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1. WO2021019296 - CMUT TRANSDUCER AND METHOD FOR MANUFACTURING

Publication Number WO/2021/019296
Publication Date 04.02.2021
International Application No. PCT/IB2020/000617
International Filing Date 16.07.2020
IPC
B06B 1/02 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
06GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
BGENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
1Processes or apparatus for generating mechanical vibrations of infrasonic, sonic or ultrasonic frequency
02making use of electrical energy
H04R 19/00 2006.01
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
19Electrostatic transducers
G01L 9/00 2006.01
GPHYSICS
01MEASURING; TESTING
LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
9Measuring steady or quasi-steady pressure of a fluid or a fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
B81B 3/00 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
3Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
CPC
B06B 1/0292
BPERFORMING OPERATIONS; TRANSPORTING
06GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
BMETHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, ; e.g.; FOR PERFORMING MECHANICAL WORK IN GENERAL
1Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
02making use of electrical energy
0292Electrostatic transducers, e.g. electret-type
G01L 9/0042
GPHYSICS
01MEASURING; TESTING
LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
9Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements
0041Transmitting or indicating the displacement of flexible diaphragms
0042Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms
H04R 19/005
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
19Electrostatic transducers
005using semiconductor materials
Applicants
  • VERMON SA [FR]/[FR]
Inventors
  • SENEGOND, Nicolas
  • GROSS, Dominique
  • MEYNIER, Cyril
Agents
  • CABINET BEAUMONT
Priority Data
62/879,05626.07.2019US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) CMUT TRANSDUCER AND METHOD FOR MANUFACTURING
(FR) TRANSDUCTEUR CMUT ET PROCÉDÉ DE FABRICATION
Abstract
(EN)
The present disclosure relates to a method of manufacturing a CMUT transducer (200), comprising the steps of: a) forming a first dielectric layer (103) on a first substrate (101); b) forming a second dielectric layer (207) on a second substrate (301); c) forming a cavity (105) in the first (103) or second (207) dielectric layer; d) assembling the first (101) and second (301) substrates by direct bonding of the surface of the second dielectric layer (207) opposite to the second substrate (301) to the surface of the first dielectric layer (103) opposite to the first substrate (101); e) removing the second substrate (301) to only keep above the cavity (105) a suspended membrane formed by the second dielectric layer (207); and f) forming an upper electrode (E2) on the surface of the membrane (207) opposite to the first substrate (101).
(FR)
La présente divulgation concerne un procédé de fabrication d'un transducteur CMUT (200), comprenant les étapes consistant à : a) former une première couche diélectrique (103) sur un premier substrat (101) ; b) former une seconde couche diélectrique (207) sur un second substrat (301) ; c) former une cavité (105) dans la première (103) ou seconde (207) couche diélectrique ; d) assembler les premier (101) et second (301) substrats par liaison directe de la surface de la seconde couche diélectrique (207) opposée au second substrat (301) à la surface de la première couche diélectrique (103) opposée au premier substrat (101) ; e) retirer le second substrat (301) pour maintenir uniquement au-dessus de la cavité (105) une membrane suspendue formée par la seconde couche diélectrique (207) ; et f) former une électrode supérieure (E2) sur la surface de la membrane (207) opposée au premier substrat (101).
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