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1. WO2022000641 - SUPER-HYDROPHOBIC MICRO-PIT ARRAY CHIP, AND PRODUCTION METHOD THEREFOR AND DEVICE THEREOF

Publication Number WO/2022/000641
Publication Date 06.01.2022
International Application No. PCT/CN2020/104470
International Filing Date 24.07.2020
IPC
B01L 3/00 2006.1
BPERFORMING OPERATIONS; TRANSPORTING
01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
LCHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
3Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
C09D 183/08 2006.1
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
183Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
04Polysiloxanes
08containing silicon bound to organic groups containing atoms other than carbon, hydrogen, and oxygen
C09D 7/61 2018.1
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
7Features of coating compositions, not provided for in group C09D5/88; Processes for incorporating ingredients in coating compositions
40Additives
60non-macromolecular
61inorganic
Applicants
  • 清华大学 TSINGHUA UNIVERSITY [CN]/[CN]
Inventors
  • 刘鹏 LIU, Peng
  • 胡亚伟 HU, Yawei
  • 陈忠尧 CHEN, Zhongyao
  • 刘畅 LIU, Chang
Agents
  • 北京汉鼎理利专利代理事务所(特殊普通合伙) LLR CHINA PATENT
Priority Data
202010636603.603.07.2020CN
Publication Language Chinese (zh)
Filing Language Chinese (ZH)
Designated States
Title
(EN) SUPER-HYDROPHOBIC MICRO-PIT ARRAY CHIP, AND PRODUCTION METHOD THEREFOR AND DEVICE THEREOF
(FR) PUCE DE RÉSEAUX DE MICRO-CUVETTES SUPER-HYDROPHOBES ET SON PROCÉDÉ DE PRODUCTION ET DISPOSITIF ASSOCIÉ
(ZH) 超疏水微坑阵列芯片及其制备方法和装置
Abstract
(EN) A super-hydrophobic micro-pit array chip. The chip is produced by the following method: forming a chip comprising a micro-pit array (5) and a super-hydrophobic coating pool (4) by means of integral injection molding; adding a super-hydrophobic coating material into the super-hydrophobic coating pool; and forming a super-hydrophobic layer among micro-pits of the micro-pit array after a super-hydrophobic coating solution is volatilized, the super-hydrophobic layer being a hydrophobic layer having a contact angle between the surface of the super-hydrophobic layer and water or the aqueous solution being greater than 150 degrees and a rolling angle being smaller than 10 degrees, and the super-hydrophobic layer enabling the aqueous solutions in all the micro-pits to be effectively and physically isolated.
(FR) L'invention concerne une puce de réseau de micro-cuvettes super-hydrophobes. La puce est produite par le procédé suivant : la formation d'une puce comprenant un réseau de micro-cuvettes (5) et un bain de revêtement super-hydrophobe (4) au moyen d'un moulage par injection intégré ; l'ajout d'un matériau de revêtement super-hydrophobe dans le bain de revêtement super-hydrophobe ; et la formation d'une couche super-hydrophobe parmi les microcuvettes du réseau de micro-cuvettes après que la solution de revêtement super-hydrophobe est volatilisée, la couche super-hydrophobe étant une couche hydrophobe ayant un angle de contact entre la surface de la couche super-hydrophobe et de l'eau ou la solution aqueuse étant supérieure à 150 degrés et un angle de roulement étant inférieur à 10 degrés, et la couche super-hydrophobe permettant d'isoler efficacement et physiquement les solutions aqueuses dans tous les microcuvettes.
(ZH) 一种超疏水微坑阵列芯片,所述芯片通过以下方法制备:通过一体注塑形成包括微坑阵列(5)和超疏水涂层池(4)的芯片,将超疏水涂料加入到超疏水涂层池中,所述超疏水涂料溶液挥发后在所述微坑阵列的微坑之间形成超疏水层,所述超疏水层是指其表面与水或水溶液的接触角大于150°、滚动角小于10°的疏水层,所述超疏水层使得各个微坑中水溶液之间有效的物理隔绝。
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