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1. WO2022000114 - DEVICE AND METHOD FOR MANUFACTURING THE SAME

Publication Number WO/2022/000114
Publication Date 06.01.2022
International Application No. PCT/CN2020/098457
International Filing Date 28.06.2020
IPC
H01L 27/32 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
28including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
32with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes
H01L 33/36 2010.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
36characterised by the electrodes
CPC
H01L 25/0753
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; ; Multistep manufacturing processes thereof
03all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes
04the devices not having separate containers
075the devices being of a type provided for in group H01L33/00
0753the devices being arranged next to each other
H01L 2933/0016
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2933Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
0008Processes
0016relating to electrodes
H01L 2933/005
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2933Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
0008Processes
0033relating to semiconductor body packages
005relating to encapsulations
H01L 2933/0066
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2933Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
0008Processes
0033relating to semiconductor body packages
0066relating to arrangements for conducting electric current to or from the semiconductor body
H01L 33/38
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
36characterised by the electrodes
38with a particular shape
H01L 33/52
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
52Encapsulations
Applicants
  • HUAWEI TECHNOLOGIES CO., LTD. [CN]/[CN]
Inventors
  • OGAWA, Tsuyoshi
Priority Data
Publication Language English (en)
Filing Language English (EN)
Designated States
Title
(EN) DEVICE AND METHOD FOR MANUFACTURING THE SAME
(FR) DISPOSITIF ET SON PROCÉDÉ DE FABRICATION
Abstract
(EN) A device (100) is provided, comprising: a substrate (10); a first electrode (20) on the substrate (10); a light-emitting element (30) electrically connected to the first electrode (20) by a first metal wiring (28); and a second electrode (42) electrically connected to the light-emitting element (30), wherein the first electrode (20) and the light-emitting element (30) are laterally separated from each other, and wherein the light-emitting element (30) is connected to the first metal wiring (28) at the side which faces the substrate (10).
(FR) L'invention concerne un dispositif (100) comprenant : un substrat (10) ; une première électrode (20) sur le substrat (10) ; un élément électroluminescent (30) connecté électriquement à la première électrode (20) par un premier câblage métallique (28) ; et une seconde électrode (42) connectée électriquement à l'élément électroluminescent (30), la première électrode (20) et l'élément électroluminescent (30) étant latéralement séparés l'un de l'autre, et l'élément électroluminescent (30) étant connecté au premier câblage métallique (28) au niveau du côté qui fait face au substrat (10).
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