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1. WO2021039514 - EXPOSURE HEAD AND IMAGE FORMING DEVICE

Publication Number WO/2021/039514
Publication Date 04.03.2021
International Application No. PCT/JP2020/031195
International Filing Date 19.08.2020
IPC
B41J 2/447 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
2Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
435characterised by selective application of radiation to a printing material or impression-transfer material
447using arrays of radiation sources
B41J 2/45 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
2Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
435characterised by selective application of radiation to a printing material or impression-transfer material
447using arrays of radiation sources
45using light-emitting diode arrays
G03G 15/04 2006.01
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
GELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
15Apparatus for electrographic processes using a charge pattern
04for exposing, i.e. imagewise exposure by optically projecting the original image on a photoconductive recording material
H01L 33/00 2010.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
H04N 1/036 2006.01
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
NPICTORIAL COMMUNICATION, e.g. TELEVISION
1Scanning, transmission or reproduction of documents or the like, e.g. facsimile transmission; Details thereof
024Details of scanning heads
032for picture-information reproduction
036for optical reproduction
CPC
B41J 2/447
BPERFORMING OPERATIONS; TRANSPORTING
41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, ; e.g. INK-JET PRINTERS, THERMAL PRINTERS; , i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
2Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
435characterised by selective application of radiation to a printing material or impression-transfer material
447using arrays of radiation sources
B41J 2/45
BPERFORMING OPERATIONS; TRANSPORTING
41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, ; e.g. INK-JET PRINTERS, THERMAL PRINTERS; , i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
2Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
435characterised by selective application of radiation to a printing material or impression-transfer material
447using arrays of radiation sources
45using light-emitting diode ; [LED] or laser; arrays
G03G 15/04
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
GELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
15Apparatus for electrographic processes using a charge pattern
04for exposing, i.e. imagewise exposure by optically projecting the original image on a photoconductive recording material
H01L 33/00
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
H01L 33/08
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
02characterised by the semiconductor bodies
08with a plurality of light emitting regions, e.g. laterally discontinuous light emitting layer or photoluminescent region integrated within the semiconductor body
H04N 1/036
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
NPICTORIAL COMMUNICATION, e.g. TELEVISION
1Scanning, transmission or reproduction of documents or the like, e.g. facsimile transmission; Details thereof
024Details of scanning heads ; ; Means for illuminating the original
032for picture information reproduction
036for optical reproduction
Applicants
  • キヤノン株式会社 CANON KABUSHIKI KAISHA [JP]/[JP]
Inventors
  • 鎌田 祐介 KAMATA Yusuke
Agents
  • 岡部 讓 OKABE Yuzuru
  • 越智 隆夫 OCHI Takao
Priority Data
2019-15294723.08.2019JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) EXPOSURE HEAD AND IMAGE FORMING DEVICE
(FR) TÊTE D'EXPOSITION ET DISPOSITIF DE FORMATION D'IMAGE
(JA) 露光ヘッド及び画像形成装置
Abstract
(EN)
This exposure head 106 is provided with: a printed board 202; a plurality of light-emitting element array chips 400; and an adhesive 701 for fixing, to the printed board, the plurality of light-emitting element array chips provided with a plurality of light-emitting parts 602 and wire bonding pads 408, in a zigzag shape in a longitudinal direction LD, wherein one end section of a first light-emitting element array chip overlaps one end of a second light-emitting element array chip adjacent thereto when viewed in the width direction WD perpendicular to the longitudinal direction, the other end section of the second light-emitting element array chip overlaps one end of a third light-emitting element array chip adjacent thereto when viewed in the width direction, and an adhesive for fixing the second light-emitting element array chip to the printed board is applied to a region between the one end section of the first light-emitting element array chip and the one end section of the third light-emitting element array chip.
(FR)
L'invention concerne une tête d'exposition (106) pourvue : d'une carte imprimée (202) ; d'une pluralité de puces de réseau d'éléments électroluminescents (400) ; et d'un adhésif (701) permettant la fixation, à la carte de circuit imprimé, de la pluralité de puces de réseau d'éléments électroluminescents comprenant une pluralité de parties électroluminescentes (602) et de plaques de liaison de fils (408), en forme de zigzag dans une direction longitudinale (LD), une section d'extrémité d'une première puce de réseau d'éléments électroluminescents chevauchant une extrémité d'une deuxième puce de réseau d'éléments électroluminescents qui lui est adjacente lorsqu'elle est vue dans le sens de la largeur (WD) perpendiculaire à la direction longitudinale, l'autre section d'extrémité de la deuxième puce de réseau d'éléments électroluminescents chevauchant une extrémité d'une troisième puce de réseau d'éléments électroluminescents qui lui est adjacente lorsqu'elle est vue dans le sens de la largeur, et un adhésif pour fixer la seconde puce de réseau d'éléments électroluminescents à la carte imprimée étant appliqué à une région située entre la section d'extrémité de la première puce de réseau d'éléments électroluminescents et la section d'extrémité de la troisième puce de réseau d'éléments électroluminescents.
(JA)
露光ヘッド106は、プリント基板202と、複数の発光素子アレイチップ400と、複数の発光部602及びワイヤボンディングパッド408が設けられた複数の発光素子アレイチップを長手方向LDに千鳥状にプリント基板に固定する接着剤701と、を備え、第一の発光素子アレイチップの一端部は、長手方向に直交する幅方向WDに見たときに、隣接する第二の発光素子アレイチップの一端部と互いに重なり、第二の発光素子アレイチップの他端部は、幅方向に見たときに、隣接する第三の発光素子アレイチップの一端部と互いに重なり、第二の発光素子アレイチップをプリント基板に固定する接着剤は、第一の発光素子アレイチップの一端部と第三の発光素子アレイチップの一端部との間の領域に塗布されている。
Also published as
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