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1. WO2020247639 - APPARATUSES AND METHODS FOR STAGGERED TIMING OF SKIPPED REFRESH OPERATIONS

Publication Number WO/2020/247639
Publication Date 10.12.2020
International Application No. PCT/US2020/036133
International Filing Date 04.06.2020
IPC
G11C 11/406 2006.01
GPHYSICS
11INFORMATION STORAGE
CSTATIC STORES
11Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
21using electric elements
34using semiconductor devices
40using transistors
401forming cells needing refreshing or charge regeneration, i.e. dynamic cells
406Management or control of the refreshing or charge-regeneration cycles
G11C 5/02 2006.01
GPHYSICS
11INFORMATION STORAGE
CSTATIC STORES
5Details of stores covered by group G11C11/63
02Disposition of storage elements, e.g. in the form of a matrix array
G06F 3/06 2006.01
GPHYSICS
06COMPUTING; CALCULATING OR COUNTING
FELECTRIC DIGITAL DATA PROCESSING
3Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
06Digital input from, or digital output to, record carriers
CPC
G11C 11/40603
GPHYSICS
11INFORMATION STORAGE
CSTATIC STORES
11Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
21using electric elements
34using semiconductor devices
40using transistors
401forming cells needing refreshing or charge regeneration, i.e. dynamic cells
406Management or control of the refreshing or charge-regeneration cycles
40603Arbitration, priority and concurrent access to memory cells for read/write or refresh operations
H01L 2225/06506
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2225Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
03All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00
04the devices not having separate containers
065the devices being of a type provided for in group H01L27/00
06503Stacked arrangements of devices
06506Wire or wire-like electrical connections between devices
H01L 2225/0651
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2225Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
03All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00
04the devices not having separate containers
065the devices being of a type provided for in group H01L27/00
06503Stacked arrangements of devices
0651Wire or wire-like electrical connections from device to substrate
H01L 2225/06562
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2225Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
03All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00
04the devices not having separate containers
065the devices being of a type provided for in group H01L27/00
06503Stacked arrangements of devices
06555Geometry of the stack, e.g. form of the devices, geometry to facilitate stacking
06562at least one device in the stack being rotated or offset
H01L 25/0657
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; ; Multistep manufacturing processes thereof
03all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes
04the devices not having separate containers
065the devices being of a type provided for in group H01L27/00
0657Stacked arrangements of devices
Applicants
  • MICRON TECHNOLOGY, INC. [US]/[US]
Inventors
  • REHMEYER, James S.
  • MEIER, Nathaniel J.
  • LEE, Joo-Sang
Agents
  • HEGSTROM, Brandon P.
  • ENG, Kimton
  • SPAITH, Jennifer L.
Priority Data
16/432,60405.06.2019US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) APPARATUSES AND METHODS FOR STAGGERED TIMING OF SKIPPED REFRESH OPERATIONS
(FR) APPAREILS ET PROCÉDÉS DESTINÉS À LA SYNCHRONISATION DÉCALÉE D'OPÉRATIONS DE RAFRAÎCHISSEMENT SAUTÉES
Abstract
(EN)
Embodiments of the disclosure are drawn to apparatuses and methods for staggering the timing of skipped refresh operations on a memory. Memory cells of memories may need to periodically perform refresh operations. In some instances, auto-refresh operations may be periodically skipped when charge retention characteristics of the memory cells of the memory exceed the auto-refresh frequency. To reduce peak current draw during refresh operations, the skipped refresh operations may be staggered across different portions of the memory. In one example, the skipped refresh operation may be staggered in time among memory dies of the memory to limit a number of memory dies that are performing an auto-refresh operation to a maximum number. In another example, the skipped refresh operation may be staggered in time among memory banks of a single memory array to limit a number of memory banks that are performing an auto-refresh operation to a maximum number.
(FR)
Selon certains modes de réalisation, l'invention concerne des appareils et des procédés permettant de décaler la synchronisation d'opérations de rafraîchissement sautées dans une mémoire. Des cellules de mémoire de mémoires peuvent avoir besoin d'effectuer périodiquement des opérations de rafraîchissement. Dans certains cas, des opérations d'auto-rafraîchissement peuvent être périodiquement sautées lorsque les caractéristiques de rétention de charge des cellules de mémoire de la mémoire dépassent la fréquence d'auto-rafraîchissement. Pour réduire l'appel de courant de crête pendant les opérations de rafraîchissement, les opérations de rafraîchissement sautées peuvent être décalées à travers différentes parties de la mémoire. Dans un exemple, l'opération de rafraîchissement sautée peut être décalée dans le temps parmi des puces de mémoire de la mémoire afin de limiter un certain nombre de puces de mémoire qui effectuent une opération d'auto-rafraîchissement à un nombre maximum. Dans un autre exemple, l'opération de rafraîchissement sautée peut être décalée dans le temps parmi des banques de mémoire d'un réseau de mémoire unique afin de limiter un certain nombre de banques de mémoire qui effectuent une opération d'auto-rafraîchissement à un nombre maximum.
Also published as
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