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Application Id/Number

1. WO2021193420 - LAYERED BONDING MATERIAL, SEMICONDUCTOR PACKAGE, AND POWER MODULE

PCT Biblio. Data
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ISR/WOSA/A17(2)(a)
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- WIPO Translate

Publication Number WO/2021/193420

Publication Date 30.09.2021

International Application No. PCT/JP2021/011341

International Filing Date 19.03.2021

IPC

C22C 9/00 2006.1

C	CHEMISTRY; METALLURGY
22	METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
C	ALLOYS
9	Alloys based on copper

C22C 13/00 2006.1

C	CHEMISTRY; METALLURGY
22	METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
C	ALLOYS
13	Alloys based on tin

C22C 27/04 2006.1

C	CHEMISTRY; METALLURGY
22	METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
C	ALLOYS
27	Alloys based on rhenium or a refractory metal not mentioned in groups C22C14/ or C22C16/130
04	Alloys based on tungsten or molybdenum

H01L 23/12 2006.1

H	ELECTRICITY
01	BASIC ELECTRIC ELEMENTS
L	SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23	Details of semiconductor or other solid state devices
12	Mountings, e.g. non-detachable insulating substrates

B23K 35/14 2006.1

B	PERFORMING OPERATIONS; TRANSPORTING
23	MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K	SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
35	Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
02	characterised by mechanical features, e.g. shape
12	not specially designed for use as electrodes
14	for soldering

B23K 35/26 2006.1

B	PERFORMING OPERATIONS; TRANSPORTING
23	MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K	SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
35	Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
22	characterised by the composition or nature of the material
24	Selection of soldering or welding materials proper
26	with the principal constituent melting at less than 400°C

View more classifications

C22C 9/00 2006.1

C	CHEMISTRY; METALLURGY
22	METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
C	ALLOYS
9	Alloys based on copper

C22C 13/00 2006.1

C	CHEMISTRY; METALLURGY
22	METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
C	ALLOYS
13	Alloys based on tin

C22C 27/04 2006.1

C	CHEMISTRY; METALLURGY
22	METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
C	ALLOYS
27	Alloys based on rhenium or a refractory metal not mentioned in groups C22C14/ or C22C16/130
04	Alloys based on tungsten or molybdenum

H01L 23/12 2006.1

H	ELECTRICITY
01	BASIC ELECTRIC ELEMENTS
L	SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23	Details of semiconductor or other solid state devices
12	Mountings, e.g. non-detachable insulating substrates

B23K 35/14 2006.1

B	PERFORMING OPERATIONS; TRANSPORTING
23	MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K	SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
35	Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
02	characterised by mechanical features, e.g. shape
12	not specially designed for use as electrodes
14	for soldering

B23K 35/26 2006.1

B	PERFORMING OPERATIONS; TRANSPORTING
23	MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K	SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
35	Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
22	characterised by the composition or nature of the material
24	Selection of soldering or welding materials proper
26	with the principal constituent melting at less than 400°C

H01L 21/52 2006.1

H	ELECTRICITY
01	BASIC ELECTRIC ELEMENTS
L	SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21	Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02	Manufacture or treatment of semiconductor devices or of parts thereof
04	the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50	Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
52	Mounting semiconductor bodies in containers

View less classifications

CPC

B23K 2101/40

B	PERFORMING OPERATIONS; TRANSPORTING
23	MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K	SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
2101	Articles made by soldering, welding or cutting
36	Electric or electronic devices
40	Semiconductor devices

B23K 35/0238

B	PERFORMING OPERATIONS; TRANSPORTING
23	MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K	SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
35	Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
02	characterised by mechanical features, e.g. shape
0222	for use in soldering, brazing
0233	Sheets, foils
0238	layered

B23K 35/26

B	PERFORMING OPERATIONS; TRANSPORTING
23	MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K	SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
35	Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
22	characterised by the composition or nature of the material
24	Selection of soldering or welding materials proper
26	with the principal constituent melting at less than 400 degrees C

B23K 35/262

B	PERFORMING OPERATIONS; TRANSPORTING
23	MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K	SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
35	Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
22	characterised by the composition or nature of the material
24	Selection of soldering or welding materials proper
26	with the principal constituent melting at less than 400 degrees C
262	Sn as the principal constituent

B32B 15/01

B	PERFORMING OPERATIONS; TRANSPORTING
32	LAYERED PRODUCTS
B	LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
15	Layered products comprising ; a layer of; metal
01	all layers being exclusively metallic

B32B 2307/732

B	PERFORMING OPERATIONS; TRANSPORTING
32	LAYERED PRODUCTS
B	LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
2307	Properties of the layers or laminate
70	Other properties
732	Dimensional properties

View more classifications

B23K 2101/40

B	PERFORMING OPERATIONS; TRANSPORTING
23	MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K	SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
2101	Articles made by soldering, welding or cutting
36	Electric or electronic devices
40	Semiconductor devices

B23K 35/0238

B	PERFORMING OPERATIONS; TRANSPORTING
23	MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K	SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
35	Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
02	characterised by mechanical features, e.g. shape
0222	for use in soldering, brazing
0233	Sheets, foils
0238	layered

B23K 35/26

B	PERFORMING OPERATIONS; TRANSPORTING
23	MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K	SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
35	Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
22	characterised by the composition or nature of the material
24	Selection of soldering or welding materials proper
26	with the principal constituent melting at less than 400 degrees C

B23K 35/262

B	PERFORMING OPERATIONS; TRANSPORTING
23	MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K	SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
35	Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
22	characterised by the composition or nature of the material
24	Selection of soldering or welding materials proper
26	with the principal constituent melting at less than 400 degrees C
262	Sn as the principal constituent

B32B 15/01

B	PERFORMING OPERATIONS; TRANSPORTING
32	LAYERED PRODUCTS
B	LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
15	Layered products comprising ; a layer of; metal
01	all layers being exclusively metallic

B32B 2307/732

B	PERFORMING OPERATIONS; TRANSPORTING
32	LAYERED PRODUCTS
B	LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
2307	Properties of the layers or laminate
70	Other properties
732	Dimensional properties

C22C 9/00

C	CHEMISTRY; METALLURGY
22	METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
C	ALLOYS
9	Alloys based on copper

H01L 2224/2908

H	ELECTRICITY
01	BASIC ELECTRIC ELEMENTS
L	SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224	Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01	Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
26	Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
28	Structure, shape, material or disposition of the layer connectors prior to the connecting process
29	of an individual layer connector
29001	Core members of the layer connector
29075	Plural core members
2908	being stacked

H01L 2224/29111

H	ELECTRICITY
01	BASIC ELECTRIC ELEMENTS
L	SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224	Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01	Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
26	Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
28	Structure, shape, material or disposition of the layer connectors prior to the connecting process
29	of an individual layer connector
29001	Core members of the layer connector
29099	Material
291	with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
29101	the principal constituent melting at a temperature of less than 400°C
29111	Tin [Sn] as principal constituent

H01L 2224/29147

H	ELECTRICITY
01	BASIC ELECTRIC ELEMENTS
L	SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224	Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01	Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
26	Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
28	Structure, shape, material or disposition of the layer connectors prior to the connecting process
29	of an individual layer connector
29001	Core members of the layer connector
29099	Material
291	with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
29138	the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
29147	Copper [Cu] as principal constituent

H01L 2224/29155

H	ELECTRICITY
01	BASIC ELECTRIC ELEMENTS
L	SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224	Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01	Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
26	Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
28	Structure, shape, material or disposition of the layer connectors prior to the connecting process
29	of an individual layer connector
29001	Core members of the layer connector
29099	Material
291	with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
29138	the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
29155	Nickel [Ni] as principal constituent

H01L 2224/2918

H	ELECTRICITY
01	BASIC ELECTRIC ELEMENTS
L	SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224	Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01	Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
26	Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
28	Structure, shape, material or disposition of the layer connectors prior to the connecting process
29	of an individual layer connector
29001	Core members of the layer connector
29099	Material
291	with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
29163	the principal constituent melting at a temperature of greater than 1550°C
2918	Molybdenum [Mo] as principal constituent

H01L 2224/29184

H	ELECTRICITY
01	BASIC ELECTRIC ELEMENTS
L	SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224	Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01	Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
26	Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
28	Structure, shape, material or disposition of the layer connectors prior to the connecting process
29	of an individual layer connector
29001	Core members of the layer connector
29099	Material
291	with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
29163	the principal constituent melting at a temperature of greater than 1550°C
29184	Tungsten [W] as principal constituent

H01L 2224/2956

H	ELECTRICITY
01	BASIC ELECTRIC ELEMENTS
L	SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224	Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01	Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
26	Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
28	Structure, shape, material or disposition of the layer connectors prior to the connecting process
29	of an individual layer connector
2954	Coating
2956	Disposition

H01L 2224/29575

H	ELECTRICITY
01	BASIC ELECTRIC ELEMENTS
L	SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224	Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01	Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
26	Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
28	Structure, shape, material or disposition of the layer connectors prior to the connecting process
29	of an individual layer connector
2954	Coating
29575	Plural coating layers

H01L 2224/32225

H	ELECTRICITY
01	BASIC ELECTRIC ELEMENTS
L	SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224	Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01	Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
26	Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
31	Structure, shape, material or disposition of the layer connectors after the connecting process
32	of an individual layer connector
321	Disposition
32151	the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
32221	the body and the item being stacked
32225	the item being non-metallic, e.g. insulating substrate with or without metallisation

H01L 23/12

H	ELECTRICITY
01	BASIC ELECTRIC ELEMENTS
L	SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23	Details of semiconductor or other solid state devices
12	Mountings, e.g. non-detachable insulating substrates

H01L 23/36

H	ELECTRICITY
01	BASIC ELECTRIC ELEMENTS
L	SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23	Details of semiconductor or other solid state devices
34	Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
36	Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks

H01L 23/3672

H	ELECTRICITY
01	BASIC ELECTRIC ELEMENTS
L	SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23	Details of semiconductor or other solid state devices
34	Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
36	Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
367	Cooling facilitated by shape of device
3672	Foil-like cooling fins or heat sinks

H01L 23/3735

H	ELECTRICITY
01	BASIC ELECTRIC ELEMENTS
L	SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23	Details of semiconductor or other solid state devices
34	Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
36	Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
373	Cooling facilitated by selection of materials for the device ; or materials for thermal expansion adaptation, e.g. carbon
3735	Laminates or multilayers, e.g. direct bond copper ceramic substrates

H01L 24/26

H	ELECTRICITY
01	BASIC ELECTRIC ELEMENTS
L	SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
24	Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
01	Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
26	Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto

H01L 24/29

H	ELECTRICITY
01	BASIC ELECTRIC ELEMENTS
L	SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
24	Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
01	Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
26	Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
28	Structure, shape, material or disposition of the layer connectors prior to the connecting process
29	of an individual layer connector

H01L 24/31

H	ELECTRICITY
01	BASIC ELECTRIC ELEMENTS
L	SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
24	Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
01	Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
26	Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
31	Structure, shape, material or disposition of the layer connectors after the connecting process

H01L 24/32

H	ELECTRICITY
01	BASIC ELECTRIC ELEMENTS
L	SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
24	Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
01	Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
26	Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
31	Structure, shape, material or disposition of the layer connectors after the connecting process
32	of an individual layer connector

View less classifications

Applicants

千住金属工業株式会社 SENJU METAL INDUSTRY CO., LTD. [JP]/[JP]

Inventors

亀田　直人 KAMEDA Naoto
▲土▼屋　政人 TSUCHIYA Masato
中村　勝司 NAKAMURA Katsuji
宗形　修 MUNEKATA Osamu
鶴田　加一 TSURUTA Kaichi

Agents

大野　聖二 OHNO Seiji
大野　浩之 OHNO Hiroyuki
野本　裕史 NOMOTO Hiroshi

Priority Data

2020-050674

23.03.2020

Publication Language Japanese (ja)

Filing Language Japanese (JA)

Designated States

View all

AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, IT, JO, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, WS, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)

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Title

(EN) LAYERED BONDING MATERIAL, SEMICONDUCTOR PACKAGE, AND POWER MODULE

(FR) MATÉRIAU DE LIAISON EN COUCHES, BOÎTIER DE SEMI-CONDUCTEUR ET MODULE DE PUISSANCE

(JA) 積層接合材料、半導体パッケージおよびパワーモジュール

Abstract

(EN) In this layered bonding material 10, the coefficient of thermal expansion of a substrate 11 is 5.5-15.5 ppm/K, and a first surface and a second surface are coated with lead-free solder 12a, 12b.

(FR) Dans ce matériau de liaison en couches 10, le coefficient de dilatation thermique d'un substrat 11 vaut de 5,5 à 15,5 ppm/K, et une première surface et une seconde surface sont revêtues de brasure sans plomb 12a, 12b.

(JA) 積層接合材料１０は、基材１１の線膨張係数が５．５～１５．５ｐｐｍ／Ｋであり、第１面および第２面が鉛フリーはんだ１２ａ、１２ｂでコーティングされている。

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1. WO2021193420 - LAYERED BONDING MATERIAL, SEMICONDUCTOR PACKAGE, AND POWER MODULE