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1. WO2021145175 - SUBSTRATE PROCESSING METHOD, STORAGE MEDIUM, AND SUBSTRATE PROCESSING APPARATUS

Publication Number WO/2021/145175
Publication Date 22.07.2021
International Application No. PCT/JP2020/048136
International Filing Date 23.12.2020
IPC
B05C 9/12 2006.1
BPERFORMING OPERATIONS; TRANSPORTING
05SPRAYING OR ATOMISING IN GENERAL; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
CAPPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
9Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by groups B05C1/-B05C7/159
08for applying liquid or other fluent material and performing an auxiliary operation
12the auxiliary operation being performed after the application
B05C 11/08 2006.1
BPERFORMING OPERATIONS; TRANSPORTING
05SPRAYING OR ATOMISING IN GENERAL; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
CAPPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
11Component parts, details or accessories not specifically provided for in groups B05C1/-B05C9/132
02Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface; Control of the thickness of a coating
08Spreading liquid or other fluent material by manipulating the work, e.g. tilting
B05D 1/40 2006.1
BPERFORMING OPERATIONS; TRANSPORTING
05SPRAYING OR ATOMISING IN GENERAL; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
DPROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
1Processes for applying liquids or other fluent materials
40Distributing applied liquids or other fluent materials by members moving relatively to surface
B05D 3/00 2006.1
BPERFORMING OPERATIONS; TRANSPORTING
05SPRAYING OR ATOMISING IN GENERAL; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
DPROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
3Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
G03F 7/26 2006.1
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
26Processing photosensitive materials; Apparatus therefor
G03F 7/30 2006.1
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
26Processing photosensitive materials; Apparatus therefor
30Imagewise removal using liquid means
CPC
B05C 11/08
BPERFORMING OPERATIONS; TRANSPORTING
05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
11Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
02Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; ; Controlling means therefor
08Spreading liquid or other fluent material by manipulating the work, e.g. tilting
B05C 9/12
BPERFORMING OPERATIONS; TRANSPORTING
05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
9Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
08for applying liquid or other fluent material and performing an auxiliary operation
12the auxiliary operation being performed after the application
B05D 1/40
BPERFORMING OPERATIONS; TRANSPORTING
05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
1Processes for applying liquids or other fluent materials
40Distributing applied liquids or other fluent materials by members moving relatively to surface
B05D 3/00
BPERFORMING OPERATIONS; TRANSPORTING
05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
3Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
G03F 7/26
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
26Processing photosensitive materials; Apparatus therefor
G03F 7/30
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
26Processing photosensitive materials; Apparatus therefor
30Imagewise removal using liquid means
Applicants
  • 東京エレクトロン株式会社 TOKYO ELECTRON LIMITED [JP]/[JP]
Inventors
  • 中村 淳司 NAKAMURA Junji
  • 寺田 正一 TERADA Shoichi
Agents
  • 長谷川 芳樹 HASEGAWA Yoshiki
  • 黒木 義樹 KUROKI Yoshiki
  • 柏岡 潤二 KASHIOKA Junji
Priority Data
2020-00497216.01.2020JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) SUBSTRATE PROCESSING METHOD, STORAGE MEDIUM, AND SUBSTRATE PROCESSING APPARATUS
(FR) PROCÉDÉ DE TRAITEMENT DE SUBSTRAT, MILIEU DE STOCKAGE ET APPAREIL DE TRAITEMENT DE SUBSTRAT
(JA) 基板処理方法、記憶媒体、及び基板処理装置
Abstract
(EN)
The purpose of the present invention is to provide a substrate processing method whereby the result of performing a solution process can easily be made to approach a target process result. This substrate processing method comprises: adjusting at least one parameter obtained by establishing, among reference conditions, a condition of a solution process in a stage before a substrate starts rotating at a second rotation speed in a drying process, said at least one parameter being adjusted on the basis of a predetermined target thickness distribution of a coating film and on the basis of the thickness distribution of the coating film obtained by executing the solution process in accordance with the prescribed reference conditions, the solution process including an application process that includes discharging a processing solution toward the surface of the substrate while the substrate is caused to rotate at a first rotation speed, and the drying process that includes causing the substrate to rotate at the second rotation speed after the application process so as to dry the coating film of the processing solution on the surface of the substrate; and performing the solution process on the substrate in accordance with control conditions obtained by adjusting the at least one parameter from among the reference conditions.
(FR)
La présente invention consiste à fournir un procédé de traitement de substrat moyennant quoi le résultat de l'exécution d’un processus de solution peut facilement approcher un résultat de traitement cible. Ce procédé de traitement de substrat comprend : l’ajustement d’au moins un paramètre obtenu par l’établissement, parmi des conditions de référence, d’une condition d’un processus de solution dans un stade antérieur à celui où un substrat commence à tourner à une seconde vitesse de rotation dans un procédé de séchage, ledit paramètre étant ajusté sur la base d’une distribution de l’épaisseur cible prédéterminée d’un film de revêtement et sur la base de la distribution de l’épaisseur du film de revêtement obtenu par exécution du processus de solution en fonction des conditions de référence prescrites, le processus de solution comprenant un procédé d’application qui comprend l’évacuation d’une solution de traitement vers la surface du substrat pendant que le substrat est amené à tourner à une première vitesse de rotation, et le procédé de séchage peut comprendre le fait d’amener le substrat à tourner à la seconde vitesse de rotation après le procédé d’application afin de sécher le film de revêtement de la solution de traitement sur la surface du substrat ; l'exécution du processus de solution sur le substrat selon des conditions de commande obtenues par l’ajustement dudit paramètre parmi les conditions de référence.
(JA)
液処理の実行結果を目標の処理結果に容易に近づけることが可能な基板処理方法を提供することを目的とする。 基板処理方法は、第1回転速度で基板を回転させつつ当該基板の表面に向けて処理液を吐出することを含む塗布処理と、塗布処理後に第2回転速度で基板を回転させて基板の表面上の処理液の被膜を乾燥させることを含む乾燥処理とを含む液処理を所定の基準条件に従って実行して得られた被膜の膜厚分布と、予め定められた被膜の目標膜厚分布とに基づいて、基準条件のうち、乾燥処理の第2回転速度での基板の回転開始よりも前段における液処理の条件を定めた少なくとも1つのパラメータを調節することと、基準条件のうち少なくとも1つのパラメータを調節することで得られる制御条件に従って、基板に液処理を施すことと、を含む。
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