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1. WO2021039427 - PRESSING DEVICE, SUBSTRATE PROCESSING SYSTEM, AND SUBSTRATE PROCESSING METHOD

Publication Number WO/2021/039427
Publication Date 04.03.2021
International Application No. PCT/JP2020/030809
International Filing Date 13.08.2020
IPC
B23K 20/00 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
20Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
H01L 21/02 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
H01L 21/683 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
683for supporting or gripping
CPC
B23K 20/00
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
20Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
H01L 21/02
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
H01L 21/683
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
683for supporting or gripping
Applicants
  • 東京エレクトロン株式会社 TOKYO ELECTRON LIMITED [JP]/[JP]
Inventors
  • 杉原 紳太郎 SUGIHARA, Shintaro
  • 和田 憲雄 WADA, Norio
  • 眞鍋 英二 MANABE, Eiji
Agents
  • 伊東 忠重 ITOH, Tadashige
  • 伊東 忠彦 ITOH, Tadahiko
Priority Data
2019-15811230.08.2019JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) PRESSING DEVICE, SUBSTRATE PROCESSING SYSTEM, AND SUBSTRATE PROCESSING METHOD
(FR) DISPOSITIF DE PRESSAGE, SYSTÈME DE TRAITEMENT DE SUBSTRAT ET PROCÉDÉ DE TRAITEMENT DE SUBSTRAT
(JA) 押圧装置、基板処理システム、及び基板処理方法
Abstract
(EN)
This pressing device is for pressing two main surfaces of a stacked substrate comprising a first substrate and a second substrate bonded to the first substrate, and comprises: a retention part for retaining the stacked substrate; a movable part disposed to face the retention part; a pressure application mechanism which moves the movable part and causes the movable part to press the stacked substrate against the retention part, wherein the movable part has a pressing surface that presses the entirety of one main surface of the stacked substrate, and the retention part has a retaining surface on which the entirety of the other main surface of the stacked substrate is retained.
(FR)
Dispositif de pressage pour presser deux surfaces principales d'un substrat empilé comprenant un premier substrat et un second substrat lié au premier substrat, et qui comprend : une partie de retenue pour retenir le substrat empilé ; une partie mobile disposée de façon à faire face à la partie de retenue ; un mécanisme d'application de pression qui déplace la partie mobile et amène celle-ci à presser le substrat empilé contre la partie de retenue, la partie mobile comportant une surface de pression qui presse la totalité d'une surface principale du substrat empilé, et la partie de retenue comportant une surface de retenue sur laquelle la totalité de l'autre surface principale du substrat empilé est retenue.
(JA)
第1基板と前記第1基板に接合された第2基板とを含む重合基板の2つの主面を押圧する押圧装置であって、前記重合基板を保持する保持部と、前記保持部に対して対向配置される可動部と、前記可動部を移動させ、前記可動部で前記重合基板を前記保持部に押す加圧機構と、を有し、前記可動部は、前記重合基板の主面の全体を押す押圧面を含み、前記保持部は、前記重合基板の主面の全体を保持する保持面を含む、押圧装置。
Latest bibliographic data on file with the International Bureau