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1. WO2021060046 - RESIN COMPOSITION, PREPREG OBTAINED USING SAME, RESIN-COATED FILM, RESIN-COATED METAL FOIL, METAL-CLAD LAMINATE, AND WIRING BOARD

Publication Number WO/2021/060046
Publication Date 01.04.2021
International Application No. PCT/JP2020/034678
International Filing Date 14.09.2020
IPC
C08F 290/06 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
290Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
02on to polymers modified by introduction of unsaturated end groups
06Polymers provided for in subclass C08G52
C08J 5/24 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H142
5Manufacture of articles or shaped materials containing macromolecular substances
24Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
B32B 15/08 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
15Layered products essentially comprising metal
04comprising metal as the main or only constituent of a layer, next to another layer of a specific substance
08of synthetic resin
H05K 1/03 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
03Use of materials for the substrate
CPC
B32B 15/08
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
15Layered products comprising ; a layer of; metal
04comprising metal as the main or only constituent of a layer, ; which is; next to another layer of ; the same or of; a ; different material
08of synthetic resin
C08F 290/06
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
290Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
02on to polymers modified by introduction of unsaturated end groups
06Polymers provided for in subclass C08G
C08J 5/24
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G
5Manufacture of articles or shaped materials containing macromolecular substances
24Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
H05K 1/03
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
03Use of materials for the substrate
Applicants
  • パナソニックIPマネジメント株式会社 PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. [JP]/[JP]
Inventors
  • 梅原 大明 UMEHARA, Hiroaki
  • 松本 匡陽 MATSUMOTO, Masaaki
  • 高橋 龍史 TAKAHASHI, Ryuji
Agents
  • 小谷 昌崇 KOTANI, Masataka
  • 小谷 悦司 KOTANI, Etsuji
  • 宇佐美 綾 USAMI, Aya
Priority Data
2019-17794427.09.2019JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) RESIN COMPOSITION, PREPREG OBTAINED USING SAME, RESIN-COATED FILM, RESIN-COATED METAL FOIL, METAL-CLAD LAMINATE, AND WIRING BOARD
(FR) COMPOSITION DE RÉSINE, PRÉIMPRÉGNÉ OBTENU À L'AIDE DE CELLE-CI, FILM REVÊTU DE RÉSINE, FEUILLE MÉTALLIQUE REVÊTUE DE RÉSINE, STRATIFIÉ REVÊTU DE MÉTAL ET CARTE DE CÂBLAGE
(JA) 樹脂組成物、並びに、それを用いたプリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板及び配線基板
Abstract
(EN)
An aspect of the present invention relates to a resin composition comprising a modified poly(phenylene ether) compound having a carbon-carbon unsaturated double bond at an end of the molecule, a maleimide compound having two or more N-substituted maleimide groups in the molecule, and a liquid styrene/butadiene copolymer having a weight-average molecular weight less than 10,000 and having 1,2-vinyl groups.
(FR)
Un aspect de la présente invention concerne une composition de résine comprenant un poly(phénylène éther) modifié ayant une double liaison insaturée carbone-carbone à une extrémité de la molécule, un composé maléimide ayant deux groupes maléimide N-substitués ou plus dans la molécule, et un copolymère styrène/butadiène liquide ayant un poids moléculaire moyen en poids inférieur à 10 000 et ayant des groupes 1,2-vinyles.
(JA)
本発明の一局面は、分子の末端に炭素-炭素不飽和二重結合を有する変性ポリフェニレンエーテル化合物と、1分子中に2個以上のN-置換マレイミド基を有するマレイミド化合物と、重量平均分子量が10000未満であり、1,2-ビニル基を有する、液状のスチレン-ブタジエンコポリマーとを含む、樹脂組成物に関する。
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