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1. WO2020223018 - SURFACE MOUNT PASSIVE COMPONENT SHORTED TOGETHER AND A DIE

Publication Number WO/2020/223018
Publication Date 05.11.2020
International Application No. PCT/US2020/028253
International Filing Date 15.04.2020
IPC
H05K 1/02 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
CPC
H01L 21/4882
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
48Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
4814Conductive parts
4871Bases, plates or heatsinks
4882Assembly of heatsink parts
H01L 21/52
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, ; e.g. sealing of a cap to a base of a container
52Mounting semiconductor bodies in containers
H01L 23/345
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
345Arrangements for heating
H01L 23/367
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
367Cooling facilitated by shape of device
H01L 23/5286
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
52Arrangements for conducting electric current within the device in operation from one component to another ; , i.e. interconnections, e.g. wires, lead frames
522including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
528Geometry or; layout of the interconnection structure
5286Arrangements of power or ground buses
H01L 23/64
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
58Structural electrical arrangements for semiconductor devices not otherwise provided for ; , e.g. in combination with batteries
64Impedance arrangements
Applicants
  • QUALCOMM INCORPORATED [US]/[US]
Inventors
  • LIU, Yu-Chun
  • DAVULIS, Peter Mark
Agents
  • GALLARDO, Michelle
Priority Data
16/794,36019.02.2020US
62/839,87929.04.2019US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) SURFACE MOUNT PASSIVE COMPONENT SHORTED TOGETHER AND A DIE
(FR) COMPOSANT PASSIF À MONTAGE EN SURFACE COURT-CIRCUITÉ ET PUCE
Abstract
(EN)
A device that includes a substrate (640) including a plurality of metal layers (618), and a plurality of dielectric layers (652). The device further includes a first passive component (602) including a first terminal (604), a second terminal (606), and a first body (608), mounted to the substrate on one of the plurality of metal layers (620). The first terminal (604) is coupled to a first ground signal and the second terminal (606) is coupled to a second ground signal such that the first passive component (602) is shorted. The first passive component may be an inductor, a capacitor or a resistor. The first passive component is operable as a heat sink, a heat shield, an electromagnetic shield, or as a tuning inductor.
(FR)
L'invention concerne un dispositif qui comprend un substrat (640) comprenant une pluralité de couches métalliques (618), et une pluralité de couches diélectriques (652). Le dispositif comprend en outre un premier composant passif (602) comprenant une première borne (604), une seconde borne (606), et un premier corps (608), monté sur le substrat sur l'une de la pluralité de couches métalliques (620). La première borne (604) est couplée à un premier signal de masse et la seconde borne (606) est couplée à un second signal de masse de sorte que le premier composant passif (602) soit court-circuité. Le premier composant passif peut être un inducteur, un condensateur ou une résistance. Le premier composant passif peut fonctionner comme un dissipateur thermique, un écran thermique, un blindage électromagnétique, ou en tant qu'inducteur d'accord.
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