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1. WO2021056722 - CONDUCTIVE FILM AND PREPARATION METHOD THEREFOR

Publication Number WO/2021/056722
Publication Date 01.04.2021
International Application No. PCT/CN2019/117129
International Filing Date 11.11.2019
IPC
H01B 13/00 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
13Apparatus or processes specially adapted for manufacturing conductors or cables
H01B 5/14 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
5Non-insulated conductors or conductive bodies characterised by their form
14comprising conductive layers or films on insulating-supports
G06F 3/041 2006.01
GPHYSICS
06COMPUTING; CALCULATING OR COUNTING
FELECTRIC DIGITAL DATA PROCESSING
3Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
01Input arrangements or combined input and output arrangements for interaction between user and computer
03Arrangements for converting the position or the displacement of a member into a coded form
041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
CPC
G06F 3/041
GPHYSICS
06COMPUTING; CALCULATING; COUNTING
FELECTRIC DIGITAL DATA PROCESSING
3Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
01Input arrangements or combined input and output arrangements for interaction between user and computer
03Arrangements for converting the position or the displacement of a member into a coded form
041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
H01B 13/00
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
13Apparatus or processes specially adapted for manufacturing conductors or cables
H01B 5/14
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
5Non-insulated conductors or conductive bodies characterised by their form
14comprising conductive layers or films on insulating-supports
Applicants
  • 苏州维业达触控科技有限公司 IVTOUCH CO., LTD [CN]/[CN]
Inventors
  • 基亮亮 JI, Liangliang
  • 周小红 ZHOU, Xiaohong
Agents
  • 苏州谨和知识产权代理事务所(特殊普通合伙) SUZHOU JINHE INTELLECTUAL PROPERTY AGENCY (SPECIAL GENERAL PARTNERSHIP)
Priority Data
201910907779.824.09.2019CN
Publication Language Chinese (ZH)
Filing Language Chinese (ZH)
Designated States
Title
(EN) CONDUCTIVE FILM AND PREPARATION METHOD THEREFOR
(FR) FILM CONDUCTEUR TRANSPARENT ET PROCÉDÉ DE PRÉPARATION ASSOCIÉ
(ZH) 导电膜及其制作方法
Abstract
(EN)
A preparation method for a conductive film, comprising: coating a layer of curing adhesive on a substrate (1) to form a curing adhesive layer (2) (S1); providing a mold (5) having a protrusion (51) (S2); transferring the liquid at a seed layer onto the protrusion (51) (S3); stamping the curing adhesive layer (2) using the mold (5) (S4); curing to form a pattern groove (21) and forming a seed layer (3) below the bottom of the pattern groove (21) (S5); demolding (S6); and preparing a conductive layer (4) in the pattern groove (21) (S7). Also disclosed is a conductive film, comprising: a substrate (1), a curing adhesive layer (2) provided on the surface of the substrate (1) and having a pattern groove (21), a seed layer (3), and a conductive layer (4). The conductive layer (4) is provided in the pattern groove (21). The seed layer (3) is provided below the bottom of the pattern groove (21) before the curing adhesive layer (2) is formed. By transferring the liquid at the seed layer onto the protrusion (51), forming the pattern groove (21) on the curing adhesive layer (2), and forming the seed layer (3) below the bottom of the pattern groove (21), the conductive layer (4) prepared in the pattern groove (21) has lower resistance than a conductive layer prepared by scrape coating, and thus the conductivity of the conductive film is better.
(FR)
La présente invention concerne un procédé de préparation d'un film conducteur comprenant : le revêtement d'une couche d'adhésif de durcissement sur un substrat (1) pour former une couche d'adhésif de durcissement (2) (S1) ; la fourniture d'un moule (5) présentant une saillie (51) (S2) ; le transfert du liquide au niveau d'une couche d'ensemencement sur la saillie (51) (S3) ; l'estampage de la couche d'adhésif de durcissement (2) au moyen du moule (5) (S4) ; le durcissement pour former une rainure de motif (21) et la formation d'une couche d'ensemencement (3) au-dessous du fond de la rainure de motif (21) (S5) ; le démoulage (S6) ; et la préparation d'une couche conductrice (4) dans la rainure de motif (21) (S7). L'invention concerne également un film conducteur comprenant : un substrat (1), une couche d'adhésif de durcissement (2) disposée sur la surface du substrat (1) et présentant une rainure de motif (21), une couche d'ensemencement (3) et une couche conductrice (4). La couche conductrice (4) est disposée dans la rainure de motif (21). La couche d'ensemencement (3) est disposée au-dessous du fond de la rainure de motif (21) avant que la couche d'adhésif de durcissement (2) ne soit formée. En transférant le liquide au niveau de la couche d'ensemencement sur la saillie (51), en formant la rainure de motif (21) sur la couche d'adhésif de durcissement (2) et en formant la couche d'ensemencement (3) au-dessous du fond de la rainure de motif (21), la couche conductrice (4) préparée dans la rainure de motif (21) présente une résistance inférieure à celle d'une couche conductrice préparée par un revêtement par raclage, et ainsi la conductivité du film conducteur est meilleure.
(ZH)
一种导电膜的制作方法,包括:在衬底(1)上涂布一层固化胶,形成固化胶层(2)(S1);提供一具有凸起(51)的模具(5)(S2);将种子层液体转移到凸起(51)上(S3);利用模具(5)压印固化胶层(2)(S4);固化,形成图形凹槽(21),以及在图形凹槽(21)底部的下方形成种子层(3)(S5);脱模(S6);在图形凹槽(21)内制备导电层(4)(S7)。还公开了一种导电膜,包括衬底(1)、设置在衬底(1)表面具有图形凹槽(21)的固化胶层(2),以及种子层(3)和导电层(4),导电层(4)设置在图形凹槽(21)内,种子层(3)设置在图形凹槽(21)底部的下方,种子层(3)在固化胶层(2)形成前设置在图形凹槽(21)底部的下方。通过将种子层液体转移到凸起(51)上,在固化胶层(2)上形成图形凹槽(21),以及在图形凹槽(21)底部下方形成种子层(3),从而使得在图形凹槽(21)内制备的导电层(4)相对于刮涂制备的导电层电阻更低,进而使得导电膜的导电性能更佳。
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