness
06for measuring thickness
G01B 11/25 2006.1
GPHYSICS
01MEASURING; TESTING
BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
11Measuring arrangements characterised by the use of optical means
24for measuring contours or curvatures
25by projecting a pattern, e.g. moiré fringes, on the object
G01N 21/956 2006.1
GPHYSICS
01MEASURING; TESTING
NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
21Investigating or analysing materials by the use of optical means, i.e. using infra-red, visible or ultra-violet light
84Systems specially adapted for particular applications
88Investigating the presence of flaws, defects or contamination
95characterised by the material or shape of the object to be examined
956Inspecting patterns on the surface of objects
H01L 21/66 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
66Testing or measuring during manufacture or treatment
CPC
G01B 11/0608
GPHYSICS
01MEASURING; TESTING
BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
11Measuring arrangements characterised by the use of optical means
02for measuring length, width or thickness
06for measuring thickness ; ; e.g. of sheet material
0608Height gauges
G01B 11/25
GPHYSICS
01MEASURING; TESTING
BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
11Measuring arrangements characterised by the use of optical means
24for measuring contours or curvatures
25by projecting a pattern, e.g. ; one or more lines,; moiré fringes on the object
G01B 2210/56
GPHYSICS
01MEASURING; TESTING
BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
2210Aspects not specifically covered by any group under G01B, e.g. of wheel alignment, caliper-like sensors
56Measuring geometric parameters of semiconductor structures, e.g. profile, critical dimensions or trench depth
G01N 2021/95638
GPHYSICS
01MEASURING; TESTING
NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
21Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
84Systems specially adapted for particular applications
88Investigating the presence of flaws or contamination
95characterised by the material or shape of the object to be examined
956Inspecting patterns on the surface of objects
95638for PCB's
G01N 21/95684
GPHYSICS
01MEASURING; TESTING
NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
21Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
84Systems specially adapted for particular applications
88Investigating the presence of flaws or contamination
95characterised by the material or shape of the object to be examined
956Inspecting patterns on the surface of objects
95684Patterns showing highly reflecting parts, e.g. metallic elements
Applicants
  • SUPSI (SCUOLA UNIVERSITARIA PROFESSIONALE DELLA SVIZZERA ITALIANA) [CH]/[CH]
Inventors
  • ALLEGRI, Daniele Guido
  • GARDENGHI, Roberto
Agents
  • MODIANO, Gabriella
Priority Data
Publication Language English (en)
Filing Language English (EN)
Designated States
Title
(EN) 3D IMAGE ACQUISITION SYSTEM FOR OPTICAL INSPECTION AND METHOD FOR OPTICAL INSPECTION OF OBJECTS, IN PARTICULAR ELECTRONIC ASSEMBLIES, ELECTRONIC BOARDS AND THE LIKE
(FR) SYSTÈME D'ACQUISITION D'IMAGE 3D POUR INSPECTION OPTIQUE ET PROCÉDÉ D'INSPECTION OPTIQUE D'OBJETS, EN PARTICULIER D'ENSEMBLES ÉLECTRONIQUES, DE CARTES ÉLECTRONIQUES ET ANALOGUES
Abstract
(EN) Automatic 3D image acquisition system (1, 10, 100) for optical inspection of objects (B), in particular electronic assemblies, electronic boards and the like, comprising: one or more light sources (21, 22) configured to emit a light (2, 3) toward a field of view (11) wherein an object (B) to be inspected is placed, and at least one digital sensor (31, 32, 33) that acquires at least part of the light (2, 3) reflected by the object (B) to be inspected, the digital sensor (31, 32, 33) being operatively connected to a data processing unit (90) configured to determine physical and/or geometric features of the object (B) to be inspected on the basis of the light (2', 3AB) acquired by the digital sensor (31, 32, 33). The light sources (21, 22) comprise a laser source (22) configured to generate laser light pulses (2), the digital sensor (31, 32, 33) comprises an intensity sensor (33), and the automatic optical inspection system (1, 10, 100) further comprises: an image intensifier apparatus (60), and a plurality of optical elements (48, 55, 49, 57) which define a path (4) of the laser light pulse (2) from the laser source (22) to the field of view (11) and from the field of view (11) to the image intensifier apparatus (60). The image intensifier apparatus (60) is configured to be switched from an open condition to a closed condition and vice versa [in ultra-fast manner] during the inspection of the object.
(FR) L'invention concerne un système d'acquisition automatique d'images 3D (1, 10, 100) pour l'inspection optique d'objets (B), en particulier des assemblages électroniques, des cartes électroniques et analogues, comprenant : une ou plusieurs sources lumineuses (21, 22) configurées pour émettre une lumière (2, 3) vers un champ de vue (11) dans lequel est placé un objet (B) à inspecter, et au moins un capteur numérique (31, 32, 33) qui acquiert au moins une partie de la lumière (2, 3) réfléchie par l'objet (B) à inspecter, le capteur numérique (31, 32, 33) étant connecté de manière opérationnelle à une unité de traitement de données (90) configurée pour déterminer des caractéristiques physiques et/ou géométriques de l'objet (B) à inspecter sur la base de la lumière (2', 3AB) acquise par le capteur numérique (31, 32, 33). Les sources de lumière (21, 22) comprennent une source laser (22) configurée pour générer des impulsions de lumière laser (2), le capteur numérique (31, 32, 33) comprend un capteur d'intensité (33), et le système d'inspection optique automatique (1, 10, 100) comprend en outre : un intensificateur d'image (60), et une pluralité d'éléments optiques (48, 55, 49, 57) qui définissent un trajet (4) de l'impulsion de lumière laser (2) depuis la source laser (22) vers le champ de vue (11) et depuis le champ de vue (11) vers l'intensificateur d'image (60). L'intensificateur d'image (60) est configuré pour basculer d'un état ouvert à un état fermé et vice versa [de manière ultrarapide] pendant l'inspection de l'objet.
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