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1. WO2020244006 - FINGERPRINT CHIP, METHOD FOR MANUFACTURING FINGERPRINT CHIP, AND ELECTRONIC DEVICE

Publication Number WO/2020/244006
Publication Date 10.12.2020
International Application No. PCT/CN2019/093395
International Filing Date 27.06.2019
IPC
G06K 9/00 2006.01
GPHYSICS
06COMPUTING; CALCULATING OR COUNTING
KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
9Methods or arrangements for reading or recognising printed or written characters or for recognising patterns, e.g. fingerprints
CPC
G06K 9/00046
GPHYSICS
06COMPUTING; CALCULATING; COUNTING
KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
9Methods or arrangements for reading or recognising printed or written characters or for recognising patterns, e.g. fingerprints
00006Acquiring or recognising fingerprints or palmprints
00013Image acquisition
00046by using geometrical optics, e.g. using prisms
H01L 27/3234
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
28including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
32with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes [OLED]
3225OLED integrated with another component
3234the other component being an imager structure
Applicants
  • 深圳市汇顶科技股份有限公司 SHENZHEN GOODIX TECHNOLOGY CO., LTD. [CN]/[CN]
Inventors
  • 刘辰锦 LIU, Chenjin
  • 张建湘 ZHANG, Jianxiang
  • 吴宝全 WU, Baoquan
Agents
  • 北京龙双利达知识产权代理有限公司 LONGSUN LEAD IP LTD.
Priority Data
PCT/CN2019/09017105.06.2019CN
Publication Language Chinese (ZH)
Filing Language Chinese (ZH)
Designated States
Title
(EN) FINGERPRINT CHIP, METHOD FOR MANUFACTURING FINGERPRINT CHIP, AND ELECTRONIC DEVICE
(FR) PUCE POUR EMPREINTE DIGITALE, PROCÉDÉ DE FABRICATION DE PUCE POUR EMPREINTE DIGITALE, ET DISPOSITIF ÉLECTRONIQUE
(ZH) 指纹芯片、制作指纹芯片的方法和电子设备
Abstract
(EN)
A method for manufacturing a fingerprint chip, allowing the implementation of an ultrathin fingerprint chip. The method comprises: manufacturing a reinforcing layer on a wafer, where the wafer is provided thereon with multiple pixel arrays, an optical path layer is provided above the multiple pixel arrays, the optical path layer is used for transmitting an optical signal shone onto a finger and reflected by the finger to the multiple pixel arrays, and the reinforcing layer is affixed to the upper surface of the optical path layer via an adhesive layer; thinning the wafer provided with the reinforcing layer; cutting the wafer provided with the reinforcing layer to produce multiple fingerprint chips, where each fingerprint chip comprising one pixel array; and removing the reinforcing layer on the fingerprint chips.
(FR)
L'invention concerne un procédé de fabrication d'une puce pour empreinte digitale, permettant la mise en oeuvre d'une puce pour empreinte digitale ultramince. Le procédé consiste à : fabriquer une couche de renforcement sur une tranche, la tranche comportant de multiples matrices de pixels, une couche de trajet optique est disposée au-dessus des multiples matrices de pixels, la couche de trajet optique est utilisée pour transmettre un signal optique rayonné sur un doigt et réfléchi par le doigt vers les multiples matrices de pixels, et la couche de renforcement est fixée à la surface supérieure de la couche de trajet optique par l'intermédiaire d'une couche adhésive ; amincir la tranche pourvue de la couche de renforcement ; découper la tranche pourvue de la couche de renforcement pour produire de multiples puces pour empreinte digitale, chaque puce pour empreinte digitale comprenant une matrice de pixels ; et enlever la couche de renforcement sur les puces pour empreinte digitale.
(ZH)
一种制作指纹芯片的方法,能够实现超薄指纹芯片。该方法包括:在晶圆上制作加固层,其中,所述晶圆上形成有多个像素阵列,所述多个像素阵列上方设置有光路层,所述光路层用于将入射至手指并经所述手指反射的光信号传输至所述多个像素阵列,所述加固层通过胶层接合在所述光路层的上表面;对具有所述加固层的所述晶圆进行减薄处理;对具有所述加固层的所述晶圆进行切割,得到多个指纹芯片,其中每个指纹芯片包括一个像素阵列;去除各个指纹芯片上的所述加固层。
Also published as
CN201980002373.3
CN201980002569.2
CN201980004069.2
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