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1. WO2020228068 - WET ETCHING DEVICE

Publication Number WO/2020/228068
Publication Date 19.11.2020
International Application No. PCT/CN2019/089800
International Filing Date 03.06.2019
IPC
H01L 21/67 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
CPC
H01L 21/67017
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
67005Apparatus not specifically provided for elsewhere
67011Apparatus for manufacture or treatment
67017Apparatus for fluid treatment
H01L 21/6708
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
67005Apparatus not specifically provided for elsewhere
67011Apparatus for manufacture or treatment
67017Apparatus for fluid treatment
67063for etching
67075for wet etching
6708using mainly spraying means, e.g. nozzles
Applicants
  • 武汉华星光电半导体显示技术有限公司 WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. [CN]/[CN]
Inventors
  • 陈建锋 CHEN, Jianfeng
Agents
  • 深圳翼盛智成知识产权事务所(普通合伙) ESSEN PATENT&TRADEMARK AGENCY
Priority Data
201910406084.116.05.2019CN
Publication Language Chinese (ZH)
Filing Language Chinese (ZH)
Designated States
Title
(EN) WET ETCHING DEVICE
(FR) DISPOSITIF DE GRAVURE HUMIDE
(ZH) 湿法刻蚀设备
Abstract
(EN)
A wet etching device (10), comprising an etching chamber (1), at least one shutter (2), and at least one spray pipe (3). The etching chamber (1) is used for accommodating and etching a substrate (20), has an inlet at the front end, and has an outlet at the rear end. The shutter (2) is mounted on the inlet or the outlet by means of a rotating shaft (4). The spray pipe (3) is disposed on the rotating shaft (4). The spray pipe (3) and the shutter (2) are overturned simultaneously. When the shutter (2) is closed, the spray pipe (3) is located above a substrate (20) traveling passage. The spray pipe (3) can spray liquid all around to clean etchant crystals formed at the inlet or the outlet. Spraying is performed at the inlet and the outlet of the etching chamber (1) by means of the spray pipe (3), so that a large number of etchant crystals generated at the inlet and the outlet of the etching chamber (1) are removed effectively, and the utilization rate, cleaning degree and product quality are improved.
(FR)
La présente invention concerne un dispositif de gravure humide (10), comprenant une chambre de gravure (1), au moins un obturateur (2), et au moins un tuyau de pulvérisation (3). La chambre de gravure (1) est utilisée pour recevoir et graver un substrat (20), a une entrée à l'extrémité avant, et a une sortie à l'extrémité arrière. L'obturateur (2) est monté sur l'entrée ou la sortie au moyen d'un arbre rotatif (4). Le tuyau de pulvérisation (3) est disposé sur l'arbre rotatif (4). Le tuyau de pulvérisation (3) et l'obturateur (2) sont retournés simultanément. Lorsque l'obturateur (2) est fermé, le tuyau de pulvérisation (3) est situé au-dessus d'un passage de déplacement de substrat (20). Le tuyau de pulvérisation (3) peut pulvériser du liquide tout autour pour nettoyer des cristaux d'agent de gravure formés au niveau de l'entrée ou de la sortie. La pulvérisation est effectuée au niveau de l'entrée et de la sortie de la chambre de gravure (1) au moyen du tuyau de pulvérisation (3), de telle sorte qu'un grand nombre de cristaux d'agent de gravure générés au niveau de l'entrée et de la sortie de la chambre de gravure (1) sont éliminés efficacement, et le taux d'utilisation, le degré de nettoyage et la qualité du produit sont améliorés.
(ZH)
一种湿法刻蚀设备(10)包括刻蚀腔(1)、至少一遮蔽门(2)和至少一喷淋管(3)。所述刻蚀腔(1)用于容纳并刻蚀基片(20),在其前端具有入口,在其后端具有出口;所述遮蔽门(2)通过一转轴(4)安装于所述入口或出口;所述喷淋管(3)设置于所述转轴(4)上,所述喷淋管(3)与所述遮蔽门(2)同时翻转,当所述遮蔽门(2)关闭时,所述喷淋管(3)位于所述基片(20)行进通道的上方;所述喷淋管(3)能够朝四周喷射液体,以清洗在所述入口或出口处形成的刻蚀液结晶。通过喷淋管(3)对刻蚀腔(1)入口、刻蚀腔(1)出口处进行喷淋,可有效去除在刻蚀腔(1)入口、刻蚀腔(1)出口处产生的大量刻蚀液结晶,提高设备稼动率,洁净度及产品质量。
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