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1. WO2021059937 - DICING DEVICE AND METHOD

Publication Number WO/2021/059937
Publication Date 01.04.2021
International Application No. PCT/JP2020/033741
International Filing Date 07.09.2020
IPC
B24B 27/06 2006.1
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
27Other grinding machines or devices
06Grinders for cutting-off
B24B 47/22 2006.1
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
47Drives or gearings for grinding machines or devices; Equipment therefor
22Equipment for exact control of the position of the grinding tool or work at the start of the grinding operation
B24B 49/12 2006.1
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
49Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
12involving optical means
H01L 21/677 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
677for conveying, e.g. between different work stations
H01L 21/301 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18the devices having semiconductor bodies comprising elements of group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
301to subdivide a semiconductor body into separate parts, e.g. making partitions
CPC
B24B 27/06
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
27Other grinding machines or devices
06Grinders for cutting-off
B24B 47/22
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
47Drives or gearings; Equipment therefor
22Equipment for exact control of the position of the grinding tool or work at the start of the grinding operation
B24B 49/12
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
49Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
12involving optical means
H01L 21/677
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
677for conveying, e.g. between different workstations
Applicants
  • 株式会社東京精密 TOKYO SEIMITSU CO., LTD. [JP]/[JP]
Inventors
  • 武田 邦義 TAKEDA, Kuniyoshi
  • 對馬 健夫 TSUSHIMA, Takeo
  • 深谷 浩則 FUKAYA, Hironori
  • 新井 裕介 ARAI, Yusuke
  • 清水 翼 SHIMIZU, Tasuku
Agents
  • 松浦 憲三 MATSUURA, Kenzo
Priority Data
2019-17726527.09.2019JP
2020-09065725.05.2020JP
2020-14902804.09.2020JP
Publication Language Japanese (ja)
Filing Language Japanese (JA)
Designated States
Title
(EN) DICING DEVICE AND METHOD
(FR) DISPOSITIF ET PROCÉDÉ DE DÉCOUPAGE EN DÉS
(JA) ダイシング装置及び方法
Abstract
(EN) Provided are: a dicing device and method capable of preventing interference between a blade and a jig when performing dicing processing and also capable of securing throughput. The dicing method comprises: a form measurement step for measuring a form of a work (W); an alignment step of acquiring measurement results of the form of the work, and performing, on the basis of the acquired measurement result, alignment between the work and the jig such that a line (CT1) that follows an intended dividing line (CL1) of the work and that has a breadth corresponding to a blade width of a blade (32) for performing dicing processing of the work, fits within a jig groove (G1) of a jig (J1); and a step of adsorption holding of the work with a jig and for performing dicing processing of the work along the intended dividing line.
(FR) L'invention concerne : un dispositif et un procédé de découpage en dés permettant d'empêcher des interférences entre une lame et un gabarit lors de la réalisation d'un traitement de découpage en dés et également aptes à sécuriser un débit. Le procédé de découpage en dés comprend : une étape de mesure de forme pour mesurer une forme d'une pièce (W) ; une étape d'alignement consistant à acquérir des résultats de mesure de la forme de la pièce et à effectuer, sur la base du résultat de mesure acquis, un alignement entre la pièce et le gabarit, de sorte qu'une ligne (CT1) qui suit une ligne de division prévue (CL1) de la pièce et qui a une largeur correspondant à une largeur de lame d'une lame (32) pour effectuer un traitement de découpage en dés de la pièce, s'adapte à l'intérieur d'une rainure de gabarit (G1) d'un gabarit (J1) ; et une étape de maintien par adsorption de la pièce avec un gabarit et de réalisation d'un traitement de découpage en dés de la pièce le long de la ligne de division prévue.
(JA) ダイシング加工時におけるブレードと治具との干渉を防止することが可能であり、かつ、スループットを確保することが可能なダイシング装置及び方法を提供する。ダイシング方法は、ワーク(W)の形状を測定する形状測定ステップと、ワークの形状の測定結果を取得し、取得した測定結果に基づいて、ワークの分割予定ライン(CL1)に沿うライン(CT1)であって、ワークのダイシング加工を行うためのブレード(32)の刃厚に対応する太さのラインが治具(J1)の治具溝(G1)に収まるように、ワークと治具とのアライメントを行うアライメントステップと、ワークを治具により吸着保持して、ワークに対して分割予定ラインに沿ってダイシング加工を行うステップとを含む。
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