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1. WO2021056704 - INTEGRATED FLEXIBLE SUBSTRATE WITH GOOD STRETCHABILITY, FLEXIBLE CIRCUIT, AND METHOD FOR MANUFACTURING SAME

Publication Number WO/2021/056704
Publication Date 01.04.2021
International Application No. PCT/CN2019/116446
International Filing Date 08.11.2019
IPC
H01L 23/14 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
12Mountings, e.g. non-detachable insulating substrates
14characterised by the material or its electrical properties
H01L 21/56 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
56Encapsulations, e.g. encapsulating layers, coatings
H01L 21/48 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
48Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/06-H01L21/326201
CPC
H01L 21/4803
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
48Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
4803Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
H01L 21/56
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, ; e.g. sealing of a cap to a base of a container
56Encapsulations, e.g. encapsulation layers, coatings
H01L 23/145
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
12Mountings, e.g. non-detachable insulating substrates
14characterised by the material or its electrical properties
145Organic substrates, e.g. plastic
Applicants
  • 清华大学 TSINGHUA UNIVERSITY [CN]/[CN]
Inventors
  • 刘冉 LIU, Ran
  • 林荣赞 LIN, Rongzan
Agents
  • 北京鸿元知识产权代理有限公司 GRANDER IP LAW FIRM
Priority Data
201910932694.529.09.2019CN
Publication Language Chinese (ZH)
Filing Language Chinese (ZH)
Designated States
Title
(EN) INTEGRATED FLEXIBLE SUBSTRATE WITH GOOD STRETCHABILITY, FLEXIBLE CIRCUIT, AND METHOD FOR MANUFACTURING SAME
(FR) SUBSTRAT FLEXIBLE INTÉGRÉ PRÉSENTANT UNE APTITUDE À L'ÉTIRAGE SATISFAISANTE, CIRCUIT FLEXIBLE, ET PROCÉDÉ DE FABRICATION ASSOCIÉ
(ZH) 具有大拉伸性的一体化柔性基底与柔性电路及其制造方法
Abstract
(EN)
Disclosed are an integrated flexible substrate with good stretchability, a flexible circuit, and a method for manufacturing same, wherein same fall within the technical field of flexible electronics. An integrated flexible substrate made of various materials having different elasticity moduli is manufactured; a rigid element is then placed on the substrate in a high-elasticity-modulus region (101), and a flexible element is placed on the substrate in a low-elasticity-modulus region (102); and same are then encapsulated, such that a flexible circuit is obtained. A strain isolation effect can be achieved, and a requirement for protecting a rigid element can be satisfied, thereby improving the stability and reliability of the whole device and realizing the flexibility and stretchability of a flexible circuit.
(FR)
L'invention se rapporte au domaine technique de l'électronique flexible, et concerne un substrat flexible intégré présentant une aptitude à l'étirage satisfaisante, un circuit flexible, et un procédé de fabrication associé. Un substrat flexible intégré constitué de divers matériaux ayant des modules d'élasticité différents est fabriqué ; un élément rigide est ensuite placé sur le substrat dans une région à module d'élasticité élevé (101), et un élément flexible est placé sur le substrat dans une région à faible module d'élasticité (102) ; et ledit substrat est ensuite encapsulé, de telle sorte qu'un circuit flexible est obtenu. Un effet d'isolation de tension peut être obtenu, et une exigence de protection d'un élément rigide peut être satisfaite, ce qui permet d'améliorer la stabilité et la fiabilité de l'ensemble du dispositif, et d'obtenir la flexibilité et l'extensibilité d'un circuit flexible.
(ZH)
具有大拉伸性的一体化柔性基底与柔性电路及其制造方法,属于柔性电子技术领域。通过制备由多种具有不同弹性模量的材料组成的一体化柔性基底,然后将刚性元件置于高弹性模量区域(101)的基底上,将柔性元件置于低弹性模量区域(102)的基底上,再对其封装,得到柔性电路。可以达到应变隔离的效果,满足对刚性元件保护的要求,提高了整体器件的稳定性和可靠性,实现柔性电路的柔性和拉伸性。
Also published as
Latest bibliographic data on file with the International Bureau