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1. WO2021037509 - ON CHIP SENSOR FOR WAFER OVERLAY MEASUREMENT

Publication Number WO/2021/037509
Publication Date 04.03.2021
International Application No. PCT/EP2020/072063
International Filing Date 05.08.2020
IPC
G03F 7/20 2006.01
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
20Exposure; Apparatus therefor
H01L 31/0232 2014.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
31Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength, or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
02Details
0232Optical elements or arrangements associated with the device
G02B 6/42 2006.01
GPHYSICS
02OPTICS
BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
6Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
24Coupling light guides
42Coupling light guides with opto-electronic elements
CPC
G02B 6/02314
GPHYSICS
02OPTICS
BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
6Light guides
02Optical fibre with cladding ; with or without a coating
02295Microstructured optical fibre
02314Plurality of longitudinal structures extending along optical fibre axis, e.g. holes
G02B 6/1225
GPHYSICS
02OPTICS
BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
6Light guides
10of the optical waveguide type
12of the integrated circuit kind
122Basic optical elements, e.g. light-guiding paths
1225comprising photonic band-gap structures or photonic lattices
G02B 6/262
GPHYSICS
02OPTICS
BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
6Light guides
24Coupling light guides
26Optical coupling means
262Optical details of coupling light into, or out of, or between fibre ends, e.g. special fibre end shapes or associated optical elements
G03F 7/70633
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
70Exposure apparatus for microlithography
70483Information management, control, testing, and wafer monitoring, e.g. pattern monitoring
70616Wafer pattern monitoring, i.e. measuring printed patterns or the aerial image at the wafer plane
70633Overlay
Applicants
  • ASML HOLDING N.V. [NL]/[NL]
  • ASML NETHERLANDS B.V. [NL]/[NL]
Inventors
  • SWILLAM, Mohamed
  • ROUX, Stephen
  • ELAZHARY, Tamer, Mohamed, Tawfik, Ahmed, Mohamed
  • DEN BOEF, Arie, Jeffrey
Agents
  • ASML NETHERLANDS B.V.
Priority Data
62/893,25629.08.2019US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) ON CHIP SENSOR FOR WAFER OVERLAY MEASUREMENT
(FR) CAPTEUR SUR PUCE POUR MESURE DE RECOUVREMENT DE TRANCHE
Abstract
(EN)
A sensor apparatus includes a sensor chip, an illumination system, a first optical system, a second optical system, and a detector system. The illumination system is coupled to the sensor chip and transmits an illumination beam along an illumination path. The first optical system is coupled to the sensor chip and includes a first integrated optic to configure and transmit the illumination beam toward a diffraction target on a substrate, disposed adjacent to the sensor chip, and generate a signal beam including diffraction order sub-beams generated from the diffraction target. The second optical system is coupled to the sensor chip and includes a second integrated optic to collect and transmit the signal beam from a first side to a second side of the sensor chip. The detector system is configured to measure a characteristic of the diffraction target based on the signal beam transmitted by the second optical system.
(FR)
La présente invention concerne un appareil de capteur qui comprend une puce de capteur, un système d'éclairage, un premier système optique, un second système optique et un système de détecteur. Le système d'éclairage est couplé à la puce de capteur et transmet un faisceau d'éclairage le long d'un trajet d'éclairage. Le premier système optique est couplé à la puce de capteur et comprend une première optique intégrée servant à configurer et à transmettre le faisceau d'éclairage vers une cible de diffraction située sur un substrat, il est disposé de façon adjacente à la puce de capteur, et il génère un faisceau de signal comprenant des sous-faisceaux d'ordre de diffraction générés à partir de la cible de diffraction. Le second système optique est couplé à la puce de capteur et comprend une seconde optique intégrée servant à collecter et à transmettre le faisceau de signal d'un premier côté vers un second côté de la puce de capteur. Le système de détecteur est conçu pour mesurer une caractéristique de la cible de diffraction sur la base du faisceau de signal transmis par le second système optique.
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