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1. WO2021045069 - LOAD LOCK DEVICE

Publication Number WO/2021/045069
Publication Date 11.03.2021
International Application No. PCT/JP2020/033160
International Filing Date 02.09.2020
IPC
H01L 21/02 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
H01L 21/3065 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18the devices having semiconductor bodies comprising elements of group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
302to change the physical characteristics of their surfaces, or to change their shape, e.g. etching, polishing, cutting
306Chemical or electrical treatment, e.g. electrolytic etching
3065Plasma etching; Reactive-ion etching
H01L 21/677 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
677for conveying, e.g. between different work stations
CPC
H01L 21/02
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
H01L 21/3065
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
18the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
302to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
306Chemical or electrical treatment, e.g. electrolytic etching
3065Plasma etching; Reactive-ion etching
H01L 21/677
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
677for conveying, e.g. between different workstations
Applicants
  • キヤノンアネルバ株式会社 CANON ANELVA CORPORATION [JP]/[JP]
Inventors
  • 三浦 順 MIURA, Jun
  • 福田 直哉 FUKUDA, Naoya
  • 熊谷 修二 KUMAGAI, Shuji
  • 高城 信二 TAKAGI, Shinji
  • 戸田 哲郎 TODA, Tetsuro
  • 下川 英利 SHIMOKAWA, Hidetoshi
  • 根岸 智 NEGISHI, Satoshi
  • 野村 聡志 NOMURA, Satoshi
  • 添田 純也 SOEDA, Junya
Agents
  • 大塚 康徳 OHTSUKA, Yasunori
  • 大塚 康弘 OHTSUKA, Yasuhiro
  • 高柳 司郎 TAKAYANAGI, Jiro
  • 木村 秀二 KIMURA, Shuji
  • 下山 治 SIMOYAMA, Osamu
  • 永川 行光 EIKAWA, Yukimitsu
Priority Data
PCT/JP2019/03524706.09.2019JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) LOAD LOCK DEVICE
(FR) DISPOSITIF DE VERROU DE CHARGE
(JA) ロードロック装置
Abstract
(EN)
This load lock device comprises: a load lock chamber that has a first transport port connected to a transfer chamber connected to a decompression processing device and a second transport port connected to a loader chamber; a substrate holder that holds a substrate in the load lock chamber; a drive mechanism that is disposed below the load lock chamber to raise and lower the substrate holder and is connected to the substrate holder via a connection member; an extension chamber that extends laterally from a lower portion of the load lock chamber; and a pump that is located below the extension chamber and discharges gas from the load lock chamber through the extension chamber. The extension chamber has a bottom surface having an opening at a position deviated from vertically below the substrate holder, and the pump is connected to the opening.
(FR)
La présente invention concerne un dispositif de verrou de charge qui comprend : une chambre de verrou de charge qui a un premier port de transport connecté à une chambre de transfert connectée à un dispositif de traitement de décompression et un deuxième port de transport connecté à une chambre de chargeur; un support de substrat qui supporte un substrat dans la chambre de verrou de charge; un mécanisme d'entraînement qui est disposé sous la chambre de verrou de charge pour élever et abaisser le support de substrat et qui est connecté au support de substrat par le biais d'un organe de connexion; une chambre d'extension qui s'étend latéralement depuis une partie inférieure de la chambre de verrou de charge; et une pompe qui est située sous la chambre d'extension et qui décharge du gaz depuis la chambre de verrou de charge à travers la chambre d'extension. La chambre d'extension a une surface inférieure ayant une ouverture à une position déviée par rapport à une position verticalement sous le support de substrat, et la pompe est connectée à l'ouverture.
(JA)
ロードロック装置は、減圧処理装置と接続されるトランスファー室と接続する第1搬送口、および、ローダー室と接続する第2搬送口とを有するロードロック室と、前記ロードロック室の中で基板を保持する基板ホルダと、前記基板ホルダを昇降させるように前記ロードロック室の下方に配置され、連結部材を介して前記基板ホルダに連結された駆動機構と、前記ロードロック室の下部から側方に延長された延長室と、前記延長室の下方に配置され前記延長室を介して前記ロードロック室のガスを排出するポンプとを備える。前記延長室は、前記基板ホルダの鉛直下方からずれた位置に開口を有する底面を有し、前記開口に前記ポンプが接続されている。
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