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1. WO2021042606 - ARRAY SUBSTRATE AND DISPLAY PANEL

Publication Number WO/2021/042606
Publication Date 11.03.2021
International Application No. PCT/CN2019/123226
International Filing Date 05.12.2019
IPC
H01L 27/12 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
02including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
12the substrate being other than a semiconductor body, e.g. an insulating body
CPC
H01L 27/124
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
02including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
12the substrate being other than a semiconductor body, e.g. an insulating body
1214comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
124with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
H01L 27/1248
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
02including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
12the substrate being other than a semiconductor body, e.g. an insulating body
1214comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
1248with a particular composition or shape of the interlayer dielectric specially adapted to the circuit arrangement
H01L 27/3258
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
28including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
32with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes [OLED]
3241Matrix-type displays
3244Active matrix displays
3258Insulating layers formed between TFT elements and OLED elements
Applicants
  • 武汉华星光电半导体显示技术有限公司 WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. [CN]/[CN]
Inventors
  • 龚吉祥 GONG, Jixiang
Agents
  • 深圳紫藤知识产权代理有限公司 PURPLEVINE INTELLECTUAL PROPERTY (SHENZHEN) CO., LTD
Priority Data
201910826546.503.09.2019CN
Publication Language Chinese (ZH)
Filing Language Chinese (ZH)
Designated States
Title
(EN) ARRAY SUBSTRATE AND DISPLAY PANEL
(FR) SUBSTRAT DE RÉSEAU ET PANNEAU D'AFFICHAGE
(ZH) 阵列基板和显示面板
Abstract
(EN)
An array substrate (200) and a display panel. The array substrate (200) comprises a second interlayer dielectric layer (210) and a passivation layer (241), wherein the material of the passivation layer (241) is an inorganic material, and the second interlayer dielectric layer (210) is made of an organic material; in addition, the array substrate (200) has a first deep hole (231) and a second deep hole (232); and the first deep hole (231) and the second deep hole (232) are filled with the second interlayer dielectric layer (210).
(FR)
L'invention concerne un substrat de réseau (200) et un panneau d'affichage. Le substrat de réseau (200) comprend une seconde couche diélectrique intercouche (210) et une couche de passivation (241), le matériau de la couche de passivation (241) étant un matériau inorganique, et la seconde couche diélectrique intercouche (210) étant constituée d'un matériau organique ; en outre, le substrat de réseau (200) présente un premier trou profond (231) et un second trou profond (232) ; et le premier trou profond (231) et le second trou profond (232) sont remplis avec la seconde couche diélectrique intercouche (210).
(ZH)
一种阵列基板(200)和显示面板,所述阵列基板(200)包括第二层间介电层(210)以及钝化层(241),其中所述钝化层(241)材料为无机材料,所述第二层间介电层(210)为有机材料;此外,所述阵列基板(200)具有第一深孔(231)和第二深孔(232),并且在第一深孔(231)和第二深孔(232)中填充第二层间介电层(210)。
Also published as
Latest bibliographic data on file with the International Bureau