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1. WO2021144980 - POWER MODULE AND POWER CONVERSION DEVICE

Publication Number WO/2021/144980
Publication Date 22.07.2021
International Application No. PCT/JP2020/001557
International Filing Date 17.01.2020
IPC
H01L 23/04 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
02Containers; Seals
04characterised by the shape
H01L 23/28 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
28Encapsulation, e.g. encapsulating layers, coatings
H01L 25/07 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices
03all the devices being of a type provided for in the same subgroup of groups H01L27/-H01L51/128
04the devices not having separate containers
07the devices being of a type provided for in group H01L29/78
H01L 25/18 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices
18the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/-H01L51/160
CPC
H01L 23/04
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
02Containers; Seals
04characterised by the shape ; of the container or parts, e.g. caps, walls
H01L 23/28
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
28Encapsulations, e.g. encapsulating layers, coatings, ; e.g. for protection
H01L 25/07
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; ; Multistep manufacturing processes thereof
03all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes
04the devices not having separate containers
07the devices being of a type provided for in group H01L29/00
H01L 25/18
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; ; Multistep manufacturing processes thereof
18the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L51/00
Applicants
  • 三菱電機株式会社 MITSUBISHI ELECTRIC CORPORATION [JP]/[JP]
Inventors
  • 原田 耕三 HARADA, Kozo
  • 坂本 健 SAKAMOTO, Ken
  • 山口 義弘 YAMAGUCHI, Yoshihiro
Agents
  • 特許業務法人深見特許事務所 FUKAMI PATENT OFFICE, P.C.
Priority Data
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) POWER MODULE AND POWER CONVERSION DEVICE
(FR) MODULE D'ALIMENTATION ET DISPOSITIF DE CONVERSION D'ALIMENTATION
(JA) パワーモジュールおよび電力変換装置
Abstract
(EN)
This power module (101) has an insulating substrate (21), a case member (6), a power semiconductor element (3), a base member (1), a sealing member (8), and an adhesion member (12). The insulating substrate (21) has a first surface (51) and a second surface (52) on the side opposite to the first surface (51). The case member (6) surrounds the insulating substrate (21) as seen from a direction perpendicular to the first surface (51). The power semiconductor element (3) faces the first surface (51). The base member (1) faces the second surface (52). The sealing member (8) seals the power semiconductor element (3) and the insulating substrate (21) and is in contact with the case member (6). The adhesion member (12) fixes the base member (1) and the case member (6) and surrounds the insulating substrate (21) as seen in the direction perpendicular to the first surface (51). The base member (1) has a third surface (53) that is in contact with the adhesion member (12), a fourth surface (54) that is continuous to the third surface (53) and is in contact with the sealing member (8), and a fifth surface (55) that faces the second surface (52). An inside end section (35) of the third surface (53) is positioned at a height different from the fifth surface (55) in a direction perpendicular to the fifth surface (55). The third surface (53) slopes toward the fourth surface (54).
(FR)
La présente invention concerne un module de puissance (101) comprenant un substrat isolant (21), un élément de boîtier (6), un élément semi-conducteur de puissance (3), un élément de base (1), un élément d'étanchéité (8) et un élément d'adhérence (12). Le substrat isolant (21) a une première surface (51) et une seconde surface (52) sur le côté opposé à la première surface (51). L'élément de boîtier (6) entoure le substrat isolant (21) vu dans une direction perpendiculaire à la première surface (51). L'élément semi-conducteur de puissance (3) fait face à la première surface (51). L'élément de base (1) fait face à la seconde surface (52). L'élément d'étanchéité (8) scelle l'élément semi-conducteur de puissance (3) et le substrat isolant (21) et est en contact avec l'élément de boîtier (6). L'élément d'adhérence (12) fixe l'élément de base (1) et l'élément de boîtier (6) et entoure le substrat isolant (21) comme vu dans la direction perpendiculaire à la première surface (51). L'élément de base (1) présente une troisième surface (53) qui est en contact avec l'élément d'adhérence (12), une quatrième surface (54) qui est continue à la troisième surface (53) et qui est en contact avec l'élément d'étanchéité (8), et une cinquième surface (55) qui fait face à la deuxième surface (52). Une section d'extrémité intérieure (35) de la troisième surface (53) est positionnée à une hauteur différente de la cinquième surface (55) dans une direction perpendiculaire à la cinquième surface (55). La troisième surface (53) est inclinée vers la quatrième surface (54).
(JA)
パワーモジュール(101)は、絶縁基板(21)と、ケース部材(6)と、パワー半導体素子(3)と、ベース部材(1)と、封止部材(8)と、接着部材(12)とを有している。絶縁基板(21)は、第1面(51)と、第1面(51)とは反対側の第2面(52)とを有している。ケース部材(6)は、第1面(51)に対して垂直な方向に見て、絶縁基板(21)を取り囲んでいる。パワー半導体素子(3)は、第1面(51)に対面している。ベース部材(1)は、第2面(52)に対面している。封止部材(8)は、パワー半導体素子(3)および絶縁基板(21)を封止し、かつケース部材(6)に接している。接着部材(12)は、ベース部材(1)とケース部材(6)とを固定し、かつ第1面(51)に垂直な方向に見て絶縁基板(21)を取り囲んでいる。ベース部材(1)は、接着部材(12)に接する第3面(53)と、第3面(53)に連なりかつ封止部材(8)に接する第4面(54)と、第2面(52)に対面する第5面(55)を有している。第5面(55)に垂直な方向において、第3面(53)の内側端部(35)は、第5面(55)と異なる高さに位置している。第3面(53)は、第4面(54)に対して傾斜している。
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