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1. WO2020224088 - ARRAY SUBSTRATE AND PREPARATION METHOD THEREFOR

Publication Number WO/2020/224088
Publication Date 12.11.2020
International Application No. PCT/CN2019/101615
International Filing Date 20.08.2019
IPC
H01L 51/52 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
52Details of devices
H01L 27/32 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
28including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
32with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes
H01L 21/77 2017.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
70Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in or on a common substrate or of specific parts thereof; Manufacture of integrated circuit devices or of specific parts thereof
77Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
CPC
H01L 2227/323
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2227Indexing scheme for devices consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate covered by group H01L27/00
32Devices including an organic light emitting device [OLED], e.g. OLED display
323Multistep processes for AMOLED
H01L 27/3246
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
28including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
32with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes [OLED]
3241Matrix-type displays
3244Active matrix displays
3246Pixel defining structures, e.g. banks
H01L 27/3258
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
28including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
32with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes [OLED]
3241Matrix-type displays
3244Active matrix displays
3258Insulating layers formed between TFT elements and OLED elements
H01L 51/5271
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50specially adapted for light emission, e.g. organic light emitting diodes [OLED] or polymer light emitting devices [PLED]
52Details of devices
5262Arrangements for extracting light from the device
5271Reflective means
Applicants
  • 武汉华星光电半导体显示技术有限公司 WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. [CN]/[CN]
Inventors
  • 王雷 WANG, Lei
Agents
  • 深圳翼盛智成知识产权事务所(普通合伙) ESSEN PATENT&TRADEMARK AGENCY
Priority Data
201910376302.107.05.2019CN
Publication Language Chinese (ZH)
Filing Language Chinese (ZH)
Designated States
Title
(EN) ARRAY SUBSTRATE AND PREPARATION METHOD THEREFOR
(FR) SUBSTRAT DE RÉSEAU ET SON PROCÉDÉ DE PRÉPARATION
(ZH) 阵列基板及其制作方法
Abstract
(EN)
An array substrate, comprising: a substrate; a first flat layer, provided on the substrate; a second flat layer, provided on the substrate, a partitioning groove being formed between the first flat layer and the second flat layer to expose the substrate; a first electrode layer, provided on the first flat layer; a reflection layer, provided on the second flat layer and shielding a side surface of the second flat layer; and a pixel defining layer, provided on the partitioning groove and covering a part of the first flat layer and a part of the second flat layer. By providing the reflection layer, the light giving-out quantity is improved, and edge light leakage is prevented. Also provided is a preparation method for the array substrate.
(FR)
La présente invention concerne un substrat de réseau, comprenant : un substrat ; une première couche plate, disposée sur le substrat ; une seconde couche plate, disposée sur le substrat, une rainure de séparation étant formée entre la première couche plate et la seconde couche plate pour exposer le substrat ; une première couche d'électrode, disposée sur la première couche plate ; une couche de réflexion, disposée sur la seconde couche plate et protégeant une surface latérale de la seconde couche plate ; et une couche de définition de pixel, disposée sur la rainure de séparation et recouvrant une partie de la première couche plate et une partie de la seconde couche plate. En fournissant la couche de réflexion, la quantité de sortie de lumière est améliorée, et une fuite de lumière de bord est empêchée. L'invention concerne également un procédé de préparation pour le substrat de réseau.
(ZH)
一种阵列基板,包括:一衬底基板;一第一平坦层,设置于所述衬底基板上;一第二平坦层,设置于所述衬底基板上,并且所述第一平坦层与所述第二平坦层之间形成有隔断槽以暴露出所述衬底基板;一第一电极层,设置于所述第一平坦层上;一反射层,设置于所述第二平坦层上并遮蔽所述第二平坦层的侧面;以及一像素定义层,设置于所述隔断槽上并覆盖在部分的所述第一平坦层与部分的所述第二平坦层上。通过设置反射层提高出光量并且防止边缘漏光。还提供一种阵列基板的制作方法。
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