Processing

Please wait...

Settings

Settings

Goto Application

1. WO2021043687 - SURFACE HARMONIZATION FOR EMBEDDED FUNCTIONAL LAYERS

Publication Number WO/2021/043687
Publication Date 11.03.2021
International Application No. PCT/EP2020/074136
International Filing Date 28.08.2020
IPC
A41D 19/015 2006.01
AHUMAN NECESSITIES
41WEARING APPAREL
DOUTERWEAR; PROTECTIVE GARMENTS; ACCESSORIES
19Gloves
015Protective gloves
H05K 1/03 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
03Use of materials for the substrate
CPC
A41D 19/0006
AHUMAN NECESSITIES
41WEARING APPAREL
DOUTERWEAR; PROTECTIVE GARMENTS; ACCESSORIES
19Gloves
0006made of several layers of material
A41D 19/0065
AHUMAN NECESSITIES
41WEARING APPAREL
DOUTERWEAR; PROTECTIVE GARMENTS; ACCESSORIES
19Gloves
0055Plastic or rubber gloves
0058Three-dimensional gloves
0065with a textile layer underneath
A41D 19/01535
AHUMAN NECESSITIES
41WEARING APPAREL
DOUTERWEAR; PROTECTIVE GARMENTS; ACCESSORIES
19Gloves
015Protective gloves
01529with thermal or fire protection
01535Heated gloves
H05K 1/038
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
03Use of materials for the substrate
038Textiles
H05K 1/189
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
18Printed circuits structurally associated with non-printed electric components
189characterised by the use of a flexible or folded printed circuit
H05K 2201/10151
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
10Details of components or other objects attached to or integrated in a printed circuit board
10007Types of components
10151Sensor
Applicants
  • UVEX SAFETY GLOVES GMBH & CO. KG [DE]/[DE]
Inventors
  • BURGHART, Markus
  • KESTING, Wolfgang
  • BARTUSCH, Matthias
Agents
  • HAUCK PATENTANWALTSPARTNERSCHAFT MBB
Priority Data
10 2019 123 664.904.09.2019DE
Publication Language German (DE)
Filing Language German (DE)
Designated States
Title
(DE) OBERFLÄCHENHARMONISIERUNG FÜR EINGEBETTETE FUNKTIONSSCHICHTEN
(EN) SURFACE HARMONIZATION FOR EMBEDDED FUNCTIONAL LAYERS
(FR) HARMONISATION DE SURFACE POUR COUCHES FONCTIONNELLES INTÉGRÉES
Abstract
(DE)
Die Erfindung betrifft ein mehrschichtiges Material mit einem textilen Substrat, einer Funktionsschicht, einer Beschichtung und einer textilen Deckschicht, welche zwischen Funktionsschicht und Beschichtung angeordnet ist. Die Haftung der Beschichtung in dem Bereich der Funktionsschicht wird dadurch verbessert, dass zwischen der Funktionsschicht und der Beschichtung eine textile Deckschicht angeordnet ist. Die Haftung der Beschichtung auf der textilen Deckschicht entspricht der Haftung auf dem textilen Substrat.
(EN)
The invention relates to a multilayer material with a textile substrate, a functional layer, a coating, and a textile cover layer which is arranged between the functional layer and the coating. The adhesion of the coating in the region of the functional layer is improved by arranging a textile cover layer between the functional layer and the coating. The adhesion of the coating to the textile cover layer corresponds to the adhesion to the textile substrate.
(FR)
L'invention concerne un matériau multicouche comprenant un substrat textile, une couche fonctionnelle, un revêtement et une couche de revêtement textile disposée entre la couche fonctionnelle et le revêtement. L'adhérence du revêtement dans la région de la couche fonctionnelle est améliorée par l'agencement d'une couche de revêtement textile entre la couche fonctionnelle et le revêtement. L'adhérence du revêtement sur la couche de revêtement textile correspond à l'adhérence au substrat textile.
Also published as
Latest bibliographic data on file with the International Bureau