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1. WO2021066480 - COVERLAY ADHESIVE COMPOSITION AND FPCB COVERLAY INCLUDING SAME

Publication Number WO/2021/066480
Publication Date 08.04.2021
International Application No. PCT/KR2020/013267
International Filing Date 28.09.2020
IPC
C09J 163/00 2006.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
163Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
C09J 121/00 2006.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
121Adhesives based on unspecified rubbers
C09J 201/00 2006.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
201Adhesives based on unspecified macromolecular compounds
C09J 11/00 2006.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
11Features of adhesives not provided for in group C09J9/76
H05K 3/28 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
22Secondary treatment of printed circuits
28Applying non-metallic protective coatings
CPC
C09J 11/00
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
11Features of adhesives not provided for in group C09J9/00, e.g. additives
C09J 121/00
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
121Adhesives based on unspecified rubbers
C09J 163/00
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
163Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
C09J 201/00
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
201Adhesives based on unspecified macromolecular compounds
H05K 3/28
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
22Secondary treatment of printed circuits
28Applying non-metallic protective coatings
Applicants
  • 한화솔루션 주식회사 HANWHA SOLUTIONS CORPORATION [KR]/[KR]
Inventors
  • 김준호 KIM, Jun Ho
  • 조원선 CHO, Won Sun
  • 곽노석 KWAK, Noh Seok
Agents
  • 원대규 WON, Dae Gyu
Priority Data
10-2019-012258802.10.2019KR
10-2019-012258902.10.2019KR
10-2019-012259002.10.2019KR
10-2019-012259302.10.2019KR
10-2019-012259502.10.2019KR
Publication Language Korean (KO)
Filing Language Korean (KO)
Designated States
Title
(EN) COVERLAY ADHESIVE COMPOSITION AND FPCB COVERLAY INCLUDING SAME
(FR) COMPOSITION ADHÉSIVE DE COVERLAY ET COVERLAY DE CARTE DE CIRCUIT IMPRIMÉ SOUPLE LA COMPRENANT
(KO) 커버레이용 접착제 조성물 및 이를 포함하는 FPCB용 커버레이
Abstract
(EN)
The present invention pertains to a coverlay adhesive composition and an FPCB coverlay including same. The coverlay adhesive composition contains an epoxy resin, a rubber resin, a thermoplastic resin, a curing agent, inorganic particles, and a flame retardant. In addition, when manufacturing a novel FPCB through roll lamination, the coverlay adhesive composition can enhance the filling rate by improving flowability, and can prevent the occurrence of lift-off due to fillability and heat during drying.
(FR)
La présente invention concerne une composition adhésive de coverlay et un coverlay de carte de circuit imprimé souple la comprenant. La composition adhésive de coverlay contient une résine époxy, une résine de caoutchouc, une résine thermoplastique, un agent de durcissement, des particules inorganiques et un agent ignifuge. De plus, lors de la fabrication d'une nouvelle carte de circuit imprimé souple par laminage à rouleaux, la composition adhésive de coverlay peut améliorer le taux de remplissage par amélioration de l'aptitude à l'écoulement et peut empêcher l'apparition de décollement dû à l'aptitude au remplissage et à la chaleur pendant le séchage.
(KO)
본 발명은 커버레이용 접착제 조성물 및 이를 포함하는 FPCB용 커버레이에 관한 것으로, 에폭시 수지; 고무 수지; 열가소성 수지; 경화제; 무기입자; 및 난연제를 포함한다. 또한, 롤 라미네이션 공법에 의해 신규 FPCB를 제조할 때, 흐름성을 개선하여 우수한 충진율을 나타낼 수 있고, 충진성 및 열에 의한 건조 시에 들뜸 현상의 발생을 방지할 수 있다.
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