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1. WO2021003011 - PICK AND PLACE MACHINE CLEANING SYSTEM AND METHOD

Publication Number WO/2021/003011
Publication Date 07.01.2021
International Application No. PCT/US2020/037552
International Filing Date 12.06.2020
IPC
H01L 21/67 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/02 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
B08B 1/00 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
08CLEANING
BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
1Cleaning by methods involving the use of tools, brushes, or analogous members
Applicants
  • INTERNATIONAL TEST SOLUTIONS, INC. [US]/[US]
Inventors
  • HUMPHREY, Alan, E.
  • HUMPHREY, Bret, A.
  • BROZ, Jerry, J.
  • SMITH, Wayne, C.
Agents
  • LOHSE, Timothy, W.
  • JACKSON, Blake, W.
  • YORE, Campbell
  • LIMBACH, Alan
  • YAMASHITA, Brent
  • SWIATEK, Maria
  • MOONEY, Christopher
Priority Data
16/460,87702.07.2019US
16/460,91802.07.2019US
16/460,92902.07.2019US
16/460,93502.07.2019US
16/794,06818.02.2020US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) PICK AND PLACE MACHINE CLEANING SYSTEM AND METHOD
(FR) SYSTÈME ET PROCÉDÉ DE NETTOYAGE DE MACHINE BRAS-TRANSFERT
Abstract
(EN)
A device, mechanism, and methodology for regular and consistent cleaning of the vacuum aperture, nozzle, and contacting surfaces of a pick-and-place apparatus and the pick-up tools of automated or manual semiconductor device and die handling machines are disclosed. The cleaning material may include a cleaning pad layer with one or more intermediate layers that have predetermined characteristics, regular geometrical features, and/or an irregular surface morphology.
(FR)
L'invention concerne un dispositif, un mécanisme et une méthodologie de nettoyage régulier et uniforme de l'ouverture d'aspiration, de la buse et des surfaces de contact d'un appareil bras-transfert et des outils de préhension de machines de manipulation de dispositifs à semi-conducteur et de puces automatisées ou manuelles. Le matériel de nettoyage peut comprendre une couche de tampon de nettoyage avec une ou plusieurs couches intermédiaires qui présentent des caractéristiques prédéterminées, des formes géométriques régulières et/ou une morphologie de surface irrégulière.
Latest bibliographic data on file with the International Bureau