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1. WO2021039401 - POLISHING APPARATUS AND POLISHING METHOD

Publication Number WO/2021/039401
Publication Date 04.03.2021
International Application No. PCT/JP2020/030688
International Filing Date 12.08.2020
IPC
B24B 37/013 2012.01
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
37Lapping machines or devices; Accessories
005Control means for lapping machines or devices
013Devices or means for detecting lapping completion
B24B 49/04 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
49Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
02according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
04involving measurement of the workpiece at the place of grinding during grinding operation
B24B 49/12 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
49Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
12involving optical means
H01L 21/304 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18the devices having semiconductor bodies comprising elements of group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
302to change the physical characteristics of their surfaces, or to change their shape, e.g. etching, polishing, cutting
304Mechanical treatment, e.g. grinding, polishing, cutting
CPC
B24B 37/005
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
37Lapping machines or devices; Accessories
005Control means for lapping machines or devices
B24B 37/013
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
37Lapping machines or devices; Accessories
005Control means for lapping machines or devices
013Devices or means for detecting lapping completion
B24B 49/04
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
49Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
02according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
04involving measurement of the workpiece at the place of grinding during grinding operation
B24B 49/12
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
49Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
12involving optical means
H01L 21/304
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
18the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
302to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
304Mechanical treatment, e.g. grinding, polishing, cutting
Applicants
  • 株式会社荏原製作所 EBARA CORPORATION [JP]/[JP]
Inventors
  • 高橋 信行 TAKAHASHI, Nobuyuki
  • 木下 将毅 KINOSHITA, Masaki
Agents
  • 廣澤 哲也 HIROSAWA, Tetsuya
  • 渡邉 勇 WATANABE, Isamu
  • 郷戸 学 GODO, Manabu
  • 金沢 充博 KANAZAWA, Mitsuhiro
Priority Data
2019-15692129.08.2019JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) POLISHING APPARATUS AND POLISHING METHOD
(FR) APPAREIL DE POLISSAGE ET PROCÉDÉ DE POLISSAGE
(JA) 研磨装置および研磨方法
Abstract
(EN)
The present invention relates to a polishing apparatus and a polishing method, whereby a substrate is polished while a film thickness of the substrate is measured by analyzing reflected light from the substrate on a polishing pad. The polishing apparatus is provided with: a polishing table (3) supporting a polishing pad (2) with a through hole (61); a pad height measuring device (32) that measures the height of a polishing surface (2a); a pure water supply line (63) and a pure water suction line (64) connected to the through hole (61); a flow rate adjustment device (71) connected to the pure water supply line (63); and an operation control unit (35) that controls operation of the flow rate adjustment device (71). The operation control unit (35) determines from correlation data a flow rate of pure water corresponding to a measured value of the height of the polishing surface (2a), and controls operation of the flow rate adjustment device (71) such that the pure water flows through the pure water supply line (63) at the flow rate thus determined.
(FR)
La présente invention concerne un appareil de polissage et un procédé de polissage, moyennant quoi un substrat est poli en même temps qu'une épaisseur de film du substrat est mesurée par analyse de la lumière réfléchie par le substrat sur un tampon à polir. L'appareil de polissage est équipé : d'une table de polissage (3) soutenant un tampon à polir (2) doté d’un trou traversant (61) ; d’un dispositif de mesure de hauteur de tampon (32) qui mesure la hauteur d'une surface de polissage (2a) ; d’une conduite d'alimentation en eau pure (63) et d’une conduite d'aspiration d'eau pure (64) reliée au trou traversant (61) ; d’un dispositif de réglage de débit (71) relié à la conduite d'alimentation en eau pure (63) ; et d’une unité de commande de fonctionnement (35) qui commande le fonctionnement du dispositif de réglage de débit (71). L'unité de commande de fonctionnement (35) détermine, à partir de données de corrélation, un débit d'eau pure correspondant à une valeur mesurée de la hauteur de la surface de polissage (2a), et commande le fonctionnement du dispositif de réglage de débit (71) de sorte que l'eau pure s'écoule dans la conduite d'alimentation en eau pure (63) au débit ainsi déterminé.
(JA)
本発明は、研磨パッド上の基板からの反射光を解析することで基板の膜厚を検出しながら、該基板を研磨する研磨装置および研磨方法に関するものである。研磨装置は、通孔(61)を有する研磨パッド(2)を支持する研磨テーブル(3)と、研磨面(2a)の高さを測定するパッド高さ測定装置(32)と、通孔(61)に連結された純水供給ライン(63)および純水吸引ライン(64)と、純水供給ライン(63)に接続された流量調節装置(71)と、流量調節装置(71)の動作を制御する動作制御部(35)を備える。動作制御部(35)は、研磨面(2a)の高さの測定値に対応する純水の流量を相関データから決定し、決定された流量で純水が純水供給ライン(63)を流れるように流量調節装置(71)の動作を制御する。
Also published as
Latest bibliographic data on file with the International Bureau