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1. WO2020238696 - FLEXIBLE ELECTRO-ACOUSTIC SUBSTRATE AND PREPARATION METHOD THEREFOR, AND FLEXIBLE ELECTRO-ACOUSTIC DEVICE

Publication Number WO/2020/238696
Publication Date 03.12.2020
International Application No. PCT/CN2020/091039
International Filing Date 19.05.2020
IPC
H01L 41/22 2013.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
41Piezo-electric devices in general; Electrostrictive devices in general; Magnetostrictive devices in general; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
22Processes or apparatus specially adapted for the assembly, manufacture or treatment of piezo-electric or electrostrictive devices or of parts thereof
H03H 9/17 2006.01
HELECTRICITY
03BASIC ELECTRONIC CIRCUITRY
HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
9Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
15Constructional features of resonators consisting of piezo-electric or electrostrictive material
17having a single resonator
CPC
H01L 41/0973
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
41Piezo-electric devices in general; Electrostrictive devices in general; Magnetostrictive devices in general; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
08Piezo-electric or electrostrictive devices
09with electrical input and mechanical output ; , e.g. actuators, vibrators
0926using bending displacement, e.g. unimorph, bimorph or multimorph cantilever or membrane benders
0973Membrane type
H01L 41/22
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
41Piezo-electric devices in general; Electrostrictive devices in general; Magnetostrictive devices in general; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
22Processes or apparatus specially adapted for the assembly, manufacture or treatment of piezo-electric or electrostrictive devices or of parts thereof
Applicants
  • 京东方科技集团股份有限公司 BOE TECHNOLOGY GROUP CO., LTD. [CN]/[CN]
Inventors
  • 韩艳玲 HAN, Yanling
  • 董学 DONG, Xue
  • 王海生 WANG, Haisheng
  • 刘英明 LIU, Yingming
  • 赵利军 ZHAO, Lijun
  • 郭玉珍 GUO, Yuzhen
  • 李佩笑 LI, Peixiao
  • 姬雅倩 JI, Yaqian
  • 张晨阳 ZHANG, Chenyang
  • 李秀锋 LI, Xiufeng
Agents
  • 北京市柳沈律师事务所 LIU, SHEN & ASSOCIATES
Priority Data
201910447022.527.05.2019CN
Publication Language Chinese (ZH)
Filing Language Chinese (ZH)
Designated States
Title
(EN) FLEXIBLE ELECTRO-ACOUSTIC SUBSTRATE AND PREPARATION METHOD THEREFOR, AND FLEXIBLE ELECTRO-ACOUSTIC DEVICE
(FR) SUBSTRAT ÉLECTRO-ACOUSTIQUE FLEXIBLE ET SON PROCÉDÉ DE PRÉPARATION, ET DISPOSITIF ÉLECTRO-ACOUSTIQUE FLEXIBLE
(ZH) 柔性声电基板及其制备方法、柔性声电装置
Abstract
(EN)
The embodiment of the present disclosure provides a flexible electro-acoustic substrate and a preparation method therefor, as well as a flexible electro-acoustic device. The preparation method for the flexible electro-acoustic substrate comprises: forming a flexible base; forming a plurality of piezoelectric components on the flexible base; and forming cavities with one-to-one correspondence to the plurality of piezoelectric components on the flexible base. The cavities are located on the side of the flexible base away from the plurality of piezoelectric components. According to the embodiment of the present disclosure, the cavities are formed in the flexible base by means of etching with good etching uniformity and no etching residue, thereby facilitating process realization and effectively eliminating the defects of low yield and complex process realization in the existing methods.
(FR)
Le mode de réalisation de la présente invention concerne un substrat électro-acoustique flexible et son procédé de préparation, ainsi qu'un dispositif électro-acoustique flexible. Le procédé de préparation du substrat électro-acoustique flexible comprend : la formation d'une base flexible ; la formation d'une pluralité de composants piézoélectriques sur la base flexible ; et la formation de cavités ayant une correspondance biunivoque avec la pluralité de composants piézoélectriques sur la base flexible. Les cavités sont situées sur le côté de la base flexible à l'opposé de la pluralité de composants piézoélectriques. Selon le mode de réalisation de la présente invention, les cavités sont formées dans la base flexible au moyen d'une gravure avec une bonne uniformité de gravure et aucun résidu de gravure, ce qui facilite la réalisation du procédé et élimine efficacement les défauts d'un faible rendement et d'une réalisation de processus complexe dans les procédés existants.
(ZH)
本公开的实施例提供一种柔性声电基板及其制备方法、柔性声电装置。柔性声电基板的制备方法包括:形成柔性基底;在柔性基底上形成多个压电组件;在柔性基底上形成与多个压电组件一一对应的腔室。腔室位于柔性基底远离多个压电组件的一侧。本公开的实施例通过刻蚀方式在柔性基底内形成腔室,腔室的刻蚀均匀性好,无刻蚀残留,易于工艺实现,有效解决了现有方法存在良品率低、工艺实现复杂等缺陷。
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