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1. WO2021002395 - NEGATIVE TYPE CURABLE COMPOSITION, CURED FILM, LAYERED BODY, CURED FILM PRODUCTION METHOD, AND SEMICONDUCTOR DEVICE

Publication Number WO/2021/002395
Publication Date 07.01.2021
International Application No. PCT/JP2020/025863
International Filing Date 01.07.2020
IPC
G03F 7/004 2006.01
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
G03F 7/027 2006.01
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
G03F 7/031 2006.01
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
028with photosensitivity-increasing substances, e.g. photoinitiators
031Organic compounds not covered by group G03F7/02967
G03F 7/20 2006.01
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
20Exposure; Apparatus therefor
Applicants
  • 富士フイルム株式会社 FUJIFILM CORPORATION [JP]/[JP]
Inventors
  • 榎本 雄一郎 ENOMOTO Yuichiro
  • 青島 俊栄 AOSHIMA Toshihide
  • 山▲ざき▼ 健太 YAMAZAKI Kenta
Agents
  • 特許業務法人特許事務所サイクス SIKs & Co.
Priority Data
2019-12365002.07.2019JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) NEGATIVE TYPE CURABLE COMPOSITION, CURED FILM, LAYERED BODY, CURED FILM PRODUCTION METHOD, AND SEMICONDUCTOR DEVICE
(FR) COMPOSITION DURCISSABLE DE TYPE NÉGATIF, FILM DURCI, CORPS STRATIFIÉ, PROCÉDÉ DE PRODUCTION DE FILM DURCI ET DISPOSITIF À SEMI-CONDUCTEURS
(JA) ネガ型硬化性組成物、硬化膜、積層体、硬化膜の製造方法、及び、半導体デバイス
Abstract
(EN)
The invention provides: a negative type curable composition comprising an alkali-soluble polyimide, a photopolymerization initiator, and a bifunctional cross-linking agent having no covalent cyclic structure other than the polymerization groups, the polymerization groups being distanced from one another by 12 or more atoms; a cured film yielded by curing the negative type curable composition; a layered body containing the cured film; a production method for the cured film; and a semiconductor device containing the cured film or the layered body.
(FR)
L'invention concerne : une composition durcissable de type négatif comprenant un polyimide soluble dans les alcalis, un initiateur de photopolymérisation, et un agent de réticulation bifonctionnel n'ayant aucune structure cyclique covalente autre que les groupes de polymérisation, les groupes de polymérisation étant espacés les uns des autres par au moins 12 atomes ; un film durci obtenu par le durcissement de la composition durcissable de type négatif ; un corps stratifié contenant le film durci ; un procédé de production du film durci ; et un dispositif à semi-conducteurs contenant le film durci ou le corps stratifié.
(JA)
アルカリ可溶性ポリイミド、光重合開始剤、及び、共有結合による環状構造を重合基以外に有さず、重合基同士の距離が12原子以上離れている2官能架橋剤を含有する、ネガ型硬化性組成物、上記ネガ型硬化性組成物を硬化してなる硬化膜、上記硬化膜を含む積層体、上記硬化膜の製造方法、及び、上記硬化膜又は上記積層体を含む半導体デバイス。
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