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1. WO2022001465 - FLIP CHIP AND CHIP PACKAGING STRUCTURE

Publication Number WO/2022/001465
Publication Date 06.01.2022
International Application No. PCT/CN2021/094916
International Filing Date 20.05.2021
IPC
H01L 23/48 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
H01L 23/488 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
488consisting of soldered or bonded constructions
Applicants
  • 京东方科技集团股份有限公司 BOE TECHNOLOGY GROUP CO., LTD. [CN]/[CN]
  • 成都京东方光电科技有限公司 CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD. [CN]/[CN]
Inventors
  • 喻勇 YU, Yong
  • 龚雪瑞 GONG, Xuerui
  • 张昌 ZHANG, Chang
Agents
  • 北京律智知识产权代理有限公司 BEIJING INTELLEGAL INTELLECTUAL PROPERTY AGENT LTD.
Priority Data
202010601611.728.06.2020CN
Publication Language Chinese (zh)
Filing Language Chinese (ZH)
Designated States
Title
(EN) FLIP CHIP AND CHIP PACKAGING STRUCTURE
(FR) PUCE RETOURNÉE ET PROCÉDÉ DE CONDITIONNEMENT DE PUCE
(ZH) 倒装芯片和芯片封装结构
Abstract
(EN) A flip chip and a chip packaging structure, relating to the technical field of display. The flip chip comprises a driving chip (100) and a plurality of conductive connecting members (200). The driving chip (100) has a packaging surface (160) facing a wiring substrate; any one of the conductive connecting members (200) comprises conductive convex points (210) connected to the packaging surface (160) and a conductive epitaxial portion (220) located on the sides, far away from the driving chip (100), of the conductive convex points (210). The flip chip can improve the stability of the chip packaging structure.
(FR) Puce retournée et structure de conditionnement de puce se rapportant au domaine technique de l'affichage. La puce retournée comprend une puce de pilotage (100) et une pluralité d'éléments de connexion conducteurs (200). La puce de pilotage (100) présente une surface de conditionnement (160) faisant face à un substrat de câblage ; l'un quelconque des éléments de connexion conducteurs (200) comprend des points convexes conducteurs (210) connectés à la surface de conditionnement (160) et une partie épitaxiale conductrice (220) située sur les côtés, loin de la puce de pilotage (100), des points convexes conducteurs (210). Le procédé permet d'améliorer la stabilité de la structure de conditionnement de puce.
(ZH) 一种倒装芯片和芯片封装结构,属于显示技术领域。该倒装芯片包括驱动芯片(100)和多个导电连接件(200);其中,驱动芯片(100)具有用于朝向一布线基板的封装面(160);任意一个所述导电连接件(200)包括连接于所述封装面(160)的导电凸点(210)和位于所述导电凸点(210)远离所述驱动芯片(100)一侧的导电外延部(220)。该倒装芯片能够提高芯片封装结构的稳定性。
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