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1. WO2021040289 - FLEXIBLE METAL LAMINATE, COVERLAY FILM, AND FLEXIBLE METAL COMPOSITE SUBSTRATE COMPRISING SAME

Publication Number WO/2021/040289
Publication Date 04.03.2021
International Application No. PCT/KR2020/010761
International Filing Date 13.08.2020
IPC
B32B 15/08 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
15Layered products essentially comprising metal
04comprising metal as the main or only constituent of a layer, next to another layer of a specific substance
08of synthetic resin
B32B 15/20 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
15Layered products essentially comprising metal
20comprising aluminium or copper
B32B 7/12 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
7Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
04Interconnection of layers
12using interposed adhesives or interposed materials with bonding properties
B32B 7/025 2019.01
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
7Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
02Physical, chemical or physicochemical properties
025Electric or magnetic properties
H05K 1/05 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
03Use of materials for the substrate
05Insulated metal substrate
CPC
B32B 15/08
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
15Layered products comprising ; a layer of; metal
04comprising metal as the main or only constituent of a layer, ; which is; next to another layer of ; the same or of; a ; different material
08of synthetic resin
B32B 15/20
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
15Layered products comprising ; a layer of; metal
20comprising aluminium or copper
B32B 7/025
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
7Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
02Physical, chemical or physicochemical properties
025Electric or magnetic properties
B32B 7/12
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
7Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
04Interconnection of layers
12using interposed adhesives or interposed materials with bonding properties
H05K 1/05
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
03Use of materials for the substrate
05Insulated ; conductive substrates, e.g. insulated; metal substrate
Applicants
  • 주식회사 두산 DOOSAN CORPORATION [KR]/[KR]
Inventors
  • 정윤호 JUNG, Yoonho
  • 이상환 LEE, Sanghwan
  • 백은송 BAIK, Eunsong
  • 박혜진 PARK, Hyejin
  • 양우진 YANG, Woojin
  • 한빈 HAN, Bin
  • 임태극 LIM, Taegeuk
Agents
  • 특허법인 위더피플 WETHEPEOPLE IP & LAW FIRM
Priority Data
10-2019-010539327.08.2019KR
10-2019-010539427.08.2019KR
10-2019-010800402.09.2019KR
10-2019-010803102.09.2019KR
Publication Language Korean (KO)
Filing Language Korean (KO)
Designated States
Title
(EN) FLEXIBLE METAL LAMINATE, COVERLAY FILM, AND FLEXIBLE METAL COMPOSITE SUBSTRATE COMPRISING SAME
(FR) STRATIFIÉ MÉTALLIQUE SOUPLE, FILM DE REVÊTEMENT ET SUBSTRAT COMPOSITE MÉTALLIQUE SOUPLE LE COMPRENANT
(KO) 연성 금속 적층판, 커버레이 필름, 이를 구비하는 연성 금속복합기판
Abstract
(EN)
The present invention can provide: a flexible metal laminate comprising a thermoplastic polymer film having a melting point (Tm) or a melting point of 300℃ or lower, or a multi-component alloy having two-component system or greater; a coverlay film comprising the thermoplastic polymer film having a predetermined melting point; or a flexible metal composite substrate comprising same.
(FR)
La présente invention peut fournir : un stratifié métallique souple comprenant un film polymère thermoplastique ayant un point de fusion (Tm) ou un point de fusion de 300°C ou moins, ou un alliage à composants multiples ayant un système à deux composants ou plus; un film de revêtement comprenant le film de polymère thermoplastique ayant un point de fusion prédéterminé; ou un substrat composite métallique souple le comprenant.
(KO)
본 발명은 융점(Tm)이 있거나 300℃ 이하인 열가소성 고분자 필름, 또는 2원계 이상의 다원계 합금을 구비하는 연성 금속 적층판, 상기 소정 융점을 갖는 열가소성 고분자 필름을 포함하는 커버레이 필름, 또는 이를 구비하는 연성 금속 복합기판을 제공할 수 있다.
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