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1. WO2021026987 - RESIN COMPOSITION, PREPREG, AND RELATED SUBSTRATE

Publication Number WO/2021/026987
Publication Date 18.02.2021
International Application No. PCT/CN2019/104828
International Filing Date 09.09.2019
IPC
C08L 71/12 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
71Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
08Polyethers derived from hydroxy compounds or from their metallic derivatives
10from phenols
12Polyphenylene oxides
C08L 63/00 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
63Compositions of epoxy resins; Compositions of derivatives of epoxy resins
C08F 283/08 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
283Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G117
06on to polyethers, polyoxymethylenes or polyacetals
08on to polyphenylene oxides
C08F 290/06 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
290Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
02on to polymers modified by introduction of unsaturated end groups
06Polymers provided for in subclass C08G52
B32B 15/08 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
15Layered products essentially comprising metal
04comprising metal as the main or only constituent of a layer, next to another layer of a specific substance
08of synthetic resin
CPC
B32B 15/08
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
15Layered products comprising ; a layer of; metal
04comprising metal as the main or only constituent of a layer, ; which is; next to another layer of ; the same or of; a ; different material
08of synthetic resin
B32B 15/20
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
15Layered products comprising ; a layer of; metal
20comprising aluminium or copper
B32B 2250/40
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
2250Layers arrangement
40Symmetrical or sandwich layers, e.g. ABA, ABCBA, ABCCBA
B32B 2457/08
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
2457Electrical equipment
08PCBs, i.e. printed circuit boards
B32B 27/06
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
27Layered products comprising ; a layer of; synthetic resin
06as the main or only constituent of a layer, ; which is; next to another layer of ; the same or of; a ; different material
B32B 27/285
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
27Layered products comprising ; a layer of; synthetic resin
28comprising synthetic resins not wholly covered by any one of the sub-groups ; B32B27/30 - B32B27/42
285comprising polyethers
Applicants
  • 瑞声声学科技(深圳)有限公司 AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. [CN]/[CN]
  • 瑞声科技(南京)有限公司 AAC TECHNOLOGIES (NANJING) CO., LTD. [CN]/[CN]
Inventors
  • 王宏远 WANG, Hongyuan
  • 张翼蓝 ZHANG, Yilan
  • 王和志 WANG, Hezhi
Agents
  • 广东广和律师事务所 GUAGDONG GUANGHE LAW FIRM
Priority Data
201910743177.313.08.2019CN
Publication Language Chinese (ZH)
Filing Language Chinese (ZH)
Designated States
Title
(EN) RESIN COMPOSITION, PREPREG, AND RELATED SUBSTRATE
(FR) COMPOSITION DE RÉSINE, PRÉIMPRÉGNÉ ET SUBSTRAT ASSOCIÉ
(ZH) 树脂组合物、预浸料及相关基板
Abstract
(EN)
The present invention provides a resin composition. The resin composition comprises the following components in parts by mass: 65-80 parts of a reactive functional group-terminated modified polyphenylene ether copolymer; 20-35 parts of glycidyl ether having a reactive group capable of reacting with the reactive functional group-terminated modified polyphenylene ether copolymer; 5-25 parts of a cross-linking agent having two or more epoxy groups; 0-3 parts of a radical initiator; and 0-1.5 parts of a catalyst or a curing agent having an epoxy group. The present invention also provides a prepreg, a laminate, a copper-clad laminate, and a printed circuit board. Compared with the related art, the resin composition, the prepreg, the laminate, the copper-clad laminate, and the printed circuit board of the present invention reduce the high viscosity of polyphenylene ether, have good manufacturability, enable good compatibility between polyphenylene ether and glycidyl ether, improve the bonding force between polyphenylene ether and a metal, and achieve good heat resistance, excellent dielectric properties, and low costs.
(FR)
La présente invention concerne une composition de résine. La composition de résine comprend les constituants suivants, en parties en masse : 65 à 80 parties d'un copolymère d'éther de polyphénylène modifié terminé par un groupe fonctionnel réactif ; 20 à 35 parties d'éther de glycidyle ayant un groupe réactif capable de réagir avec le copolymère d'éther de polyphénylène modifié terminé par un groupe fonctionnel réactif ; 5 à 25 parties d'un agent de réticulation ayant deux groupes époxy ou plus ; 0 à 3 parties d'un initiateur radicalaire ; et 0 à 1,5 partie d'un catalyseur ou d'un agent de durcissement ayant un groupe époxy. La présente invention concerne également un préimprégné, un stratifié, un stratifié plaqué au cuivre et une carte de circuit imprimé. Par rapport à l'état de la technique associé, la composition de résine, le préimprégné, le stratifié, le stratifié plaqué au cuivre et la carte de circuit imprimé selon la présente invention réduisent la viscosité élevée de l'éther de polyphénylène, ont une bonne aptitude à la fabrication, permettent une bonne compatibilité entre l'éther de polyphénylène et l'éther de glycidyle, améliorent la force de liaison entre l'éther de polyphénylène et un métal et permettent d'obtenir une bonne résistance à la chaleur, d'excellentes propriétés diélectriques et de faibles coûts.
(ZH)
本发明提供了一种树脂组合物,所述树脂组合物按质量份包括如下组分:反应性官能团封端的改性聚苯醚共聚物,65~80质量份;具有能够与所述反应性官能团封端的改性聚苯醚共聚物反应的反应性基团的缩水甘油醚,20~35质量份;具有两个及以上环氧基团的交联剂,5-25质量份;自由基引发剂,0-3质量份;以及环氧基团的催化或固化剂,0-1.5质量份。本发明还提供了一种预浸料和层压板、覆铜箔层压板以及印制电路板。与相关技术相比,本发明的所述树脂组合物、预浸料、层压板、覆铜箔层压板以及印制电路板具有改善聚苯醚粘度大且工艺性良好,使聚苯醚和缩水甘油醚的相容性好,提高了聚苯醚与金属的粘接力,并耐热性好、介电性能优且成本低。
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