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1. WO2021061480 - CLEAVE SYSTEMS HAVING SPRING MEMBERS FOR CLEAVING A SEMICONDUCTOR STRUCTURE AND METHODS FOR CLEAVING SUCH STRUCTURES

Publication Number WO/2021/061480
Publication Date 01.04.2021
International Application No. PCT/US2020/051180
International Filing Date 17.09.2020
IPC
H01L 21/67 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/683 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
683for supporting or gripping
CPC
B32B 2457/14
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
2457Electrical equipment
14Semiconductor wafers
B32B 38/1858
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
38Ancillary operations in connection with laminating processes
18Handling of layers or the laminate
1858using vacuum
B32B 43/006
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
43Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
006Delaminating
H01L 21/67092
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
67005Apparatus not specifically provided for elsewhere
67011Apparatus for manufacture or treatment
67092Apparatus for mechanical treatment
H01L 21/6838
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
683for supporting or gripping
6838with gripping and holding devices using a vacuum; Bernoulli devices
H01L 21/78
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
77Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
78with subsequent division of the substrate into plural individual devices
Applicants
  • GLOBALWAFERS CO., LTD. [CN]/[CN]
Inventors
  • KAYSER, Justin Scott
Agents
  • SCHUTH, Richard A.
  • VANDER MOLEN, Michael J.
  • KEPPEL, Nicholas A.
  • MUNSELL, Michael G.
  • RASCHE, Patrick W.
  • BLOCK, Zachary J.
  • MUELLER, Jacob R.
  • POLAND, Eric G.
  • BUTLER, Christopher H.
  • ALLEN, Derick E.
  • AMODIO, Lucas M.
  • ATKINS, Bruce T.
  • BRENNAN, Patrick E.
  • BROPHY, Richard L.
  • COYLE, Patrick J.
  • FITZGERALD, Daniel M.
  • FLOREK, Erin M.
  • GOFF, Christopher M.
  • HARPER, James D.
  • HARPER, Jesse S.
  • HEINEN JR., James M.
  • HILMERT, Laura J.
  • LONGMEYER, Michael H.
  • REESER III, Robert B.
  • SNIDER, Josh C.
  • THOMAS, Mark A.
  • WULLER, Adam R.
  • RAYMOND, JR., Donald D.
  • MOLLER-JACOBS, Rose L.
  • VANENGELEN, Catherine E.
  • TRUITT, Tracey S.
  • SCHNEIDERJOHN, Robert L.
  • VANDER TUIG, Marc W.
  • ROSS, Katherine L.
  • BEHM, JR., Edward F.
  • BENNETT, Rachel
  • BRACCIANO, Daniel D.
  • GNIBUS, Michael M.
  • CARWIN, Michael W.
  • MARTINEZ, Alexandra
  • WIERSMA, Zachary
  • KING, Sandra
  • BEULICK, Nicholas P.
  • WINTER, Catherine J.
  • WHITEHEAD, Andrew B.
  • BAUMEL, Carla J.
  • SHARIFF, Michael A.
  • BROOKS, Amelia S.
Priority Data
62/906,86027.09.2019US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) CLEAVE SYSTEMS HAVING SPRING MEMBERS FOR CLEAVING A SEMICONDUCTOR STRUCTURE AND METHODS FOR CLEAVING SUCH STRUCTURES
(FR) SYSTÈMES DE CLIVAGE AYANT DES ÉLÉMENTS DE RESSORT POUR LE CLIVAGE D'UNE STRUCTURE SEMI-CONDUCTRICE ET PROCÉDÉS DE CLIVAGE DE TELLES STRUCTURES
Abstract
(EN)
Cleave systems for cleaving a semiconductor structure are disclosed. The cleave systems may include a cleave arm that is moveable from a starting position to a raised position in which a cleave stress is applied to the semiconductor structure. Spring members store energy as the cleave arm is raised with the stored spring energy causing the structure to cleave into two pieces upon initiation of the cleave across the structure.
(FR)
L'invention concerne également des systèmes de clivage pour le clivage d'une structure semi-conductrice. Les systèmes de clivage peuvent comprendre un bras de clivage qui est mobile d'une position de départ à une position élevée dans laquelle une contrainte de clivage est appliquée à la structure de semi-conducteur. Des éléments de ressort stockent de l'énergie lorsque le bras de clivage est soulevé avec l'énergie de ressort stockée provoquant le clivage de la structure en deux morceaux lors de l'initiation du clivage à travers la structure.
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