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1. WO2021143578 - CLEANING DEVICE

Publication Number WO/2021/143578
Publication Date 22.07.2021
International Application No. PCT/CN2021/070306
International Filing Date 05.01.2021
IPC
H01L 21/67 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
B08B 1/00 2006.1
BPERFORMING OPERATIONS; TRANSPORTING
08CLEANING
BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
1Cleaning by methods involving the use of tools, brushes, or analogous members
B08B 3/02 2006.1
BPERFORMING OPERATIONS; TRANSPORTING
08CLEANING
BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
3Cleaning by methods involving the use or presence of liquid or steam
02Cleaning by the force of jets or sprays
CPC
H01L 21/67046
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
67005Apparatus not specifically provided for elsewhere
67011Apparatus for manufacture or treatment
67017Apparatus for fluid treatment
67028for cleaning followed by drying, rinsing, stripping, blasting or the like
6704for wet cleaning or washing
67046using mainly scrubbing means, e.g. brushes
H01L 21/67051
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
67005Apparatus not specifically provided for elsewhere
67011Apparatus for manufacture or treatment
67017Apparatus for fluid treatment
67028for cleaning followed by drying, rinsing, stripping, blasting or the like
6704for wet cleaning or washing
67051using mainly spraying means, e.g. nozzles
Applicants
  • 北京北方华创微电子装备有限公司 BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD. [CN]/[CN]
Inventors
  • 李相鑫 LI, Xiangxin
  • 吴仪 WU, Yi
Agents
  • 北京天昊联合知识产权代理有限公司 TEE&HOWE INTELLECTUAL PROPERTY ATTORNEYS
Priority Data
202010058439.519.01.2020CN
Publication Language Chinese (ZH)
Filing Language Chinese (ZH)
Designated States
Title
(EN) CLEANING DEVICE
(FR) DISPOSITIF DE NETTOYAGE
(ZH) 清洗装置
Abstract
(EN)
The embodiments of the present application provide a cleaning device. The cleaning device comprises: a base, a first spraying mechanism and a flexible cleaning member; the base is used for bearing a part to be cleaned and can drive said part to rotate, and the outer diameter of the base is smaller than the outer diameter of said part; the first spraying mechanism is movably provided on a side of the base and is used for spraying a cleaning liquid onto the surface of said part when the first spraying mechanism moves to a first position; and the flexible cleaning member is connected to the first spraying mechanism, and is used for flexibly contacting an edge portion of said part when the first spraying mechanism moves to the first position, so as to clean the edge portion of said part. The cleaning device provided in the embodiments of the present application can remove particles and residual contaminants adhered to the edge of a part to be cleaned more completely, and therefore, the cleaning effect can be improved without causing damage to the surface of the part to be cleaned, thereby increasing the yield of the part to be cleaned.
(FR)
Les modes de réalisation de la présente invention concernent un dispositif de nettoyage. Le dispositif de nettoyage comprend : une base, un premier mécanisme de pulvérisation et un élément de nettoyage souple ; la base est utilisée pour supporter une pièce à nettoyer et peut entraîner ladite pièce en rotation, et le diamètre extérieur de la base est inférieur au diamètre extérieur de ladite pièce ; le premier mécanisme de pulvérisation est disposé de façon mobile sur un côté de la base et est utilisé pour pulvériser un liquide de nettoyage sur la surface de ladite partie lorsque le premier mécanisme de pulvérisation se déplace vers une première position ; et l'élément de nettoyage souple est relié au premier mécanisme de pulvérisation, et est utilisé pour entrer en contact souple avec une partie de bord de ladite partie lorsque le premier mécanisme de pulvérisation se déplace vers la première position, de façon à nettoyer la partie de bord de ladite partie. Le dispositif de nettoyage selon les modes de réalisation de la présente invention peut enlever des particules et des contaminants résiduels adhérant au bord d'une pièce à nettoyer plus complètement, et par conséquent, l'effet de nettoyage peut être amélioré sans provoquer d'endommagement de la surface de la pièce à nettoyer, ce qui permet d'augmenter le rendement de la pièce à nettoyer.
(ZH)
本申请实施例提供了一种清洗装置。该清洗装置包括:基座、第一喷淋机构及柔性清洗件,其中,基座用于承载待清洗件,并能够带动待清洗件转动,且基座的外径小于待清洗件的外径;第一喷淋机构可移动地设置于基座的一侧,用于在移动至第一位置时向待清洗件的表面喷淋清洗液体;柔性清洗件与第一喷淋机构连接,用于在第一喷淋机构移动至第一位置时,与待清洗件的边缘部分柔性接触,以对待清洗件的边缘部分进行清洗。本申请实施例提供的清洗装置,可以更彻底地去除待清洗件的边缘附着的颗粒及污染物残留,从而可以提高清洗效果,同时不会对待清洗件表面造成损伤,进而可以提高待清洗件的良率。
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