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1. WO2020230987 - ELECTRONIC DEVICE INCLUDING HEAT DISSIPATION STRUCTURE

Publication Number WO/2020/230987
Publication Date 19.11.2020
International Application No. PCT/KR2020/003002
International Filing Date 03.03.2020
IPC
G06F 1/20 2006.01
GPHYSICS
06COMPUTING; CALCULATING OR COUNTING
FELECTRIC DIGITAL DATA PROCESSING
1Details not covered by groups G06F3/-G06F13/82
16Constructional details or arrangements
20Cooling means
G06F 1/16 2006.01
GPHYSICS
06COMPUTING; CALCULATING OR COUNTING
FELECTRIC DIGITAL DATA PROCESSING
1Details not covered by groups G06F3/-G06F13/82
16Constructional details or arrangements
H05K 7/20 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7Constructional details common to different types of electric apparatus
20Modifications to facilitate cooling, ventilating, or heating
CPC
H01Q 1/002
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
QANTENNAS, i.e. RADIO AERIALS
1Details of, or arrangements associated with, antennas
002Protection against seismic waves, thermal radiation or other disturbances, e.g. nuclear explosion; Arrangements for improving the power handling capability of an antenna
H04M 1/0202
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
MTELEPHONIC COMMUNICATION
1Substation equipment, e.g. for use by subscribers; Analogous equipment at exchanges
02Constructional features of telephone sets
0202Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
H05K 5/0004
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
5Casings, cabinets or drawers for electric apparatus
0004comprising several parts forming a closed casing
H05K 5/0017
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
5Casings, cabinets or drawers for electric apparatus
0017with display or control units
H05K 7/20336
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7Constructional details common to different types of electric apparatus
20Modifications to facilitate cooling, ventilating, or heating
2029using a liquid coolant with phase change in electronic enclosures
20336Heat pipes, e.g. wicks or capillary pumps
H05K 7/20436
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7Constructional details common to different types of electric apparatus
20Modifications to facilitate cooling, ventilating, or heating
2039characterised by the heat transfer by conduction from the heat generating element to a dissipating body
20436Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
Applicants
  • SAMSUNG ELECTRONICS CO., LTD. [KR]/[KR]
Inventors
  • KIM, Yonghwa
  • SON, Dongil
  • LEE, Chihwei
Agents
  • LEE, Keon-Joo
  • KIM, Jeoung-Hoon
Priority Data
10-2019-005684915.05.2019KR
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) ELECTRONIC DEVICE INCLUDING HEAT DISSIPATION STRUCTURE
(FR) DISPOSITIF ÉLECTRONIQUE COMPRENANT UNE STRUCTURE DE DISSIPATION DE CHALEUR
Abstract
(EN)
An electronic device is provided. The electronic device includes a housing including a front plate, a rear plate facing away from the front plate, and a side structure surrounding a space between the front plate and the rear plate, a heat dissipation member accommodated inside the housing, at least one antenna module disposed adjacent to the side structure or at least partially accommodated in the side structure, the at least one antenna module being disposed to be inclined or perpendicular relative to the front plate or the rear plate, and a fixing member coupled to and at least partially surrounding the antenna module. The fixing member may include a first heat transfer portion at least partially surrounding a rear face of the antenna module, and a second heat transfer portion disposed in contact with the heat dissipation member.
(FR)
La présente invention concerne un dispositif électronique. Le dispositif électronique comprend un boîtier comprenant une plaque avant, une plaque arrière faisant face à la plaque avant, et une structure latérale entourant un espace entre la plaque avant et la plaque arrière, un élément de dissipation de chaleur logé à l'intérieur du boîtier, au moins un module d'antenne disposé de façon à être adjacent à la structure latérale ou au moins partiellement logé dans la structure latérale, le ou les modules d'antenne étant disposés de façon à être inclinés ou perpendiculaires par rapport à la plaque avant ou à la plaque arrière, et un élément de fixation couplé au module d'antenne et entourant au moins partiellement le module d'antenne. L'élément de fixation peut comprendre une première partie de transfert de chaleur entourant au moins partiellement une face arrière du module d'antenne, et une seconde partie de transfert de chaleur disposée de façon à être en contact avec l'élément de dissipation de chaleur.
Latest bibliographic data on file with the International Bureau