Processing

Please wait...

Settings

Settings

Goto Application

1. WO2020245371 - ARRANGEMENT AND METHOD FOR PRODUCING AN ARRANGEMENT

Publication Number WO/2020/245371
Publication Date 10.12.2020
International Application No. PCT/EP2020/065645
International Filing Date 05.06.2020
IPC
F21V 29/503 2015.01
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
21LIGHTING
VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
29Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
50Cooling arrangements
502characterised by the adaptation for cooling of specific components
503of light sources
F21V 29/76 2015.01
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
21LIGHTING
VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
29Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
50Cooling arrangements
70characterised by passive heat-dissipating elements, e.g. heat-sinks
74with fins or blades
76with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
H05K 1/02 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
CPC
F21V 29/503
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
21LIGHTING
VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
29Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
50Cooling arrangements
502characterised by the adaptation for cooling of specific components
503of light sources
F21V 29/763
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
21LIGHTING
VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
29Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
50Cooling arrangements
70characterised by passive heat-dissipating elements, e.g. heat-sinks
74with fins or blades
76with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
763the planes containing the fins or blades having the direction of the light emitting axis
H05K 1/0204
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
0201Thermal arrangements, e.g. for cooling, heating or preventing overheating
0203Cooling of mounted components
0204using means for thermal conduction connection in the thickness direction of the substrate
Applicants
  • OSRAM CONTINENTAL GMBH [DE]/[DE]
Inventors
  • GASSER, Hans-Friedrich
  • AUSTERER, Maximilian
Agents
  • WINTER BRANDL FÜRNISS HÜBNER RÖSS KAISER POLTE - PARTNERSCHAFT MBB
Priority Data
10 2019 115 500.207.06.2019DE
Publication Language German (DE)
Filing Language German (DE)
Designated States
Title
(DE) ANORDNUNG UND VERFAHREN ZUR HERSTELLUNG EINER ANORDNUNG
(EN) ARRANGEMENT AND METHOD FOR PRODUCING AN ARRANGEMENT
(FR) ENSEMBLE ET PROCÉDÉ DE FABRICATION D’UN ENSEMBLE
Abstract
(DE)
Offenbart ist eine Anordnung mit einer Leiterplatte (1) zur mechanischen Befestigung und elektrischen Verbindung von Bauelementen, mit einer Leiterplatte (1) und einem an einer ersten Seite (9a) der Leiterplatte (1) befestigten Kühlkörper (5; 11) zur Kühlung der Anordnung. In der Leiterplatte (1) ist eine Ausnehmung (3) vorgesehen und zumindest ein Abschnitt des Kühlkörpers (5; 11) ist durch die Ausnehmung (3) geführt und kragt von einer der ersten Seite (9a) der Leiterplatte (1) wegweisenden zweiten Seite (9b) der Leiterplatte (1) weg.
(EN)
Disclosed is an arrangement comprising a printed circuit board (1) for mechanically fastening and electrically connecting components, comprising a printed circuit board (1) and a heat sink (5; 11) fastened on a first face (9a) of the printed circuit board (1), for cooling the arrangement. A cut-out (3) is provided in the printed circuit board (1) and at least one portion of the heat sink (5; 11) passes through the cut-out (3) and projects away from a second face (9b) of the printed circuit board (1) facing away from the first face (9a) of said printed circuit board (1).
(FR)
L’invention concerne un ensemble pourvu d’une carte de circuit imprimé (1) destinée à la fixation mécanique et la connexion électrique de composants, l’ensemble comprenant une carte de circuit imprimé (1) et un dissipateur thermique (5 ; 11) fixés à un premier côté (9a) de la carte de circuit imprimé (1) et destiné à refroidir l’ensemble. Un évidement (3) est ménagé dans la carte de circuit imprimé (1) et au moins une portion du dissipateur thermique (5 ; 11) est guidée à travers l’évidement (3) et fait saillie d’un deuxième côté (9b) de la carte de circuit imprimé (1) qui est dirigé à l’opposé du premier côté (9a) de la carte de circuit imprimé (1).
Also published as
Latest bibliographic data on file with the International Bureau