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1. WO2020238142 - COPPER PARTICLES WITH ANTI-OXIDATION PROTECTION ON SURFACE, LOW-TEMPERATURE SINTERED COPPER PASTE AND SINTERING PROCESS USING SAME

Publication Number WO/2020/238142
Publication Date 03.12.2020
International Application No. PCT/CN2019/123827
International Filing Date 06.12.2019
IPC
H01B 1/22 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
1Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
20Conductive material dispersed in non-conductive organic material
22the conductive material comprising metals or alloys
H01L 21/768 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
70Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in or on a common substrate or of specific parts thereof; Manufacture of integrated circuit devices or of specific parts thereof
71Manufacture of specific parts of devices defined in group H01L21/7086
768Applying interconnections to be used for carrying current between separate components within a device
CPC
B22F 3/10
BPERFORMING OPERATIONS; TRANSPORTING
22CASTING; POWDER METALLURGY
FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER
3Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; ; Presses and furnaces
10Sintering only
B22F 3/1003
BPERFORMING OPERATIONS; TRANSPORTING
22CASTING; POWDER METALLURGY
FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER
3Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; ; Presses and furnaces
10Sintering only
1003Use of special medium during sintering, e.g. sintering aid
H01L 21/56
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, ; e.g. sealing of a cap to a base of a container
56Encapsulations, e.g. encapsulation layers, coatings
H01L 23/28
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
28Encapsulations, e.g. encapsulating layers, coatings, ; e.g. for protection
H01L 23/29
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
28Encapsulations, e.g. encapsulating layers, coatings, ; e.g. for protection
29characterised by the material ; , e.g. carbon
Applicants
  • 深圳第三代半导体研究院 SHENZHEN INSTITUTE OF WIDE-BANDGAP SEMICONDUCTORS [CN]/[CN]
Inventors
  • 张卫红 ZHANG, Weihong
  • 刘旭 LIU, Xu
  • 敖日格力 AORI, Geli
  • 叶怀宇 YE, Huaiyu
  • 张国旗 ZHANG, Guoqi
Agents
  • 北京中知法苑知识产权代理事务所(普通合伙) BEIJING ZZFY INTELLECTUAL PROPERTY LAW FIRM (GENERAL PARTNER)
Priority Data
201910456136.629.05.2019CN
Publication Language Chinese (ZH)
Filing Language Chinese (ZH)
Designated States
Title
(EN) COPPER PARTICLES WITH ANTI-OXIDATION PROTECTION ON SURFACE, LOW-TEMPERATURE SINTERED COPPER PASTE AND SINTERING PROCESS USING SAME
(FR) PARTICULES DE CUIVRE AYANT UNE PROTECTION ANTI-OXYDATION SUR LA SURFACE, PÂTE DE CUIVRE FRITTÉE À BASSE TEMPÉRATURE ET PROCÉDÉ DE FRITTAGE L'UTILISANT
(ZH) 一种表面进行抗氧化保护的铜颗粒、低温烧结铜膏及使用其的烧结工艺
Abstract
(EN)
Copper particles (1,3) with anti-oxidation protection on a surface, low-temperature sintered copper paste, and a sintering process using the same, wherein the surface of the copper particles (1,3) is modified with an organic solderable protective agent, and the organic solderable protective agent is at least one of benzotriazole, imidazole, and benzimidazole.
(FR)
L'invention concerne des particules de cuivre (1,3) ayant une protection anti-oxydation sur une surface, une pâte de cuivre frittée à basse température, et un procédé de frittage l'utilisant, la surface des particules de cuivre (1,3) étant modifiée avec un agent protecteur soudable organique, et l'agent protecteur soudable organique étant au moins l'un parmi le benzotriazole, l'imidazole et le benzimidazole.
(ZH)
一种表面进行抗氧化保护的铜颗粒(1、3)、低温烧结铜膏及使用其的烧结工艺,其中,利用有机可焊接保护剂对铜颗粒(1、3)的表面进行修饰,该有机可焊接保护剂为苯并三氮唑、咪唑、苯并咪唑中的至少一种。
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