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1. WO2020231053 - ELECTRONIC DEVICE COMPRISING SENSOR MODULE

Publication Number WO/2020/231053
Publication Date 19.11.2020
International Application No. PCT/KR2020/005784
International Filing Date 29.04.2020
IPC
G06F 1/16 2006.01
GPHYSICS
06COMPUTING; CALCULATING OR COUNTING
FELECTRIC DIGITAL DATA PROCESSING
1Details not covered by groups G06F3/-G06F13/82
16Constructional details or arrangements
C09J 7/00 2006.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
7Adhesives in the form of films or foils
Applicants
  • 삼성전자 주식회사 SAMSUNG ELECTRONICS CO., LTD. [KR]/[KR]
Inventors
  • 황병선 HWANG, Byungseon
  • 이덕희 LEE, Deokhee
  • 이성규 LEE, Sunggyu
Agents
  • 권혁록 KWON, Hyuk-Rok
  • 이정순 LEE, Jeong-Soon
Priority Data
10-2019-005591413.05.2019KR
Publication Language Korean (KO)
Filing Language Korean (KO)
Designated States
Title
(EN) ELECTRONIC DEVICE COMPRISING SENSOR MODULE
(FR) DISPOSITIF ÉLECTRONIQUE COMPRENANT UN MODULE DE CAPTEUR
(KO) 센서 모듈을 포함하는 전자 장치
Abstract
(EN)
An electronic device is disclosed. The electronic device comprises a housing and a sensor module disposed in at least a portion of the housing. The sensor module comprises: a fingerprint recognition sensor; a protective layer covering the fingerprint recognition sensor; an adhesive member placed on the protective layer; and a ceramic layer placed on the adhesive member, wherein the edge of the ceramic layer, the edge of the adhesive member, and the edge of a part of the protective layer include machined surfaces. Other embodiments are also possible.
(FR)
L'invention concerne un dispositif électronique. Le dispositif électronique comprend un boîtier et un module de capteur disposé dans au moins une partie du boîtier. Le module de capteur comprend : un capteur de reconnaissance d'empreinte digitale ; une couche de protection recouvrant le capteur de reconnaissance d'empreinte digitale ; un élément adhésif placé sur la couche de protection ; et une couche de céramique placée sur l'élément adhésif, le bord de la couche de céramique, le bord de l'élément adhésif et le bord d'une partie de la couche de protection comprenant des surfaces usinées. D'autres modes de réalisation sont également possibles.
(KO)
전자 장치가 개시된다. 전자 장치는 하우징 및 하우징의 적어도 일부분에 배치된 센서 모듈에 있어서, 지문 인식 센서, 지문 인식 센서를 감싸는 보호층, 보호층 상에 배치되는 접착 부재, 접착 부재 상에 배치되는 세라믹층을 포함하는 센서 모듈을 포함하고, 세라믹층의 가장자리, 접착 부재의 가장자리, 및 보호층 일부의 가장자리는 가공면을 포함하는 것을 특징으로 한다. 다른 실시 예가 가능하다.
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