Processing

Please wait...

Settings

Settings

Goto Application

1. WO2021002880 - POLISHING COMPOSITIONS FOR REDUCED DEFECTIVITY AND METHODS OF USING THE SAME

Publication Number WO/2021/002880
Publication Date 07.01.2021
International Application No. PCT/US2019/045489
International Filing Date 07.08.2019
IPC
B24B 1/02
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
1Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
02for cutting pieces from stock, i.e. severing
C09K 3/14 2006.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
KMATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
3Materials not provided for elsewhere
14Anti-slip materials; Abrasives
H01L 21/306 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18the devices having semiconductor bodies comprising elements of group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
302to change the physical characteristics of their surfaces, or to change their shape, e.g. etching, polishing, cutting
306Chemical or electrical treatment, e.g. electrolytic etching
Applicants
  • FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. [US]/[US]
Inventors
  • MCDONOUGH, James
  • ALVARADO, Saul
Agents
  • GREELEY, Paul, D.
Priority Data
16/503,19803.07.2019US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) POLISHING COMPOSITIONS FOR REDUCED DEFECTIVITY AND METHODS OF USING THE SAME
(FR) COMPOSITIONS DE POLISSAGE POUR UN CARACTÈRE DÉFECTUEUX RÉDUIT ET LEURS PROCÉDÉS D'UTILISATION
Abstract
(EN)
Chemical mechanical polishing compositions include an abrasive, a first removal rate enhancer; and water; wherein the polishing compositions have a value of less than 800,000 for the relation: large particle counts/weight percent abrasive, when measured using a 0.2 μm bin size.
(FR)
L'invention concerne des compositions de polissage chimico-mécaniques qui comprennent un abrasif, un premier amplificateur de taux d'élimination; et de l'eau; les compositions de polissage ayant une valeur inférieure à 800 000 pour la relation : grands nombres de particules/pourcentage en poids d'abrasif, lors d'une mesure à l'aide d'une taille de bac de 0,2 pm.
Latest bibliographic data on file with the International Bureau