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1. WO2021057322 - LAMINATED CIRCUIT BOARD MADE BY STACKING WAVY LED LAMP STRIP CIRCUIT BOARD AND METAL CIRCUIT BOARD, AND MANUFACTURING METHOD

Publication Number WO/2021/057322
Publication Date 01.04.2021
International Application No. PCT/CN2020/109154
International Filing Date 14.08.2020
IPC
F21S 4/24 2016.01
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
21LIGHTING
SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
4Lighting devices or systems using a string or strip of light sources
20with light sources held by or within elongate supports
22flexible or deformable, e.g. into a curved shape
24of ribbon or tape form, e.g. LED tapes
H05K 3/00 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
CPC
F21S 4/24
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
21LIGHTING
SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
4Lighting devices or systems using a string or strip of light sources
20with light sources held by or within elongate supports
22flexible or deformable, e.g. into a curved shape
24of ribbon or tape form, e.g. LED tapes
H05K 1/02
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
H05K 1/11
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
11Printed elements for providing electric connections to or between printed circuits
H05K 3/00
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
H05K 3/34
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
30Assembling printed circuits with electric components, e.g. with resistor
32electrically connecting electric components or wires to printed circuits
34by soldering
H05K 3/46
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
46Manufacturing multilayer circuits
Applicants
  • 王定锋 WANG, Dingfeng [CN]/[CN]
Inventors
  • 王定锋 WANG, Dingfeng
  • 徐文红 XU, Wenhong
  • 冉崇友 RAN, Chongyou
  • 徐磊 XU, Lei
  • 琚生涛 JU, Shengtao
Agents
  • 广东嘉贤律师事务所 EASWAYER LAW FIRM
Priority Data
201910960779.427.09.2019CN
Publication Language Chinese (ZH)
Filing Language Chinese (ZH)
Designated States
Title
(EN) LAMINATED CIRCUIT BOARD MADE BY STACKING WAVY LED LAMP STRIP CIRCUIT BOARD AND METAL CIRCUIT BOARD, AND MANUFACTURING METHOD
(FR) CARTE DE CIRCUIT IMPRIMÉ STRATIFIÉE FABRIQUÉE PAR EMPILEMENT D'UNE CARTE DE CIRCUIT IMPRIMÉ DE LAMPE À DEL ONDULÉE ET D'UNE CARTE DE CIRCUIT IMPRIMÉ MÉTALLIQUE, ET PROCÉDÉ DE FABRICATION
(ZH) 波浪状的LED灯带线路板叠加金属线路板制成的叠层线路板及制作方法
Abstract
(EN)
The present invention relates to a laminated circuit board made by stacking a wavy LED lamp strip circuit board and a metal circuit board, and a manufacturing method. Said method specifically comprises after a single-layer or double-layer circuit board is made into a wavy circuit board, applying same to a metal single-sided board by means of an adhesive to form a wavy double-layer circuit board or a three-layer circuit board in a partial area, so as to form a wavy circuit board as well as a layered circuit board with a discontinuous bonding and discontinuous layered structure. Such a circuit board is used for manufacturing an LED lamp strip and is not easy to break when bending.
(FR)
La présente invention concerne une carte de circuit imprimé stratifiée fabriquée par empilement d'une carte de circuit imprimé de lampe à DEL ondulée et d'une carte de circuit imprimé métallique, et un procédé de fabrication. Ledit procédé comprend spécifiquement, après qu'une carte de circuit imprimé monocouche ou double couche est réalisée sous la forme d'une carte de circuit imprimé ondulée, l'application de celle-ci sur une carte à simple face métallique au moyen d'un adhésif pour former une carte de circuit imprimé à double couche ondulée ou une carte de circuit imprimé à triple couche dans une zone partielle, de manière à former une carte de circuit imprimé ondulée ainsi qu'une carte de circuit imprimé en couches ayant une liaison discontinue et une structure en couches discontinue. Une telle carte de circuit imprimé est utilisée pour fabriquer une bande de lampe à DEL et n'est pas facile à casser lors du pliage.
(ZH)
本发明涉及波浪状的LED灯带线路板叠加金属线路板制成的叠层线路板及制作方法,具体而言,将单层或者双层线路板制成波浪状线路板后,用胶粘剂粘贴在一金属单面板上,形成部分区域分成的波浪状的双层线路板或三层线路板,形成既是波浪状的线路板,又是间断粘合,间断分层结构的分层线路板,这种线路板制作LED灯带,弯折使用时不易折断。
Also published as
Latest bibliographic data on file with the International Bureau