Processing

Please wait...

Settings

Settings

Goto Application

1. WO2021021356 - METHODS FOR REPAIRING A RECESS OF A CHAMBER COMPONENT

Publication Number WO/2021/021356
Publication Date 04.02.2021
International Application No. PCT/US2020/040135
International Filing Date 29.06.2020
IPC
H01J 37/32 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
37Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
32Gas-filled discharge tubes
H01L 21/683 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
683for supporting or gripping
CPC
B23K 26/082
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
08Devices involving relative movement between laser beam and workpiece
082Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
B23K 26/1224
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
12in a special atmosphere, e.g. in an enclosure
1224in vacuum
B23K 26/3576
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
352for surface treatment
3568Modifying rugosity
3576Diminishing rugosity, e.g. grinding; Polishing; Smoothing
H01J 2237/166
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
2237Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
16Vessels
166Sealing means
H01J 37/32183
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
37Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
32Gas-filled discharge tubes, ; e.g. for surface treatment of objects such as coating, plating, etching, sterilising or bringing about chemical reactions
32009Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
32082Radio frequency generated discharge
32174Circuits specially adapted for controlling the RF discharge
32183Matching circuits, impedance matching circuits per se H03H7/38 and H03H7/40
H01J 37/3244
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
37Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
32Gas-filled discharge tubes, ; e.g. for surface treatment of objects such as coating, plating, etching, sterilising or bringing about chemical reactions
32431Constructional details of the reactor
3244Gas supply means
Applicants
  • APPLIED MATERIALS, INC. [US]/[US]
Inventors
  • PENG, Gang Grant
  • YAU, Wai-Fan
  • GROECHEL, David W.
  • HOOSHDARAN, Frank F.
  • CHO, Tom K.
  • YANG, Yao-Hung
Agents
  • PATTERSON, B. Todd
  • TABOADA, Keith
Priority Data
16/525,46529.07.2019US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) METHODS FOR REPAIRING A RECESS OF A CHAMBER COMPONENT
(FR) PROCÉDÉS DE RÉPARATION D'UN ÉVIDEMENT D'UN COMPOSANT DE CHAMBRE
Abstract
(EN)
Embodiments of the present disclosure generally relate to a method for forming and treating a component in semiconductor manufacturing. In one embodiment, a method for treating a chamber component used in vacuum processing includes obtaining the chamber component including a recess formed in a surface of the chamber component, the surface being fabricated from a metal, and the recess has a depth ranging from about 0.5 mm to about 10 mm and a width ranging from about 1 mm to about 15 mm. The method further includes polishing the bottom surface of the recess using a laser to form a polished bottom surface having an Ra number of 1 micron or less. The laser can achieve high quality surface finishing.
(FR)
Des modes de réalisation de la présente invention concernent généralement un procédé de formation et de traitement d'un composant dans la fabrication de semi-conducteurs. Dans un mode de réalisation, un procédé de traitement d'un composant de chambre utilisé dans un traitement sous vide comprend l'obtention du composant de chambre comprenant un évidement formé dans une surface du composant de chambre, la surface étant fabriquée à partir d'un métal, et l'évidement présentant une profondeur allant d'environ 0,5 mm à environ 10 mm et une largeur allant d'environ 1 mm à environ 15 mm. Le procédé comprend en outre le polissage de la surface inférieure de l'évidement au moyen d'un laser pour former une surface inférieure polie présentant un nombre Ra de 1 micron ou moins. Le laser peut permettre d'obtenir une finition de surface de haute qualité.
Latest bibliographic data on file with the International Bureau