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1. WO2022000478 - CIRCUIT BOARD MANUFACTURING METHOD AND CIRCUIT BOARD

Publication Number WO/2022/000478
Publication Date 06.01.2022
International Application No. PCT/CN2020/100177
International Filing Date 03.07.2020
IPC
H05K 3/06 2006.1
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
02in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
06the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
H05K 1/02 2006.1
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
G03F 1/00 2012.1
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
1Originals for photomechanical production of textured or patterned surfaces, e.g. masks, photo-masks or reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
Applicants
  • 欧菲光集团股份有限公司 OFILM GROUP CO., LTD. [CN]/[CN]
  • 南昌欧菲显示科技有限公司 NANCHAGN OFILM DISPLAY TECHNOLOGY CO., LTD [CN]/[CN]
Inventors
  • 张礼冠 ZHANG, Liguan
  • 许建勇 XU, Jianyong
Agents
  • 广州华进联合专利商标代理有限公司 ADVANCE CHINA IP LAW OFFICE
Priority Data
Publication Language Chinese (zh)
Filing Language Chinese (ZH)
Designated States
Title
(EN) CIRCUIT BOARD MANUFACTURING METHOD AND CIRCUIT BOARD
(FR) PROCÉDÉ DE FABRICATION D'UN CIRCUIT IMPRIMÉ ET CIRCUIT IMPRIMÉ
(ZH) 线路板制作方法及线路板
Abstract
(EN) The present application relates to a circuit board manufacturing method and a circuit board. The method comprises: providing a substrate, forming a metal layer on the substrate, covering the side of the metal layer away from the substrate with a dry film, utilizing a mask to expose and develop the dry film, etching parts of the metal layer not covered by the dry film to form a metal circuit, where the mask comprises a light-blocking structure and a hollow area, the edge area of the light-blocking structure in proximity to the hollow area is a partially light-blocking structure, and the middle area of the light-blocking structure away from the hollow area is a fully light-blocking structure.
(FR) La présente demande concerne un procédé de fabrication de circuit imprimé et un circuit imprimé. Le procédé consiste à : fournir un substrat, former une couche métallique sur le substrat, recouvrir le côté de la couche métallique à l'opposé du substrat avec un film sec, utiliser un masque pour exposer et développer le film sec, graver des parties de la couche métallique non recouvertes par le film sec pour former un circuit métallique, le masque comprenant une structure de blocage de lumière et une zone creuse, la zone de bord de la structure de blocage de lumière à proximité de la zone creuse étant une structure partiellement bloquante, et la zone centrale de la structure de blocage de lumière à l'opposé de la zone creuse étant une structure entièrement bloquant la lumière.
(ZH) 本申请涉及一种线路板制作方法及线路板。方法包括:提供底板,在底板上形成金属层,在金属层远离底板的一侧覆盖干膜,利用光罩对干膜进行曝光显影,蚀刻金属层中未被干膜覆盖的部分,形成金属线路,其中,光罩包括遮光结构和镂空区域,遮光结构靠近镂空区域的边缘区域为部分遮光结构,遮光结构远离镂空区域的中间区域为全遮光结构。
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